JPH02125343U - - Google Patents
Info
- Publication number
- JPH02125343U JPH02125343U JP3382289U JP3382289U JPH02125343U JP H02125343 U JPH02125343 U JP H02125343U JP 3382289 U JP3382289 U JP 3382289U JP 3382289 U JP3382289 U JP 3382289U JP H02125343 U JPH02125343 U JP H02125343U
- Authority
- JP
- Japan
- Prior art keywords
- substance
- coated
- utility
- integrated circuit
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図、第２図はそれぞれ本考案の実施例のＩ
Ｃの縦断面図である。 １……リードフレーム、２……半導体チツプ、
３……パツケージ樹脂、４……帯電防止剤（液体
）、５……帯電防止樹脂。
Ｃの縦断面図である。 １……リードフレーム、２……半導体チツプ、
３……パツケージ樹脂、４……帯電防止剤（液体
）、５……帯電防止樹脂。
Claims (1)
- 半導体集積回路装置において、パツケージ表面
を帯電防止効果のある物質でコーテイングする事
を特徴とする半導体集積回路装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3382289U JPH02125343U (ja) | 1989-03-24 | 1989-03-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3382289U JPH02125343U (ja) | 1989-03-24 | 1989-03-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02125343U true JPH02125343U (ja) | 1990-10-16 |
Family
ID=31537775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3382289U Pending JPH02125343U (ja) | 1989-03-24 | 1989-03-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02125343U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010003296A (ja) * | 2008-05-23 | 2010-01-07 | Semiconductor Energy Lab Co Ltd | 半導体装置及び半導体装置の作製方法 |
-
1989
- 1989-03-24 JP JP3382289U patent/JPH02125343U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010003296A (ja) * | 2008-05-23 | 2010-01-07 | Semiconductor Energy Lab Co Ltd | 半導体装置及び半導体装置の作製方法 |