JPH02101789A - Mounting method for integrated circuit and its equipment - Google Patents

Abstract

PURPOSE:To obtain an electrically connected state between the following, by fixing with pressure each conductor segment led out externally from an integrated circuit package and each conductor pattern part, of a flexible printed wiring board, which corresponds with each of the above segments. CONSTITUTION:Conductor segments 1a, 1b,... of an integrated circuit package 1 of an image sensing element and the like are inserted from the front into slits 4, 5 of a pedestal 2, and the integrated circuit package 1 is fixed on the pedestal 2. The conductor segments are bent at right angles toward the rear of paper along chain lines B-B', C-C' in the vicinity of the upper and the lower side edges of tip-wide-width part of FPC 8. In this state, the package is inserted in a recessed part 3 of the pedestal 2 while being positioned. Further, when a locking member 13 is inserted from the rear of the FPC 8 while being positioned, connection land parts 9a, 10a,... of the FPC 8 are fixed by pressure inside the conductor segments of the integrated circuit package 1 by the effect of the elastic force of elastic members 16, 17 arranged on both side surfaces of the locking member 13.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method and apparatus for mounting an integrated circuit, and more particularly, to a method and an apparatus for mounting an integrated circuit on the outside of an integrated circuit package such as a solid-state image sensor used in a video camera or an electronic still camera. The present invention relates to a method for attaching each lead-out conductor piece (hereinafter abbreviated as an IC lead) to a printed wiring board, etc., and a device for attaching the same.

[Prior Art] Conventionally, as shown in FIG. 10, this type of mounting means uses the following two methods to mount an integrated circuit package 41 such as a solid-state image sensor onto a printed wiring board 42. Some were adopted.

That is, the first means is to connect the IC leads 41a, 41b, .
2 a, 42 b, . . . , and then soldered to the conductor pattern portion laid on the back surface of the board 42.

The second means is to position the IC socket 43 into which the integrated circuit package 41 can be inserted detachably by fitting the positioning pins 43a, 43b into the openings 42c, 42d on the back surface of the printed wiring board 42. After soldering the socket to the conductor pattern portion of the board 42, the integrated circuit package 41 is bonded to its IC leads 41a.

41b, . . . are inserted into the small holes 4 of the printed wiring board 42.
2a.

42b, . . . and pass through the socket 43.
These include items that can be attached to a person's body.

[Problems to be Solved by the Invention] However, in the first method of directly soldering the IC leads 41a, 41b, . . . of the integrated circuit package 41 to the conductor pattern portion of the printed wiring board 42, When an integrated circuit such as an image sensor is broken or malfunctioning and needs to be replaced and repaired, the integrated circuit package 41
A large number of IC leads 41a.

41b, . . . and each conductor pattern portion 42a of the printed wiring board 42 soldered thereto.

42b, etc., the attached solder is sucked off with a solder sucker, etc., and then the integrated circuit package 4 is heated while simultaneously heating all the IC leads and conductor pattern parts with a soldering iron etc.
There is the annoyance of having to pull out 1. Also, as semiconductors are well known, they are sensitive to heat, so many ICs can be connected at the same time.
Pulling out the leads while heating them without degrading the performance of the integrated circuit is extremely difficult, requires a high degree of skill, and is a time-consuming process. Furthermore, in order to reuse the removed integrated circuit package 41 by mounting it on another printed wiring board, it is necessary to remove the solder that has adhered around the IC leads of the same circuit package 41. Small hole 42a.

A new integrated circuit package cannot be inserted unless the solder attached to 42b, . . . is also thoroughly removed.

Further, the second method of mounting the IC socket 43 on the printed wiring board 42 and inserting the integrated circuit package 41 into the socket 43 is advantageous in terms of replacing the integrated circuit package, but requires the use of an IC socket. This increases the number of parts, increases costs, and increases the failure rate.

