JPH0215587A - Manufacture of circuit substrate equipped with terminal - Google Patents
Manufacture of circuit substrate equipped with terminalInfo
- Publication number
- JPH0215587A JPH0215587A JP63162421A JP16242188A JPH0215587A JP H0215587 A JPH0215587 A JP H0215587A JP 63162421 A JP63162421 A JP 63162421A JP 16242188 A JP16242188 A JP 16242188A JP H0215587 A JPH0215587 A JP H0215587A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- circuit
- circuit board
- substrate
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims description 8
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 239000011347 resin Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 19
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 238000005476 soldering Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、端子付き回路基板の製造方法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a circuit board with terminals.
例えば、電子部品を実装した親回路基板に、同じく電子
部品を実装した子回路基板を搭載する場合には、子回路
基板の縁部に端子を半田付けし、その端子の先端を親回
路基板に挿入して半田付けするという方法がとられる。For example, when mounting a child circuit board with electronic components mounted on a parent circuit board with electronic components, solder a terminal to the edge of the child circuit board and attach the tip of the terminal to the parent circuit board. The method used is to insert and solder.
この方法を図−２ないし図−５ににより説明する。図−
２および図−３は親回路基板１１に子回路基板１２を平
行に搭載する場合、図−４および図＝５は親回路基板１
１に子回路基板１２を垂直に搭載する場合である。いず
れの場合も、子回路基板１２の縁部に端子１３を装着し
、この端子１３を半田付けにより子回路基板１２に固定
した上で、端子１３を親回路基板１１に接続するもので
ある。１４が子回路基板１２と端子１３との半田付は部
である。子回路基板１２は例えばセラミックス基板１５
に高温焼成タイプの導電ペーストで回路パターン１６を
形成し、さらにソルダーレジスト１７を印刷してなるも
のである。This method will be explained with reference to FIGS. 2 to 5. Figure-
2 and 3 are for the case where the child circuit board 12 is mounted on the parent circuit board 11 in parallel, and FIGS. 4 and 5 are for the parent circuit board 1.
This is a case where the child circuit board 12 is mounted vertically on the board 1. In either case, the terminals 13 are attached to the edges of the child circuit board 12, the terminals 13 are fixed to the child circuit board 12 by soldering, and then the terminals 13 are connected to the parent circuit board 11. Reference numeral 14 indicates soldering between the child circuit board 12 and the terminals 13. The child circuit board 12 is, for example, a ceramic board 15.
A circuit pattern 16 is formed using a high-temperature firing type conductive paste, and a solder resist 17 is further printed.
端子１３の基部は、子回路基板１２の縁部に形成された
回路パターン１６のバッド部１６ａを挟み付ける構造と
なっている。The base of the terminal 13 has a structure in which the pad portion 16a of the circuit pattern 16 formed on the edge of the child circuit board 12 is sandwiched.
また端子１３の先端部は親回路基板１１に挿入され、通
常の挿入実装手段により、親回路基板１１に接続固定さ
れる。なお１８は親回路基板１１および子回路基板１２
に実装された電子部品である。Further, the tip end of the terminal 13 is inserted into the parent circuit board 11, and is connected and fixed to the parent circuit board 11 by ordinary insertion mounting means. Note that 18 is a parent circuit board 11 and a child circuit board 12.
It is an electronic component mounted on.
しかし上記のような構成では、子回路基板と端子は半田
付けにより接合されているだけであるため、両者の接合
強度を大きくすることが難しく、子回路基板の大きさが
半田付は部の強度によって制約を受けるという欠点があ
る。また子回路基板の形状は平板状であるため、親回路
基板の実装部品の大きさのバラツキにより生じる空間を
有効に使うことができないという難点もある。However, in the above configuration, since the slave circuit board and the terminal are only joined by soldering, it is difficult to increase the bonding strength between the two, and the size of the slave circuit board does not affect the strength of the soldered part. The disadvantage is that it is restricted by Furthermore, since the child circuit board has a flat shape, there is also the problem that the space created by the variation in the size of the components mounted on the parent circuit board cannot be used effectively.
