JPH0211377U - - Google Patents
Info
- Publication number
- JPH0211377U JPH0211377U JP8917188U JP8917188U JPH0211377U JP H0211377 U JPH0211377 U JP H0211377U JP 8917188 U JP8917188 U JP 8917188U JP 8917188 U JP8917188 U JP 8917188U JP H0211377 U JPH0211377 U JP H0211377U
- Authority
- JP
- Japan
- Prior art keywords
- mini
- wiring board
- molded components
- board
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8917188U JPH0211377U (zh) | 1988-07-05 | 1988-07-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8917188U JPH0211377U (zh) | 1988-07-05 | 1988-07-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0211377U true JPH0211377U (zh) | 1990-01-24 |
Family
ID=31313721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8917188U Pending JPH0211377U (zh) | 1988-07-05 | 1988-07-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0211377U (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05178454A (ja) * | 1991-06-04 | 1993-07-20 | Yukio Ishida | 整列移送装置 |
-
1988
- 1988-07-05 JP JP8917188U patent/JPH0211377U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05178454A (ja) * | 1991-06-04 | 1993-07-20 | Yukio Ishida | 整列移送装置 |