On the other hand, a method for connecting a plurality of printed circuit boards has been disclosed in Japanese Patent Laid-Open No. 54-111-1, which aims at electrical continuity while preventing damage to the printed wiring boards by overlapping the copper foil parts of the plurality of printed wiring boards and pressing them together through a protective film. It is disclosed in Japanese Patent No. 44770. However, the technical means disclosed in the publication is a flexible printed wiring board (hereinafter referred to as FPC).
It is about the electrical connection between a comrade or an FPC and a non-flexible flat printed wiring board, and is not about electrical connection between the IC leads of an integrated circuit package and the copper foil part of the printed wiring board. .

An object of the present invention is to solve the above-mentioned problems, and to provide an integrated circuit that electrically connects the conductive pattern portion of the FPC to each IC lead of the integrated circuit package by press-contacting them one-to-one. The present invention provides a mounting method and a mounting device.

[Means and effects for solving the problem] The integrated circuit mounting means of the present invention includes each conductor piece led out to the outside of the integrated circuit package and each conductor pattern portion of the flexible printed wiring board corresponding thereto. This is characterized in that an electrically conductive state between the two is obtained by bringing them into pressure contact.

[Example] Hereinafter, a mounting apparatus to which the integrated circuit mounting method of the present invention is applied will be specifically described with reference to the drawings. In the following explanation, an integrated circuit package having a solid-state image sensor will be used as an example of an integrated circuit package, but the present invention is not limited to this, and it may be used as an integrated circuit package with an autofocus-related light receiving element or an automatic exposure device. Of course, the present invention can also be applied to integrated circuit packages such as photometric elements.

FIG. 2 is a rear view of an integrated circuit mounting apparatus showing a first embodiment of the present invention, and FIG. 1 is a sectional view taken along the dashed line 1--1 in FIG. In FIGS. 1 and 2, the pedestal 2, which is a crimping member that holds the integrated circuit package 1, is a rectangular rigid body made of an electrical insulator, and the side opposite to the stone mounting surface of the integrated circuit package 1 is a rigid body made of an electrical insulator. A recess 3, which is slightly larger than the integrated circuit package 1, is formed in the center of the surface of the integrated circuit package 1. In order to insert conductor pieces 1a and lb made of IC leads of gold or the like led out from the package 1 into the upper and lower edges of this recessed part 3, spanning the width and width of the recessed part 3. slits 4 and 5 are bored. Also,
At a substantially symmetrical position in the center of the concave portion 3, there is an FPC which will be described later.
8 and the locking member 13 are provided with positioning bosses 6.7.

In the concave portion 3 of the pedestal 2 formed in this way, an FPC 8 having a width of about a cup in the vertical direction is disposed.
The other end of C8 is connected to a processing circuit of an imaging system (not shown). As shown in FIG. 3, one surface of the FPC 8 has a plurality of conductor pattern parts 9, 10.・・・・・・
・are printed, and each pattern portion 9, 10 . At the tips of . . . are conductor pieces 1a, lb, . . . made of gold IC leads led out from the integrated circuit package 1.
The connection lands 9a, 10a, etc. are made of arrow tension metal and are wider than the pattern width in a 1:1 ratio.
... is formed.

A positioning hole 11 and a positioning elongated hole 12 are bored at the tip of the FPC 8 at positions corresponding to the positioning bosses 6.7 planted on the pedestal 2.

Returning to FIG. 1, on the rear surface of the tip of the FPC 8, a locking member 13 made of a cube having a size that fits into the recess 3 of the pedestal 2 is disposed. As shown in FIG. 4, this locking member 13 has a circumferential positioning hole 141 that fits into a positioning boss 6.7 installed in the pedestal 2, and a positioning hole 15 formed approximately in the center. Also, the connecting land portions 9a, 10g of the above FPC 8, old...
The conductor pieces 1a, lb, . . . of the integrated circuit package 1 are
. . . Elastic members 16 and 17 made of, for example, silicone rubber are attached to both sides in the long plane direction by adhesive or the like.

