JPH02112998A - Manufacture of ic card - Google Patents

Abstract

PURPOSE:To enhance massproductivity and to enhance reliability by forming front and rear oversheets, two layers or more of core material therebetween, providing a mold release resin between the layers of the core material, and burying to secure an IC module in a recess cut until arriving at the resin by cutting means. CONSTITUTION:Oversheet materials 1a, 1b of front and rear layers and core materials 2a, 2b, 2c are provided as three layers, silicone resin 13 is interposed as mold release resin to be held on the whole periphery of the edge of a recess to be formed between the layers of the materials 2b and 2c as a noncoupling layer. The resin 13 is formed by printing on the material 2b, and adhesive strength to the material 2c is substantially not provided. In order to form a recess on a card base material, a linear groove 14 is formed along the edge of the recess by an end mill as cutting means. Its depth may, for example, be arrived at the noncoupling layer or the material 2c. Then, the noncoupling part 15 formed from the result of the formation of the groove 14 is mechanically removed, and a recess 16 is formed. Further, an IC module 17 is buried fixedly with an adhesive 18 in the bottom of the recess 16.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing an IC card in which an IC module is embedded in a card base material.

Prior Art Conventional techniques are shown in FIGS. 7, 8, and 9. FIG. 7 is a cross-sectional view of the card base material, and FIG. 8 is a cross-sectional view of the card base material in which a recess is formed with an end mill or the like to embed the IC module.
FIG. 9 is a sectional view of a main part of an IC card in which an IC module is embedded and fixed in a recessed portion with an adhesive.

According to the conventional example, as shown in FIG. 7, the center core material 2 is laminated with one oversea layer (1a, 1b) on each side of the front and back sides, and then the IC module 4 is buried as shown in FIG. A recess 3 was formed using an end mill or the like, and an IC module 4 was embedded and fixed in the recess 3 with an adhesive 5, as shown in FIG.

Problems to be Solved by the Invention As mentioned above, in the conventional example, the entire bottom part 3& of the recess 3 in which the IC module 4 is buried is cut with an end mill or the like, but it is difficult to obtain precision in the depth of the recess 3, and the machining process is difficult. It was also difficult to set processing conditions to obtain a favorable surface flatness, which was a major issue in mass production.

Furthermore, as shown in Figure 10, ISO
When conducting the bending test specified in the standard 15O7818-1, there is a risk that stress will be concentrated at the corner 3b of the recess 3, causing cracks and causing the IC module 4 to fall off from the XC card. Met.

An object of the present invention is to improve the mass productivity of IC cards and to provide IC cards with higher reliability.

Means for Solving the Problems In order to achieve the above object, the present invention comprises a card base material having a front surface, a midwinter oversheet, and at least two or more layers of fur material between them, and a layer of fur material between the layers of the core material. A releasable resin is provided, a recess is formed by cutting the oversheet material and at least one layer of core material using a cutting means until the releasable resin is reached, and the IC module is embedded in this recess using an adhesive. It is something that sticks.

Effects According to the above structure, when forming a recess for embedding an IC module in a card base material using a cutting means such as an end mill,
The recesses can be easily formed by cutting along the edges of the four parts to be formed. Also, the depth of the recess is
By controlling the thickness of the core material and oversheet material before winding, precise formation can be achieved.

Furthermore, after embedding and fixing the IC module in the recess with adhesive, when performing the above-mentioned bending test, the concentration of stress was alleviated due to the unbonded part between the core materials placed around the recess due to the release resin. As a result, it is possible to obtain a highly reliable IC card that is less likely to generate cracks.

EXAMPLE An example of the present invention will be described below with reference to the drawings. 1st
The figure is a cross-sectional view of a card base material used in an IC card according to the present invention, and FIGS. 2 and 3 are cross-sectional views of the card base material in which the edges of the recesses have been cut using cutting means of an end mill or the like. FIG. 4 shows a sectional view of a main part of an IC card in which an IC module is embedded in a recessed portion of a card base material.

In this example, the structure of the card base material is as shown in FIG.
Consisting of three layers: oversheet materials 1a and 1b, one layer each on the front and back, and core materials 22L, 2b, and 2C, and core material 2b.
, 0.6 on the entire circumference of the recess formed between the layers of 2C.
The mold release resin was closed so that ~2+o could be seen, and a silicone resin 13 was interposed to form a non-bonding layer. This non-bonding layer silicone resin 13 is printed on the core material 2b and has almost no adhesive strength to the core material 2C side. In FIG. 2, in order to form a recess in a card base material, a linear groove 14 is formed along the edge of the recess using an end mill having a diameter of 1 to 3 mm, which is used as a cutting means. In FIG. 2, the depth is up to the non-bonding layer of silicone resin 13, but it may reach the core material 2C as shown in FIG. Figure 3 shows the groove 14 in Figure 2.
This figure shows a state in which a recess 16 is formed by mechanically removing the unbonded part 16 that was formed as a result of forming the . FIG. 4 shows the IC module 1a embedded and fixed in the bottom of the recess 16 shown in FIG. 3 with adhesive 18.

In this example, one layer of oats each on the front and back sides) 1!
The thickness of L and 1b is 0.03ran each, and the core materials 2a to 2
The thickness of C is 0.10wm, 0.54wm, and 0.1wm, respectively.
It was set to 0+++m. In addition, as shown in FIG. 6, the core materials 2b and 2c are made of two layers i'
It may be 14-zukuri.

Effects of the Invention According to the present invention, even if the depth of the recess in which the IC module is buried is formed by cutting means such as an end mill, the depth of the recess in which the IC module is buried can be precisely controlled by simply controlling the thickness of the core sheet material before lamination. The flatness of the machined surface can also be made into a preferable state. Furthermore, in card bending tests, since there are unbonded parts between the core materials at the edges of the recesses, stress concentrates at the corners of the recesses, causing cracks and preventing accidents such as IC modules falling off. It has a great effect.

[Brief Description of the Drawings] Figure 1 is a cross-sectional view of a card base material in an embodiment of the present invention, and Figure 2 is a card base material in which the edges of the recesses are processed using an end mill or the like on the card base material in Figure 1. 3 is a cross-sectional view of a recess formed in the card base material, FIG. 4 is a cross-sectional view of the main parts of an IC card with an IC module embedded in a recess formed in the card base material, and FIG. 6 is a cross-sectional view of the core material. FIG. 6 is a cross-sectional view of the card base material showing that the edge of the υ recess has been processed by an end mill or the like to a depth exceeding the non-bonding layer provided in between. FIG. 6 is a cross-sectional view of another example of the card base material. 7 is a cross-sectional view of a conventional card base material, FIG. 8 is a cross-sectional view of a conventional card base material with a recess formed with an end mill, etc., FIG. 9 is a cross-sectional view of essential parts of a conventional IC card, and FIG. FIG. 10 is a sectional view of a main part showing the IC card in a bent state. 1a, 1b--oversheet material, 2a,
2b. 2C: Core material, 13: Silicone resin (mold release resin), 1: IC module.

Claims (1)

[Claims] The front and back oversheet materials and at least two layers of core material with a mold release resin interposed between the layers are laminated, and then the oversheet material and at least one layer of the core material are bonded to the mold release resin using cutting means. A method for manufacturing an IC card, characterized in that a recess is formed by cutting the IC card until it reaches the desired height, and an IC module is embedded and fixed in the recess.