JPH0158950U - - Google Patents
Info
- Publication number
- JPH0158950U JPH0158950U JP15351487U JP15351487U JPH0158950U JP H0158950 U JPH0158950 U JP H0158950U JP 15351487 U JP15351487 U JP 15351487U JP 15351487 U JP15351487 U JP 15351487U JP H0158950 U JPH0158950 U JP H0158950U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- board
- integrated circuit
- circuit board
- microwave integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Multi-Conductor Connections (AREA)
- Waveguides (AREA)
Description
第１図は本考案のマイクロ波集積回路基板の組
立構造の一実施例を示す断面図、第２図は本考案
の組立構造の別の実施例を示す断面図である。第
３図及び第４図は従来のマイクロ波集積回路基板
の組立構造を示す断面図である。
５……マイクロ波集積回路基板、６……マイク
ロストリツプライン、７……アースパターン、８
……透孔、９……導体、１０……金属筐体、１０
ｂ……金属ピン。
FIG. 1 is a sectional view showing one embodiment of the assembly structure of a microwave integrated circuit board according to the present invention, and FIG. 2 is a sectional view showing another embodiment of the assembly structure of the present invention. 3 and 4 are cross-sectional views showing the assembled structure of a conventional microwave integrated circuit board. 5... Microwave integrated circuit board, 6... Microstrip line, 7... Earth pattern, 8
...Through hole, 9...Conductor, 10...Metal casing, 10
b...Metal pin.
Claims (1)
れ、他方の面にアースパターンが形成されたマイ
クロ波集積回路基板と、この基板を内包する金属
筐体との組立構造に於いて、前記基板に透孔を設
け前記基板上の接地用のマイクロストリツプライ
ンと前記アースパターンとを撃ぐ導体を前記透孔
の周面に形成し、さらに、前記筐体に一体成形も
しくは固定された金属ピンを前記透孔に挿入する
ことによつて前記接地用のマイクロストリツプラ
インを金属筐体に電気的に接続すると共に、前記
基板を筐体に強固に固定することを特徴とするマ
イクロ波集積回路基板の組立構造。 In an assembly structure of a microwave integrated circuit board with microstrip lines formed on one surface and a ground pattern formed on the other surface, and a metal casing enclosing this board, a through hole is formed in the substrate. A conductor is formed on the circumferential surface of the through hole to connect the microstrip line for grounding on the board and the earth pattern, and a metal pin integrally molded or fixed to the housing is connected to the through hole. Assembly of a microwave integrated circuit board, characterized in that the grounding microstrip line is electrically connected to a metal casing by being inserted into a hole, and the board is firmly fixed to the casing. structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15351487U JPH0158950U (en) | 1987-10-07 | 1987-10-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15351487U JPH0158950U (en) | 1987-10-07 | 1987-10-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0158950U true JPH0158950U (en) | 1989-04-13 |
Family
ID=31429421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15351487U Pending JPH0158950U (en) | 1987-10-07 | 1987-10-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0158950U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011166494A (en) * | 2010-02-10 | 2011-08-25 | Nippon Dengyo Kosaku Co Ltd | Plane circuit, and filter circuit |
| JP2013150582A (en) * | 2012-01-26 | 2013-08-08 | Daiichi Vinyl Kk | Sheet-like article press tool |
-
1987
- 1987-10-07 JP JP15351487U patent/JPH0158950U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011166494A (en) * | 2010-02-10 | 2011-08-25 | Nippon Dengyo Kosaku Co Ltd | Plane circuit, and filter circuit |
| JP2013150582A (en) * | 2012-01-26 | 2013-08-08 | Daiichi Vinyl Kk | Sheet-like article press tool |
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