JPH0183387U - - Google Patents
Info
- Publication number
- JPH0183387U JPH0183387U JP1987178314U JP17831487U JPH0183387U JP H0183387 U JPH0183387 U JP H0183387U JP 1987178314 U JP1987178314 U JP 1987178314U JP 17831487 U JP17831487 U JP 17831487U JP H0183387 U JPH0183387 U JP H0183387U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- soldering
- housed
- wound
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図イは本考案の一実施例の回路基板の上面
図、第１図ロは同じく正面図、第２図は多重巻し
た回路ブロツクの斜視図、第３図はビデオカメラ
に回路ブロツクを収納した斜視図である。
１…フレキシブル基板、２…電子部品、４…円
筒型ケース、５…回路基板ブロツク、６…回路基
板。
FIG. 1A is a top view of a circuit board according to an embodiment of the present invention, FIG. It is a perspective view of a stored state. DESCRIPTION OF SYMBOLS 1...Flexible board, 2...Electronic component, 4...Cylindrical case, 5...Circuit board block, 6...Circuit board.
Claims (1)
を搭載し、半田付してなる回路基板において、該
回路基板を多重巻にして円筒型の該回路基板取付
ケースに収納したことを特徴とする回路基板。 A circuit board formed by mounting surface-mountable electrical components on a flexible board and soldering them, characterized in that the circuit board is wound in multiple layers and housed in a cylindrical circuit board mounting case. substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987178314U JPH0183387U (en) | 1987-11-25 | 1987-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987178314U JPH0183387U (en) | 1987-11-25 | 1987-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0183387U true JPH0183387U (en) | 1989-06-02 |
Family
ID=31469937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987178314U Pending JPH0183387U (en) | 1987-11-25 | 1987-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0183387U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020194952A (en) * | 2019-05-24 | 2020-12-03 | Ｎｉｓｓｈａ株式会社 | Cylindrical printed circuit board and printed circuit board integrally molded product |
-
1987
- 1987-11-25 JP JP1987178314U patent/JPH0183387U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020194952A (en) * | 2019-05-24 | 2020-12-03 | Ｎｉｓｓｈａ株式会社 | Cylindrical printed circuit board and printed circuit board integrally molded product |
| CN113557799A (en) * | 2019-05-24 | 2021-10-26 | 日写株式会社 | Cylindrical printed board and printed board integrated product |
| US11324114B2 (en) | 2019-05-24 | 2022-05-03 | Nissha Co., Ltd. | Cylindrical printed board and printed-board-integrated molded article |
| CN113557799B (en) * | 2019-05-24 | 2024-10-29 | 日写株式会社 | Integrated printed circuit board molding |
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