JPH02132951U - - Google Patents
Info
- Publication number
- JPH02132951U JPH02132951U JP4284389U JP4284389U JPH02132951U JP H02132951 U JPH02132951 U JP H02132951U JP 4284389 U JP4284389 U JP 4284389U JP 4284389 U JP4284389 U JP 4284389U JP H02132951 U JPH02132951 U JP H02132951U
- Authority
- JP
- Japan
- Prior art keywords
- insulating
- package
- external lead
- glass
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 2
- 239000013078 crystal Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の半導体素子収納用パツケージ
の一実施例を示す平面図、第２図は第１図に示す
パツケージの断面図、第３図は第１図に示すパツ
ケージの外部リード端子先端部分を示す部分拡大
平面図である。
１……絶縁基体、２……絶縁枠体、４……外部
リード端子、５……ガラス。
Fig. 1 is a plan view showing an embodiment of the package for housing semiconductor elements of the present invention, Fig. 2 is a sectional view of the package shown in Fig. 1, and Fig. 3 is the tip of the external lead terminal of the package shown in Fig. 1. It is a partially enlarged plan view showing a part. 1... Insulating base, 2... Insulating frame, 4... External lead terminal, 5... Glass.
Claims (1)
の間に多数の外部リード端子を挟んでガラス付け
して成る半導体素子収納用パツケージにおいて、
前記外部リード端子の少なくとも先端周囲にある
ガラスに電気絶縁性の結晶粉末を含有させたこと
を特徴とする半導体素子収納用パツケージ。 In a package for storing semiconductor elements, which is made of an insulating base and an insulating frame or an insulating lid, which are glass-attached with a large number of external lead terminals sandwiched between them,
A package for housing a semiconductor element, characterized in that the glass around at least the tip of the external lead terminal contains electrically insulating crystal powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989042843U JP2508067Y2 (en) | 1989-04-12 | 1989-04-12 | Package for storing semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989042843U JP2508067Y2 (en) | 1989-04-12 | 1989-04-12 | Package for storing semiconductor devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02132951U true JPH02132951U (en) | 1990-11-05 |
| JP2508067Y2 JP2508067Y2 (en) | 1996-08-21 |
Family
ID=31554740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989042843U Expired - Lifetime JP2508067Y2 (en) | 1989-04-12 | 1989-04-12 | Package for storing semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2508067Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5874057A (en) * | 1981-10-29 | 1983-05-04 | Nec Corp | Glass sealed semiconductor device |
-
1989
- 1989-04-12 JP JP1989042843U patent/JP2508067Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5874057A (en) * | 1981-10-29 | 1983-05-04 | Nec Corp | Glass sealed semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2508067Y2 (en) | 1996-08-21 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |