JPH0134343Y2 - - Google Patents

Description

[Detailed description of the invention] The present invention relates to an external electrode coating device for electronic components.
In particular, the present invention relates to an apparatus for applying a paste-like external electrode to both end surfaces of an electrode portion of an electronic component.

Conventionally, to apply external electrodes on electronic components, as shown in Fig. 1, electronic components 3 are first fitted into the grooves of an alignment jig 2, which has grooves in the desired shape. It is pressed against the electronic component 3 so that it adheres to the end surface of the holder 1 and is aligned. Next, as shown in FIG. 2, external electrodes were applied by pressing the aligned electronic components 3 against the surface of the roller 4 on which the conductive paste 6 had been applied in advance. However, in such conventional means, the holder 1
The positional accuracy when aligning and adhering the electronic components 3 is poor, which causes variations in the coating dimensions of the external electrodes. For this reason, many products do not meet the standard, which states that in order to ensure a sufficient coating size, the coating must be applied over a predetermined electrode size. Furthermore, in the case where the electronic component 3 is applied by pressing it against the roller 4, as shown in FIG. 3, the surface 7 on which the external electrode is applied is not parallel to the end surface but is applied in an arcuate manner, which is the smallest part of the application width. It becomes difficult to apply the coating at both ends to a predetermined size or more. Especially 1-2mm
Since a micro electronic component 3 having a width of about 100 lbs. is coated in an arc shape, if the minimum coating size at both ends meets a predetermined standard dimension, the tip of the coated part protruding in an arc shape will adhere and support the electronic component 3. The electrically conductive paste 6 adheres to the holder 1 which is attached to the holder 1, causing a problem of staining the central surfaces of the holder 1 and the electronic component 3.

An object of the present invention is to provide an apparatus for coating external electrodes of electronic components that overcomes the above-mentioned drawbacks of the prior art.

According to the present invention, a vibration feeding mechanism includes a first guide plate having a plurality of rows of grooves mounted on a vibrate feeder along the component feeding direction;
A second guide plate adjacent to the groove of the first guide plate at the same height, a stopper reciprocating on the second guide plate, and a stopper located slightly near the exit in the feeding direction from the center of the first guide plate. Vacuum suction holes are provided in the grooves of the first guide plate at positions corresponding to the lowered positions of the first chip holding plate and the second chip holding plate, which can be moved up and down to a height several mm above the surface of the first guide plate. a chip pushing pin that moves back and forth and up and down from near the exit of the first guide plate to the stopper position, and whose tip moves back and forth by the stroke of the compression spring; and a second guide plate that moves from above in front of the stopper. , an alignment chuck having a holder support that moves up and down on the surface, and a holder mounting block that can move left and right and repeatedly rotate through 180 degrees by rotating a square threaded bar in the next stage; An external electrode coating device for electronic components, characterized in that an external electrode coating section is provided that has an external electrode coating roller that is positioned perpendicularly to the holder near the tip of the holder and rotates in the same direction at a synchronous speed as the holder mounting block. is obtained.

The present invention will be explained below with reference to FIGS. 4, 5 and 6.

FIG. 4 shows a side sectional view of the alignment section and chuck section of the device of the present invention.

First, the vibration feeding mechanism of the alignment section A will be explained.

Vibrate feeder 17 of electronic components 3 from the right
A first guide plate 8 adjacent to the supply plate 26 has a plurality of rows of grooves matching the external width of the plate-shaped electronic component 3 and an electronic component 3 covering approximately two-thirds of the first guide plate 8. A cover 18 is installed to maintain the delivery gap.

Next, the stopper section of the alignment section A will be explained.

The second guide plate 14 is installed adjacent to the left side with the groove of the first guide plate 8 aligned in position and height, and a slight gap is provided. A stopper 15 is placed on the second guide plate so as to fit into the groove and move back and forth.

Next, the gate mechanism at the center of the alignment section A will be explained. The electronic component 3 that passes through the portion covered by the cover 18 from the supply plate 26 and is sent out slightly to the left of the center of the first guide plate 8 is held down from above, and moves up and down onto the surface of the first guide plate 8. A chip holding plate 9 (hereinafter referred to as the first holding plate) 9 is installed. This first presser plate 9
A second chip holding plate (hereinafter referred to as second holding plate) 10 that moves up and down in the same manner as the first holding plate 9 is installed two rows behind the electronic components 3 from the top. Rubber is pasted on the lower surface of this second presser plate 10 to soften the shock. A vacuum suction hole 11 is made in the groove of the first guide plate 8 at the position where the second presser plate 10 is lowered.

Next, the forced feeding mechanism at the center left of the alignment section A will be explained.

A tip push pin 12 that can move back and forth by the stroke of the compression spring corresponding to the plurality of rows of grooves in the first guide plate 8 and can move up and down in the grooves of the first guide plate 8 is attached to the first guide plate 8 and the second guide plate 8. It moves back and forth along the groove of the plate 14 from near the exit of the cover 18 to the stopper 15 position. The chip extrusion block 13 is moved to the first guide plate 8.
Set it on top. The outlet of the first guide plate 8 is shaped so that the tip presser pin 12 does not rotate and come out of the groove even if the tip presser pin 12 moves up and down or back and forth.

Next, the mechanism of the chuck portion B will be explained.

A holder support 16 is installed to clamp the holder of the electronic component 3 that moves up and down from an upper position in front of the stopper 15 to above the surface of the second guide plate 14.

FIG. 5 and FIG. 6 are a side view and a front view showing the external electrode coating section C.

A bar 21 that rotates in forward and reverse directions and has square threads cut across its entire length in a position different from the alignment part A and chuck part B in FIG. 4 is fitted with a female screw installed in the holder mounting block 19. . Further, this holder mounting block 19 is provided with a mechanism (not shown) that can repeatedly rotate it through 180 degrees around the bar 21. The center of the electronic component 3 attached via an adhesive applied to the side end surface of the holder 1 held by the holder 16 is aligned with the center of the circumferential groove of the application roller 22 of the electronic component external electrode, and The height-adjustable coating rollers 22 are set on both sides of the bar 21 so that the distance between the end surface 3a of the electrode of the electronic component 3 and the circumferential groove 22a of the coating roller 22 is about 0.5 mm. As shown in Fig. 6, when the applicator roller 22 rotates in the forward direction as shown by the arrow, it rotates so as to match the moving speed of the holder mounting block 19, and in the opposite direction, it is prevented from rotating by a cam clutch. shall be. The tank 24 containing the conductive paste 25 is coated with an application roller 22 from the open side of the top of the tank 24.
The height of the tank 24 is adjusted and installed at a position where the conductive paste 25 can be sufficiently immersed in the conductive paste 25. The scraper 23 is arranged so as to be pressed by a spring against the outer peripheral contact point of the application roller 22 in the vertical line direction.

Next, the operation of the external electrode coating apparatus for electronic components according to the present invention will be explained.

