JPH01717A - Adhesive flexible lead element - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an element such as a resistive capacitive semiconductor sensor, and more particularly to an element having flexible leads with adhesive for input/output signals of the element.

In recent years, the circuit mechanisms of computers, terminals, vending machines, home audio equipment, communications equipment, facsimile machines, and other electronic devices have become more precise and smaller, and the space on printed circuit boards has become extremely small, making it difficult for elements to It seems to be used a lot. However, it is impossible to assemble elements alone in a factory or laboratory without general equipment. Secondly, it is extremely difficult to attach it to necessary locations other than printed circuit boards. In addition, conventional electrical parts have various drawbacks in that automatic insertion is not yet possible for all types.The present invention aims to eliminate these drawbacks.

The present invention will be explained in detail below with reference to the drawings.

FIG. 1 shows conventional resistors, diodes, etc., and it would be extremely difficult to perform taping, magazine preparation, insertion jigs, etc. for automatic insertion.

Figure 2 shows conventional LEDs, Hall elements, etc., and 3-terminal leads are semiconductor transistors, SCRs, etc. Insertion is extremely difficult because it requires taping, parts feeders, etc.

FIG. 3 shows recent resistance elements and capacitance elements. It is still impossible to attach these printed circuit boards using conventional technology.

FIG. 4 shows an example in which a sensor is assembled using two or more conventional elements, and this is a beam flap.

Sensors are used 90% of the time, especially on printed circuit boards, but also in other places. Therefore, it is very difficult to attach conventional elements.

FIG. 5 is a configuration diagram of the adhesive flexible lead element of the present invention.

Place a copper thin film (apply force on the surface of an insulating material plate such as mylar that is easy to bend (moon tape (but use an opaque black color when using an optical sensor) to attach the element (2) to the attachment point 4) and the lead part (3).
To attach to the flat surface of the flexible tape plywood by leaving the necessary parts such as 1 and removing the others, attaching the element 12) to the attachment point 4) of the above-mentioned element (2), or connecting the wiring by bonding etc. Coat the adhesive side of the paper (6) to protect the adhesive (5).
). Then, leaving a piece of paper, punching is made to separate the individual elements so that they can be taken out along the punch lines (8). When using this element, it is removed from the paper (6) and fixedly attached using adhesive (5).

FIG. 6 shows an example of two devices using the present invention at the same time, in which a light emitting device (9) and a light receiving device (10) are attached to a flexible lead (11) with adhesive. It is a reflector sensor that is placed in a case (12) and converts the light from the light emitting element (9) into parallel light, and the light hits an object and enters the light receiving element (10).

FIG. 7 shows an example of a device in which one device of the present invention is used separately. First, a light emitting element with two adhesively attached flexible leads (
15) and a light-receiving element (13) facing each other, and fixed with adhesive to a support base (14) having a hole for parallel light and a slit for passing and blocking objects.

In FIG. 8, an IC board (16) is attached to a flexible lead (17) with skin adhesive. This makes assembly possible even in factories and laboratories without regular equipment.

By using a method using an element and a flexible lead with adhesive, the present invention can be easily applied not only to computers and terminal equipment, vending machines, home appliances and audio equipment, communication equipment, facsimiles, but also to other fields that do not use printed circuit boards. It can be used in a very wide range. Moreover, the elements (resistors, capacitors, semiconductor ICs, sensors, etc.) on the substrate can be made very compact, and the space can be made very small.

The elements can be used stably over a wide range of applications, not only as resistors and capacitors, but also as semiconductor elements (diodes, LEDs, transistors, ICs, etc.) and sensors (ffl air, temperature, light, humidity, capacitance, high frequency, etc.) I can do it.

The installation speed of the product of the present invention is very fast because of the tape, and an automatic installation machine can be used easily and at low cost.

It will also be much cheaper to assemble.

Furthermore, because of the adhesive flexible lead tape of the present invention,
The unit cost of attaching the number of elements to the tape becomes cheaper, and the overall cost becomes cheaper.

[Brief explanation of drawings]

Fig. 1 is an external view of conventional resistors and diodes, Fig. 2 is an external view of conventional LEDs, Hall elements, transistors, etc., Fig. 3 is an external view of recent resistors and capacitive elements, and Fig. 4 is an external view of conventional resistors and diodes. An external view of the sensor (light reflector), Fig. 5 is a configuration diagram of the adhesive flexible lead element of the present invention, Fig. 6 is a configuration diagram of two elements of the present invention, and Fig. 7 is an assembled configuration of each element of the present invention. FIG. 8 is an assembled diagram of the IC element of the present invention. 1 is a bendable insulating material plate, 2 is an element, 3 is a lead terminal part, 4 is a part for attaching the element, 5 is an adhesive, 6 is a protective paper for the adhesive, 7 is a copper thin film, 8 is a cutter wire, 9 is a Light receiving element, 10
is a light emitting element, 11 is a flexible lead with adhesive, 12 is a case, 13 and 15 are flexible lead elements with adhesive,
14 is a support base, 16 is an IC element, and 17 is a plate substrate.

Claims (1)

[Claims] A thin copper layer (7) having a surface portion (4) where the element (2) is to be attached and a lead terminal portion (3) for inputting and outputting signals from the element (2) is attached to the flat surface of the flexible insulating material plate (1). Apply adhesive (5) to the flat surface of the board, attach the element (2) to the attachment part (4) of the previous element on a flexible plywood board with paper (6) pasted to protect the adhesive (5), Alternatively, by performing wiring connections such as bonding, necessary input/output signals are passed through the element, and the elements are made parallel and tape-shaped. This element is characterized in that, when the element is used, it can be peeled off from the paper (6) and fixedly attached using an adhesive.