In the first embodiment configured in this way, the conductor piece 1a of the integrated circuit package 1 such as an image sensor.

lb,... in front (left side in Figure 1, second
In the figure, the slit of pedestal 2 is 4°5 from the back of the page)
to attach the integrated circuit package 1 to the pedestal 2. Next, as shown in FIG. 1, while bending the FPC 8 at right angles toward the back of the page along the chain lines B-B'C-C' near the upper and lower both edges of the wide end portion of the FPC 8 shown in FIG. Insert it into the recessed part 3 of No. 2 while positioning it. Furthermore, F
Lock member 1 from the rear of PC8 (right side in Figure 1)
3 while positioning it, the elastic members 16 and 17 provided on both sides of the locking member 13 will cause the F
Connection land portions 9a, 10a,... of PC8
. . are the conductor pieces 1a, lb, . . of the integrated circuit package 1.
It is pressed against the inside of... Usually, the conductor pieces 1a, 1b of the integrated circuit package 1 are made of gold or are fully plated, so that the connection land parts 9a, 10a of the FPC 8
.

If the conductor pieces 1a and lb of the integrated circuit package 1 are treated with full plating or tin plating to reduce the electrical resistance upon contact, as described above.

Connection land part 9 a, 1 of FPC 8 on ......
By simply pressing 0 a+ . . . , the electrical continuity and mechanical holding state between the two can be obtained.

If you want to replace the integrated circuit package 1 for repair or the like, then replace the opening/rift member 1 by reversing the above-mentioned assembly procedure.
3. By removing the FPC 8 in order, the integrated circuit package 1 can be easily and quickly removed. In other words, according to this embodiment, it is possible to easily install and remove an integrated circuit package such as an image sensor without using a soldering iron or an IC socket. This is advantageous and has a simple configuration.

The lock member 13 used in the first embodiment described above is
As shown in FIG. 4, elastic members 16 and 17, such as silicone rubber, are separately attached to the side surfaces of the rigid body, and as shown in FIG.
8 is bent into a U-shape, and its both side edges 18a
, 18b and the warpage of the entire leaf spring to form the conductor piece 1a.

lb,... and connecting land portions 9a, 10a
+ . . . may be electrically contacted, thereby further reducing the cost of the integrated circuit mounting apparatus.

Further, such a locking member 13 connects the connecting land portions 9a, 10a, . . . of the FPC 8 to the conductor pieces 1a.

1b... If the conductor pattern portion of the FPC 8 is bent at a steep angle, the pattern may break during use. Therefore, in order to prevent pattern breakage of the FPC 8, it is desirable to round the ends of the elastic members 16 and 17 as shown in FIG. 6.

Furthermore, a conductor piece 1a made of an IC lead.

Land part 9 a* 10 connected to lb,...
In order to press the parts a, . Therefore, the conductor pieces 1a are inserted into the slits 4 and 5 of the pedestal 2 shown in FIG.
, Lb, . . . may be provided, or the pedestal 2 may be provided with something like a stopper bin for determining the external position of the integrated circuit package 1 with respect to the pedestal 2. However, in this case, it is assumed that there is little variation in the external dimensions of the integrated circuit package 1 and the pin position dimensions of the conductor pieces consisting of IC leads.

FIG. 7 is an exploded perspective view of an integrated circuit mounting apparatus showing a second embodiment of the present invention. This second embodiment differs greatly from the first embodiment described above in the conductor piece 21a made of the IC lead of the integrated circuit package 21.

Therefore, the integrated circuit package 21. The FPC 28 and the locking member 23 are attached to the pedestal 22 from above.

The pedestal 22, which has a convex cross-sectional shape, has a large number of small holes 22a located near both edges in the elongated direction.

22b, . . . are bored. This small hole 22
a.

The integrated circuit package 21 is attached to the pedestal 22 by inserting the conductor pieces 21 a + 2 l b + . . . of the integrated circuit package 21 into 22b, . Then, an FPC 28 having connection land portions 28a and 28b is placed on the inner surface from above,
Furthermore, by pushing the frame-shaped locking member 23 from above through an elastic member (not shown), the connection land portion 2
8a, 28b... are the conductor pieces 21a.

It is adapted to be brought into pressure contact with the outside of 21b.

