JPH02146429U - - Google Patents
Info
- Publication number
- JPH02146429U JPH02146429U JP5666089U JP5666089U JPH02146429U JP H02146429 U JPH02146429 U JP H02146429U JP 5666089 U JP5666089 U JP 5666089U JP 5666089 U JP5666089 U JP 5666089U JP H02146429 U JPH02146429 U JP H02146429U
- Authority
- JP
- Japan
- Prior art keywords
- rotating shaft
- solution
- solution supply
- spray nozzle
- supply pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007921 spray Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 claims 3
- 238000004528 spin coating Methods 0.000 claims 1
Landscapes
- Coating Apparatus (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
図面は本考案の実施例を示し、第1図は縦断正
面図、第2図は第1図の−視断面図である。
1……回転軸、1a……軸線、2……カバー槽
、3……溶液供給管、4……ウエハ、5……ウエ
ハホルダー、6……溶液供給通路、7……スプレ
ーノズル。
The drawings show an embodiment of the present invention, with FIG. 1 being a longitudinal sectional front view and FIG. 2 being a sectional view taken from the side of FIG. 1. DESCRIPTION OF SYMBOLS 1... Rotating shaft, 1a... Axis line, 2... Cover tank, 3... Solution supply pipe, 4... Wafer, 5... Wafer holder, 6... Solution supply passage, 7... Spray nozzle.
Claims (1)
回転軸の上方に配設した溶液滴下用の溶液供給管
とから成り、前記回転軸を、その内部に溶液供給
通路を備えた中空軸にして、該回転軸の上端に、
溶液を上向きに吹き出すようにしたスプレーノズ
ルを設ける一方、前記回転軸には前記スプレーノ
ズルと前記溶液供給管との間の部位に配設したウ
エハを、回転軸に対して支持するためのウエハホ
ルダーを取付けたことを特徴とするウエハにおけ
るスピンコート装置。 It consists of a rotating shaft that rotates around a vertical axis, and a solution supply pipe for dropping a solution disposed above the rotating shaft, and the rotating shaft is a hollow shaft with a solution supply passage inside. At the upper end of the rotating shaft,
A spray nozzle that blows out a solution upward is provided, and a wafer holder is provided on the rotating shaft to support a wafer disposed between the spray nozzle and the solution supply pipe with respect to the rotating shaft. A spin coating device for wafers, characterized in that it is equipped with a.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5666089U JPH02146429U (en) | 1989-05-16 | 1989-05-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5666089U JPH02146429U (en) | 1989-05-16 | 1989-05-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02146429U true JPH02146429U (en) | 1990-12-12 |
Family
ID=31580680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5666089U Pending JPH02146429U (en) | 1989-05-16 | 1989-05-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02146429U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002143750A (en) * | 2000-11-13 | 2002-05-21 | Honda Lock Mfg Co Ltd | Device and method for coating mirror for vehicle |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58100425A (en) * | 1981-12-11 | 1983-06-15 | Hitachi Ltd | Apparatus for uniformly applying resist film on wafer surfaces |
JPS63240967A (en) * | 1988-03-03 | 1988-10-06 | Toray Ind Inc | Spin-coating device |
-
1989
- 1989-05-16 JP JP5666089U patent/JPH02146429U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58100425A (en) * | 1981-12-11 | 1983-06-15 | Hitachi Ltd | Apparatus for uniformly applying resist film on wafer surfaces |
JPS63240967A (en) * | 1988-03-03 | 1988-10-06 | Toray Ind Inc | Spin-coating device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002143750A (en) * | 2000-11-13 | 2002-05-21 | Honda Lock Mfg Co Ltd | Device and method for coating mirror for vehicle |