本発明は、上記のような課題を解決できる端子付き回路
基板の製造方法を提供するもので、その構成は、回路フ
ィルムの縁部に端子を取り付けて半田付けしたものを、
モールド成形用の金型内にセットし、樹脂をモールド成
形して、上記回路フィルムの片面に樹脂基板を形成する
と共に、上記端子の回路フィルム取付は部を樹脂基板内
に埋め込むことを特徴とするものである。The present invention provides a method for manufacturing a circuit board with terminals that can solve the above-mentioned problems, and the structure is such that terminals are attached and soldered to the edges of a circuit film.
The circuit film is set in a mold for molding, and a resin is molded to form a resin substrate on one side of the circuit film, and the circuit film mounting portion of the terminal is embedded in the resin substrate. It is something.
回路フィルムは、絶縁フィルムの片面または両面に回路
パターンを形成したもの又はそれらを積層したもので、
薄く、可撓性のあるものである。Circuit film is an insulating film with a circuit pattern formed on one or both sides, or a lamination of these.
It is thin and flexible.
この回路フィルムの片面に樹脂基板をモールド成形する
ことにより回路基板を形成し、その樹脂基板内に端子の
回路フィルム取付は部を埋め込むようにすれば、回路フ
ィルムと端子との半田付は部が樹脂基板で補強されるた
め、両者の接合強度が大きくなる。また回路フィルムは
可撓性があり、樹脂基板はモールド成形体であるため、
回路基板の形状を任意に選ぶことができ、空間の有効利
用が可能となる。If a circuit board is formed by molding a resin board on one side of the circuit film, and the part of the circuit film for the terminal is embedded in the resin board, the soldering part of the circuit film and the terminal will be easy. Since it is reinforced by the resin substrate, the bonding strength between the two is increased. In addition, since the circuit film is flexible and the resin substrate is a molded product,
The shape of the circuit board can be arbitrarily selected, allowing effective use of space.
以下、本発明の一実施例を図−１を参照して詳細に説明
する。Hereinafter, one embodiment of the present invention will be described in detail with reference to FIG.
図において、２１は回路フィルムで、絶縁フィルム２２
の両面に回路パターン２３を形成し、さらにソルダーレ
ジスト２４を印刷してなるものである。絶縁フィルム２
２としてはポリイミド、ポリエチレンテレフタレート、
ポリエーテルイミド等のフィルムや、厚さ１５０μｍ以
下のガラス・エポキシシート等が使用される。また回路
パターン２３は銅箔やアルミ箔のエツチングあるいは導
電ペーストの印刷等により形成される０回路フィルム２
１の縁部には回路パターン２３のパッド部２３ａを露出
させである。In the figure, 21 is a circuit film, and an insulating film 22
A circuit pattern 23 is formed on both sides of the board, and a solder resist 24 is further printed. Insulating film 2
2 is polyimide, polyethylene terephthalate,
A film such as polyetherimide or a glass epoxy sheet with a thickness of 150 μm or less is used. In addition, the circuit pattern 23 is formed by etching copper foil or aluminum foil, or printing conductive paste on the zero circuit film 2.
The pad portion 23a of the circuit pattern 23 is exposed at the edge of the circuit pattern 23.
このような回路フィルム２１の縁部に端子１３を装着し
、この両者を半田付けにより一体化する。１４がその半
田付は部である。端子１３は従来同様、回路フィルム２
１の縁部を挟み付ける構造のものである。The terminal 13 is attached to the edge of such a circuit film 21, and the two are integrated by soldering. 14 is the soldering part. The terminal 13 is connected to the circuit film 2 as before.
It has a structure in which the edges of 1 are sandwiched.
以上のようにして端子１３付きの回路フィルム２１を得
た後、これをモールド成形用の金型（図示せず）内にセ
ットし、樹脂をモールド成形して、回路フィルム２１の
片面に樹脂基板２５を一体に形成することにより回路基
板２６を得るのであるが、このとき端子１３の回路フィ
ルム取付は部を樹脂基板２５内に埋め込むようにする。After obtaining the circuit film 21 with the terminals 13 as described above, this is set in a molding die (not shown), and resin is molded to form a resin substrate on one side of the circuit film 21. By integrally forming the terminals 25, a circuit board 26 is obtained. At this time, the circuit film of the terminal 13 is attached by embedding the portion within the resin board 25.
このようにすれば、端子２１は回路フィルム２１に半田
付けにより固定されると共に、樹脂基板２５に埋め込ま
れる形となるため、回路基板２６との接合強度がきわめ
て大きくなる。したがって端子１３により支持される回
路基板２６を大型化しても接合部が破損するおそれは少
なくなる。また回路フィルム２１は可撓性があるため金
型の壁面にそって屈曲配置することができ、樹脂基板２
５も任意の形状にできるから、回路基板２６は、それが
設置される周囲の状況に応じて、その形状を自由に選べ
ることになる。特に−枚の回路フィルムに複数に分割さ
れた樹脂基板をモールド成形し、それらの樹脂基板を組
み合わせるようにすれば、部品実装は平面で行い、部品
実装後に組み立てて立体形状にすることも可能である。In this way, the terminals 21 are fixed to the circuit film 21 by soldering and are embedded in the resin board 25, so that the bonding strength with the circuit board 26 becomes extremely high. Therefore, even if the circuit board 26 supported by the terminals 13 is increased in size, there is less risk of damage to the joint. In addition, since the circuit film 21 is flexible, it can be bent and arranged along the wall surface of the mold, and the resin substrate 21
Since the circuit board 5 can also have any shape, the shape of the circuit board 26 can be freely selected depending on the surrounding situation in which it is installed. In particular, if you mold a resin board divided into multiple pieces onto a sheet of circuit film and then combine those resin boards, it is possible to mount components on a flat surface and then assemble them into a three-dimensional shape after mounting the components. be.
以上説明したように本発明によれば、回路フィルムに半
田付けにより固定された端子が、さらに樹脂基板に埋め
込み固定されるので、回路基板と端子との接合強度を大
きくすることができ、このため端子により支持される回
路基板を大型化することができる。また回路基板は、そ
の形状を自由に選定できるため、スペースの有効活用が
できるという利点もある。As explained above, according to the present invention, the terminals fixed to the circuit film by soldering are further embedded and fixed in the resin board, so that the bonding strength between the circuit board and the terminals can be increased. The circuit board supported by the terminals can be increased in size. Further, since the shape of the circuit board can be freely selected, there is also the advantage that space can be used effectively.
図−１は本発明の一実施例により製造された端子付き回
路基板を示す断面図、図−２は従来の端子付き回路基板
の説明図、図−３はその要部の断面図、図−４は従来の
端子付き回路基板の他の例を示す説明図、図−５はその
要部の断面図である。
１３：端子、１４：半田付は部、２１：回路フィルム、
２５：樹脂基板、２６：回路基板。
図−２
図−１
図−４Figure 1 is a sectional view showing a circuit board with terminals manufactured according to an embodiment of the present invention, Figure 2 is an explanatory diagram of a conventional circuit board with terminals, and Figure 3 is a sectional view of its main parts. 4 is an explanatory diagram showing another example of a conventional circuit board with a terminal, and FIG. 5 is a sectional view of the main part thereof. 13: Terminal, 14: Soldering part, 21: Circuit film,
25: Resin board, 26: Circuit board. Figure-2 Figure-1 Figure-4
Claims (1)
たものを、モールド成形用の金型内にセットし、樹脂を
モールド成形して、上記回路フィルムの片面に樹脂基板
を形成すると共に、上記端子の回路フィルム取付け部を
樹脂基板内に埋め込むことを特徴とする端子付き回路基
板の製造方法。1. Attach terminals to the edges of the circuit film and solder them, set in a mold for molding, mold resin to form a resin substrate on one side of the circuit film, and A method for manufacturing a circuit board with a terminal, characterized by embedding a circuit film attachment part of the terminal in a resin board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63162421A JPH0215587A (en) | 1988-07-01 | 1988-07-01 | Manufacture of circuit substrate equipped with terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63162421A JPH0215587A (en) | 1988-07-01 | 1988-07-01 | Manufacture of circuit substrate equipped with terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0215587A true JPH0215587A (en) | 1990-01-19 |
Family
ID=15754281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63162421A Pending JPH0215587A (en) | 1988-07-01 | 1988-07-01 | Manufacture of circuit substrate equipped with terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215587A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019042610A (en) * | 2017-08-29 | 2019-03-22 | 株式会社レクシー | High-pressure type discharge device |
-
1988
- 1988-07-01 JP JP63162421A patent/JPH0215587A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019042610A (en) * | 2017-08-29 | 2019-03-22 | 株式会社レクシー | High-pressure type discharge device |
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