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JPH019187Y2 - - Google Patents

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Publication number
JPH019187Y2
JPH019187Y2 JP1982011106U JP1110682U JPH019187Y2 JP H019187 Y2 JPH019187 Y2 JP H019187Y2 JP 1982011106 U JP1982011106 U JP 1982011106U JP 1110682 U JP1110682 U JP 1110682U JP H019187 Y2 JPH019187 Y2 JP H019187Y2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
wire
lead terminal
insulating base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982011106U
Other languages
Japanese (ja)
Other versions
JPS58114084U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1110682U priority Critical patent/JPS58114084U/en
Publication of JPS58114084U publication Critical patent/JPS58114084U/en
Application granted granted Critical
Publication of JPH019187Y2 publication Critical patent/JPH019187Y2/ja
Granted legal-status Critical Current

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  • Supports For Pipes And Cables (AREA)
  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【考案の詳細な説明】 本考案は線材を束線してプリント基板の面上に
固定するクランパに関するものである。
[Detailed Description of the Invention] The present invention relates to a clamper for bundling wires and fixing them on the surface of a printed circuit board.

複雑な回路を小型のプリント基板で構成する場
合、この回路の各部品間を接続する結線はプリン
トされた部分だけでは足りず、結線用に多数の線
材がプリント基板に取付けられることがある。こ
の場合、これらの線材がプリント基板上で浮遊し
てしまい、組み上がつたプリント基板は嵩ばつて
扱いにくいものとなつてしまう。このため従来で
は例えば実願昭49−136906号明細書に記載のよう
に、基板に突出部を加工し、この突出部と線材を
結束具によつて結束し基板に線材を保持固定して
いる技術がある。この従来技術であると、保持固
定する位置が自由にならず、基板の作成時に位置
が決まつてしまい、位置や数量や取付け間隔等を
変更することができない。また基板を加工するこ
とにより、基板の実装密度が落ちてしまう等の重
大なる課題が残されていた。
When a complex circuit is constructed using a small printed circuit board, the printed parts alone are not enough to connect each component of the circuit, and a large number of wires may be attached to the printed circuit board for connection. In this case, these wires float on the printed circuit board, making the assembled printed circuit board bulky and difficult to handle. For this reason, in the past, for example, as described in the specification of Utility Model Application No. 136906/1980, a protruding part is processed on the board, and the protruding part and the wire are tied together with a binding tool to hold and fix the wire to the board. There is technology. With this conventional technique, the position for holding and fixing cannot be set freely, and the position is determined when the board is created, and the position, quantity, mounting interval, etc. cannot be changed. Furthermore, serious problems remain, such as the processing of the board reduces the packaging density of the board.

本考案はかかる点に鑑み提案されたもので上述
課題を除去し、良好に線材を束線でき、更に束線
した所をプリント基板に固定したときにプリント
基板の実装密度に影響がでないようにまた新たに
プリント基板を加工するすることの無いクランパ
を提供するものである。
The present invention was proposed in view of these points, and it eliminates the above-mentioned problems, allows wires to be bundled well, and furthermore, when the bundled wires are fixed to a printed circuit board, the mounting density of the printed circuit board is not affected. Furthermore, the present invention provides a clamper that does not require additional processing of printed circuit boards.

以下本考案を図面に従つて説明する。第1図は
本考案の1実施例を示す斜視図、第2図は同実施
例の具体的な使用例を示す斜視図である。
The present invention will be explained below with reference to the drawings. FIG. 1 is a perspective view showing one embodiment of the present invention, and FIG. 2 is a perspective view showing a specific usage example of the same embodiment.

図において、1はクランパで一端が線材4を挿
通したときに線材4を束線すべく弾性的に開閉可
能な輪状体2を形成している。また他端は例えば
プリント基板3に半田付された抵抗12のリード
端子13に掛止される係止部3を構成している。
即ち、このクランパ1は線材4をプリント基板に
所定距離を保つて保持している。このクランパ1
は合成樹脂等の絶縁性と弾力性を有する材料で形
成され、輪状体2にはその自由端2′を弾力性を
利用して拡き、線材4を挿通可能になつている。
係止部3はリード端子13に係止され、線材4が
輪状体2に挿通されると、輪状体2の張力で線材
4方向へ張つぱられ、係止部3がリード端子13
から抜出さない様に保持される。又係止部3には
リード端子13に引掛けられた際、リード端子1
3が係止部3から抜出さない様に係止部3に第1
図点線で示す様な隆起部14を設けても良い。
In the figure, reference numeral 1 denotes a clamper, and one end thereof forms a ring-shaped body 2 that can be elastically opened and closed to bundle the wire rods 4 when the wire rods 4 are inserted thereinto. The other end constitutes a locking portion 3 that is hooked onto a lead terminal 13 of a resistor 12 soldered to a printed circuit board 3, for example.
That is, this clamper 1 holds the wire 4 at a predetermined distance from the printed circuit board. This clamper 1
is made of an insulating and elastic material such as synthetic resin, and the ring-shaped body 2 has its free end 2' expanded by utilizing its elasticity so that the wire 4 can be inserted therethrough.
The locking part 3 is locked to the lead terminal 13, and when the wire 4 is inserted through the ring-shaped body 2, the tension of the ring-shaped body 2 causes the locking part 3 to be pulled in the direction of the wire 4.
It is held so that it cannot be pulled out. In addition, when the locking part 3 is hooked on the lead terminal 13, the lead terminal 1
3 is attached to the locking part 3 to prevent it from being pulled out from the locking part 3.
A raised portion 14 as shown by the dotted line in the figure may also be provided.

