JPH0189747U - - Google Patents
Info
- Publication number
- JPH0189747U JPH0189747U JP18609387U JP18609387U JPH0189747U JP H0189747 U JPH0189747 U JP H0189747U JP 18609387 U JP18609387 U JP 18609387U JP 18609387 U JP18609387 U JP 18609387U JP H0189747 U JPH0189747 U JP H0189747U
- Authority
- JP
- Japan
- Prior art keywords
- suction
- pad
- grip
- tip
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
Description
第1図は本考案に係るウエハ剥離用治具の一実
施例を示す斜視図、第2図は治具先端の吸着パツ
ドの拡大断面図、第3図は本考案に係るウエハ剥
離用治具を用いた剥離作業の手順を示す工程図、
第4図は従来の治具を用いた剥離作業の手順を示
す工程図、第5図は従来の他の治具を用いた剥離
作業の手順を示す工程図、第6図は第5図の方法
で使用される治具の一例を示す斜視図である。
1……ウエハ、2……貼付けプレート、10…
…剥離用治具、11……グリツプ、12……パイ
プ、13……吸着パツド、13a……エツジ部材
、13b……吸引穴、13c……吸着面、14…
…吸引ホース。
FIG. 1 is a perspective view showing an embodiment of a wafer peeling jig according to the present invention, FIG. 2 is an enlarged sectional view of a suction pad at the tip of the jig, and FIG. 3 is a wafer peeling jig according to the present invention. A process diagram showing the procedure of peeling work using
Figure 4 is a process diagram showing the procedure for peeling work using a conventional jig, Figure 5 is a process diagram showing the procedure for peeling work using another conventional jig, and Figure 6 is a process diagram showing the procedure for peeling work using another conventional jig. FIG. 2 is a perspective view showing an example of a jig used in the method. 1... Wafer, 2... Pasting plate, 10...
...Peeling jig, 11... Grip, 12... Pipe, 13... Suction pad, 13a... Edge member, 13b... Suction hole, 13c... Suction surface, 14...
...suction hose.
Claims (1)
ツプと、このグリツプの一端に接続され、上記貫
通孔と連通された吸引穴が形成された吸着面を有
する吸着パツドとからなり、上記グリツプの他端
に真空吸引ホースが接続可能にされてなるウエハ
剥離用治具であつて、上記吸着パツドの少なくと
も吸着面を軟質材料で形成するとともに、吸着パ
ツドの先端には硬質材料からなるエツジ部材を付
着し、パツド先端部が鋭角をなすように構成した
ことを特徴とするウエハ剥離用治具。 (2) 上記吸着パツドの先端角が2段階で変化す
るように形成したことを特徴とする実用新案登録
請求の範囲第1項記載のウエハ剥離用治具。[Claims for Utility Model Registration] (1) A grip having a through hole for air suction inside, and a suction surface connected to one end of the grip and having a suction hole communicating with the through hole. A wafer peeling jig comprising a pad and a vacuum suction hose connectable to the other end of the grip, wherein at least the suction surface of the suction pad is formed of a soft material, and the tip of the suction pad is made of a soft material. A wafer peeling jig characterized in that an edge member made of a hard material is attached and the tip of the pad is configured to form an acute angle. (2) The wafer peeling jig according to claim 1, wherein the suction pad is formed so that the tip angle thereof changes in two steps.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18609387U JPH0189747U (en) | 1987-12-07 | 1987-12-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18609387U JPH0189747U (en) | 1987-12-07 | 1987-12-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0189747U true JPH0189747U (en) | 1989-06-13 |
Family
ID=31477341
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18609387U Pending JPH0189747U (en) | 1987-12-07 | 1987-12-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0189747U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014022648A (en) * | 2012-07-20 | 2014-02-03 | Tatsuta Electric Wire & Cable Co Ltd | Peeling tool for protective film on printed wiring board |
-
1987
- 1987-12-07 JP JP18609387U patent/JPH0189747U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014022648A (en) * | 2012-07-20 | 2014-02-03 | Tatsuta Electric Wire & Cable Co Ltd | Peeling tool for protective film on printed wiring board |
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