In the second embodiment configured as described above, the pressure contact portions consisting of the conductor pieces 21a, 21b, . . . consisting of IC leads and the connecting land portions 28a, 28b, . Since the component 23 is configured to be clamped from the outside, the shape of the integrated circuit package is not limited to the dual inline type shown in FIG. 7; for example, the IC leads may face outward. The present invention can be applied even to a flat package type integrated circuit by simply changing the configuration slightly.

Further, even if the position of the IC lead is slightly shifted during transportation such as delivery, it can be easily corrected.

Incidentally, the integrated circuit package for image pickup devices currently in use is a so-called dual in-line package φ type in which the IC leads are lined up in two rows, but as the trend toward higher density integration continues, In the future, it is thought that the trend will be towards a flat package type integrated circuit in which IC leads are arranged in four directions, that is, a quad type flat package type integrated circuit. Therefore, in the third embodiment shown in FIGS. 8 and 9, the present invention is applied to such a four-way flat package type integrated circuit package.

In FIG. 8, the pedestal 32 is provided with a peripheral wall 35 projecting from its upper surface and having vertical slits 35a, 35b, . . . . This peripheral wall 35 has a main body portion of a four-way flat package type integrated circuit package 31 housed therein, and a slit 35
Conductor pieces 31a, 31b, . . . made of IC leads are inserted into the holes 31a, 35b, . From above, it has a frame shape that is slightly larger than the peripheral wall 35, and has connection land portions 38a, 38 on the back surface.
After placing the FPC 38 provided with b, .

Push in the locking member 33 with 33b. Then,
The locking claws 33a, 33b are attached to the base 32 as shown in FIG.
It will be hooked to the bottom of the and locked.

By the way, when a video camera or an electronic still camera is assembled, adjustment steps such as focus adjustment are required. In each of the above-mentioned embodiments, an FPC is used to connect an integrated circuit package such as a solid-state image sensor with a processing circuit of an image sensor, and the conductor pattern portion of the FPC is pressed into contact with the IC lead (conductor piece) of the image sensor. Not only does this reduce the number of connection points by one, but the flexibility of the FPC allows the focus to be adjusted by moving the light and small image sensor back and forth while leaving large units such as processing circuits fixed. This increases the degree of freedom in the adjustment process.

[Effects of the Invention] As described above, according to the present invention, compared to the case where each conductor piece led out to the outside of the package of an integrated circuit such as an image sensor is attached to a printed wiring board by soldering, the integrated circuit Since it is extremely easy to attach and remove from a printed wiring board and does not require any skill, manufacturing costs can be reduced and it is very convenient during repairs. Furthermore, compared to the case where an IC socket is used, remarkable effects such as a simpler configuration and lower cost are exhibited.

[Brief explanation of drawings]

1 and 2 are a cross-sectional view and a rear view of an integrated circuit mounting device showing a first embodiment of the present invention, FIG. 3 is a plan view of essential parts of an FPC in the first embodiment, and FIG. , FIG. 5 is a perspective view showing an example of the locking member in the first embodiment, and FIG. 6 is a main part showing an example of means for avoiding pattern breakage in the conductor pattern portion of the FPC in FIG. 1. 7 is an exploded perspective view of an integrated circuit mounting device showing a second embodiment of the present invention; FIG. 8 is an exploded perspective view of an integrated circuit mounting device showing a third embodiment of the present invention; FIG. 9 is a sectional view of the integrated circuit mounting apparatus shown in FIG. 8, and FIG. 10 is a perspective view of the mounting apparatus illustrating a conventional integrated circuit mounting means.

Claims (2)

[Claims] (1) Electrical continuity is established between each conductor piece led out of the integrated circuit package and the corresponding conductor pattern portion of the flexible printed wiring board by press-contacting them. An integrated circuit mounting method characterized by: (2) When each conductor piece led out to the outside of the integrated circuit package is in contact with each conductor pattern portion of the flexible printed wiring board, both of these contacting pieces are removed from the outside. An integrated circuit mounting device comprising a clamping member for clamping.