また第3図は他の実施例を示す斜視図で、第4
図は同実施例の底面図、第5図は同実施例の具体
的な使用例を示す斜視図である。
Further, FIG. 3 is a perspective view showing another embodiment, and FIG.
The figure is a bottom view of the same embodiment, and FIG. 5 is a perspective view showing a specific usage example of the same embodiment.

第3図の5は前述した実施例の輪状体2に相当
し、また7は係止部に相当する。さてこの実施例
では、線材4を輪状体5に挿通すると前述の実施
例と同様に線材4を握るように付勢し、線材5を
束線する。また係止部7を抵抗12のリード端子
13側からプリント基板3の面上に沿つてスライ
ドすれば、このリード端子13は係止部7に設け
た挿通溝8から溝内に挿入される。一方挿通溝8
には内部に対向して一対の突起6が設けられてお
り、挿通溝8に挿入された抵抗12のリード端子
13は一対の突起6を乗り越え、係止され、クラ
ンパ9をプリント基板3に固定する。挿通溝8は
抵抗12が嵌合される幅を有する。
Reference numeral 5 in FIG. 3 corresponds to the annular body 2 of the above-described embodiment, and 7 corresponds to a locking portion. In this embodiment, when the wire 4 is inserted into the annular body 5, the wire 4 is biased to be gripped and the wire 5 is bundled as in the previous embodiment. Further, by sliding the locking portion 7 along the surface of the printed circuit board 3 from the lead terminal 13 side of the resistor 12, the lead terminal 13 is inserted into the groove through the insertion groove 8 provided in the locking portion 7. One side insertion groove 8
A pair of protrusions 6 are provided inside facing each other, and the lead terminal 13 of the resistor 12 inserted into the insertion groove 8 rides over the pair of protrusions 6 and is locked, thereby fixing the clamper 9 to the printed circuit board 3. do. The insertion groove 8 has a width into which the resistor 12 is fitted.

第3図の場合、係止部7は一端が抵抗12に嵌
合されるものとしたが、少なく共リード端子13
に係止されるものであれば良い。
In the case of FIG. 3, one end of the locking part 7 is fitted to the resistor 12, but at least one end of the locking part 7 is fitted to the lead terminal 13.
It is fine as long as it can be locked to.

このように本考案によれば、プリント基板上に
浮遊する線材を束線し、またこの束線箇所をプリ
ント基板に実装した電子部品で取付けでき、プリ
ント基板上で線材が浮遊することによるプリント
基板の嵩ばりを少くでき有効である。更に電子部
品のリード端子へ取り付けることにより、プリン
ト基板上の実装密度を落とさず、また新たにプリ
ント基板を加工する必要が無く、クランパの取付
け位置や数量を必要に応じて比較的自由に変更で
きるという実用的効果を奏する。
As described above, according to the present invention, the wires floating on the printed circuit board can be bundled, and the bundled wires can be attached to the electronic components mounted on the printed circuit board. It is effective because it can reduce the bulk. Furthermore, by attaching to the lead terminals of electronic components, the mounting density on the printed circuit board is not reduced, there is no need to process new printed circuit boards, and the mounting position and number of clampers can be changed relatively freely as necessary. This has a practical effect.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の1実施例を示す斜視図、第2
図は同実施例の具体的な使用例を示す斜視図、第
3図は他の実施例を示す斜視図、第4図は同実施
例の底面図、第5図は同実施例の具体的な使用例
を示す斜視図である。 1,7……クランパ、2,5……輪状体、3,
7……係止部。
Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a perspective view showing a specific usage example of the same embodiment, FIG. 3 is a perspective view showing another embodiment, FIG. 4 is a bottom view of the same embodiment, and FIG. 5 is a specific example of the same embodiment. FIG. 3 is a perspective view showing an example of use. 1, 7... Clamper, 2, 5... Annular body, 3,
7...Locking part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基体と、この絶縁基体の一端に延設され弾
性的に開閉可能な輪状体と、前記絶縁基体の他端
に設けられプリント基板に実装された電子部品の
リード端子を回り込んで掛止するかまたは前記リ
ード端子を乗り越えて掛止する係止部とからなる
ことを特徴とするクランパ。
An insulating base, a ring-shaped body extending from one end of the insulating base and capable of being opened and closed elastically, and a ring-like body provided at the other end of the insulating base for wrapping around and hooking lead terminals of electronic components mounted on a printed circuit board. or a locking portion that rides over and locks the lead terminal.
JP1110682U 1982-01-29 1982-01-29 Clamper Granted JPS58114084U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1110682U JPS58114084U (en) 1982-01-29 1982-01-29 Clamper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1110682U JPS58114084U (en) 1982-01-29 1982-01-29 Clamper

Publications (2)

Publication Number Publication Date
JPS58114084U JPS58114084U (en) 1983-08-04
JPH019187Y2 true JPH019187Y2 (en) 1989-03-13

Family

ID=30023725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1110682U Granted JPS58114084U (en) 1982-01-29 1982-01-29 Clamper

Country Status (1)

Country Link
JP (1) JPS58114084U (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0334928Y2 (en) * 1985-08-01 1991-07-24

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5162097U (en) * 1974-11-12 1976-05-15

Also Published As

Publication number Publication date
JPS58114084U (en) 1983-08-04

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