JPH0213740U - - Google Patents
Info
- Publication number
- JPH0213740U JPH0213740U JP9285488U JP9285488U JPH0213740U JP H0213740 U JPH0213740 U JP H0213740U JP 9285488 U JP9285488 U JP 9285488U JP 9285488 U JP9285488 U JP 9285488U JP H0213740 U JPH0213740 U JP H0213740U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- insulator
- package
- component package
- package according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図ａ及びｂは本考案の第１の実施例の電子
部品のパツケージの構成を示す正面図及び底面図
、第２図ａ，ｂ及びｃは本考案のパツケージを備
えた電子部品としての圧電振動子の具体的構成説
明図、第３図ａ，ｂ及びｃは製造手順の説明図、
第４図ａ及びｂは本考案の第２の実施例の構成を
示す正面図及び平面図、第５図はその製造手順の
説明図である。
１…電子部品、２…パツケージ、３…リード、
４…絶縁物、５…溝、１０…ベース、１１…キヤ
ツプ、１２…サポータ、１６…挿通孔、２０…型
。
Figures 1a and b are front and bottom views showing the configuration of an electronic component package according to the first embodiment of the present invention, and Figures 2a, b, and c are views of an electronic component equipped with the package of the present invention. A diagram illustrating the specific configuration of the piezoelectric vibrator, Figures 3a, b, and c are diagrams explanatory of the manufacturing procedure;
4a and 4b are a front view and a plan view showing the structure of a second embodiment of the present invention, and FIG. 5 is an explanatory view of the manufacturing procedure thereof. 1...Electronic component, 2...Package, 3...Lead,
4... Insulator, 5... Groove, 10... Base, 11... Cap, 12... Supporter, 16... Insertion hole, 20... Model.
Claims (1)
品のパツケージにおいて、パツケージの底面の金
属部分に絶縁物を一体成型したことを特徴とする
電子部品のパツケージ。 (2) 前記絶縁物は前記パツケージ底面から伸び
たリード外周を被覆することを特徴とする請求項
第１項の電子部品のパツケージ。 (3) 前記絶縁物は前記パツケージ底面を覆うよ
うに一体化されていることを特徴とする請求項第
１項の電子部品のパツケージ。 (4) 前記絶縁物の底面にはハンダからのガスを
抜くための溝が形成されていることを特徴とする
請求項第１乃至第３項記載の電子部品のパツケー
ジ。[Claims for Utility Model Registration] (1) An electronic component package whose bottom surface is partially or entirely made of metal, characterized in that an insulator is integrally molded on the metal portion of the bottom surface of the package. . (2) The electronic component package according to claim 1, wherein the insulator covers the outer periphery of the leads extending from the bottom surface of the package. (3) The electronic component package according to claim 1, wherein the insulator is integrated so as to cover the bottom surface of the package. (4) The electronic component package according to any one of claims 1 to 3, wherein a groove is formed on the bottom surface of the insulator to release gas from the solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9285488U JPH0213740U (en) | 1988-07-12 | 1988-07-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9285488U JPH0213740U (en) | 1988-07-12 | 1988-07-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0213740U true JPH0213740U (en) | 1990-01-29 |
Family
ID=31317302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9285488U Pending JPH0213740U (en) | 1988-07-12 | 1988-07-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0213740U (en) |
-
1988
- 1988-07-12 JP JP9285488U patent/JPH0213740U/ja active Pending