First, the second chip holding plate 10 and the chip pushing block 13 of the alignment section A and the chuck section B are
Then, the electronic component 3 is fed onto the supply plate 26 of the electronic component 3 with the holder support 16 pulled upward and the first chip presser plate 9 lowered. The electronic component 3 moves straight to the left due to the vibration feeding of the vibrate feeder 17, and is moved straight to the left by the vibration feeding of the vibrate feeder 17.
The first chip holding plate 9 is located at the front row along the groove.
Proceed to a position where it can be stopped. Next, the second chip holding plate 10 is lowered to a position where it presses the top surface of the chip-shaped electronic component 3, and the electronic component
The first chip holding plate 9 is released upward while the electronic components 3 in the second row from the front row are sucked and held by applying a negative pressure to the lower surface of the chip. Therefore, electronic components 3 in the front row
only is sent to the exit at the left end of the first guide plate 8. Next, the upper chip extrusion block 1
3 is lowered and brought forward with the electronic component 3 being pressed against the stopper 15 by the force of the compression spring of the chip push pin 12. Next, attach the electronic component 3 to the stopper 15.
and the holder 1 while being held between the tip push pins 12.
The holder support 16 holding the holder 1 with adhesive adhered to the lower end surface is lowered until the lower end surface of the holder 1 presses against the upper surface of the electronic component 3.
At this time, the position of the stopper 15 is adjusted in advance so that the lower end surface of the holder 1 comes into contact with the center of the electronic component 3. After that, the chip push-out block 13 is lowered backward to release the electronic component 3 from being pressed, and when the holder support 16 is lifted up, the electronic component 3 is stuck in a suspended state due to the adhesive applied to the lower end of the holder 1. The parts 3 are obtained by being arranged at predetermined intervals. Next, the holder 1 with the electronic components 3 aligned and chucked is gripped again with the second holder support 20 attached to the holder mounting block 19 of the external electrode application section C provided in the alignment section A and the chuck section B, and external electrode application is applied. Move to part C.
Next, by rotating the bar 21 in the forward direction (clockwise), the holder mounting block 19 advances while being held by the rotating slider 27 with one side in contact with the bar 21 and the lower surface of the other side. At the same time, the external electrode coating roller 22 also rotates in the forward direction, causing the coating roller 22 immersed in the lower tank 24 to rotate in the forward direction.
The portion of the conductive paste 25 is pulled upwards, and the excess conductive paste is removed by a scraper 23 provided on the way, leaving the conductive paste with a uniform surface only in the grooves of the application roller 22, and the process further rises. In applying the external electrode to the electronic component 3, the holder 1 to which the electronic component 3 is attached passes through the arcuate groove of the coating roller 22, whereby the external electrode is applied to one side of the electronic component 3. (Note that the desired dimension value for applying the external electrode can be obtained by adjusting the height of the application roller 22.) When the application of the external electrode on one side is completed, move the holder mounting block 19 to the bar 2.
The external electrode is applied using the external electrode applying roller 22', which is rotated 180 degrees around 1 and placed side by side with the other electrode surface on the opposite side, in the same manner as in the above-mentioned application method.

As described above, since the electrode coated surfaces are brought into contact in synchronization as in the present invention, (i) multiple electronic components are aligned one row at a time and are held individually with high precision; Stable external electrode coating is possible.

(ii) The application surface, which was convex due to pressure application as in conventional equipment, has been resolved so that the application is applied straight, and the application size is less than the specified size.
Also, there is no problem of the conductive paste adhering to the holder, and this also ensures uniform and stable application of the external electrode.

There are effects such as

[Brief explanation of the drawing]

FIG. 1 is a perspective view of the alignment section and chuck section of a conventional electronic component. FIG. 2 shows a conventional external electrode coating means, and FIG. 3 shows a top view of the state after coating. FIG. 4 is a side sectional view of the alignment section and chuck section of the device of the present invention. FIG. 5 and FIG. 6 are a side view and a front view, respectively, of the external electrode coating section. 1... Holder, 2... Alignment jig, 3... Electronic components, 4... Roller, 5... Coating source adjustment plate, 6
...Conductive paste, 7...Applying surface of external electrode, 8
...First guide plate, 9...First chip holding plate, 10...Second chip holding plate, 1
1... Vacuum suction hole, 12... Chip push pin, 1
3... Chip extrusion block, 14... Second guide plate, 15... Stopper, 16... Holder support, 17... High rate feeder, 18... Cover, 19... Holder mounting block, 20... holder support, 21...bar,
22, 22, ... application roller, 23 ... scraper, 24 ... tank, 25 ... conductive paste, 26
...Supply plate, 27...Slider.

Claims (1)

[Scope of utility model registration request] a holder for holding central portions of a plurality of electronic components at predetermined intervals; a chuck mechanism for chucking the holder with the electronic components aligned and held; and a chuck mechanism for holding the plurality of electronic components at predetermined intervals. a moving mechanism that moves the electronic components in the alignment direction while keeping them aligned; and a moving mechanism that rotates in the same direction at a speed substantially synchronized with the moving speed of the electronic components to apply a conductor to one end of the electronic components. a first external electrode application roller, and the moving mechanism.
A rotation mechanism that rotates 180 degrees and the rotation mechanism
A second rotating mechanism rotates in the same direction at a speed substantially synchronized with the moving speed of the electronic component by the moving mechanism rotated by 180 degrees to apply a conductor to the other end of the electronic component.
1. An external electrode coating device for electronic components, comprising: an external electrode coating roller.