JPH01302171A - Probe card and measurement of part to be measured using the same - Google Patents

Abstract

PURPOSE:To obtain a probe card with an excellent characteristic, by burying a metal member with both ends thereof exposed from both faces of a holder to provide a holder made of an electrically insulating material with a wire pattern. CONSTITUTION:A probe card 200 has an electric connection member 125. The electric connection member 125 has a holder 111 made of an electrically insulating material as organic material and a metal member 107 buried in the holder 111 with one end of the metal member 107 exposed from one face of the holder 111 while the other end of the metal member 107 is exposed from the other face of the holder, but also has a wire pattern 300. Thus, a material is selected to reduce a noise as insulating body of the electric connection member 125 thereby enabling a reduction in an electromagnetic noise generated from a semiconductor element and a noise from an external field.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a probe card and a method for measuring a component to be measured using the probe card.

[Prior Art] Conventionally, the following technology is known as a technology related to a probe card for electrically measuring a component to be measured, for example, an electric circuit component.

(2) Probe Card Method FIGS. 8 and 9 show a conventional probe card and a method for measuring electric circuit components using the probe card, which will be explained below based on FIGS. 8 and 9.

The probe card 809 has needles 80 which are electrically conductive material.
3 so that the tip 804 of the needle 804 is located at the desired position.
03 to the circuit board 805 and the brazing material 808 and the fixing member 8.
06 (there is no fixing member in FIG. 9).

In FIG. 8, the fixing member 806 connects the needle 803 to the circuit board 805.
The brazing material 808 is only mechanically fixed to the needle 8.
03 and the connecting portion 807 of the circuit board 805 are mechanically fixed and electrically connected at the same time. In addition, in FIG. 9, the brazing material 808 is connected to the connecting portion 807 between the needle 803 and the circuit board 805.
mechanically and electrically connect the

Needle 80 of probe card 809 made in this way
The tip 804 of No. 3 is pressed against the connecting portion 802 of the semiconductor element 801, which is the object to be measured, by the force of the spring of the needle 803.
The tip 804 of the needle 803 is
In order to reduce the contact resistance between the connecting portion 802 of the semiconductor element 801 and the connecting portion 802 of the semiconductor element 801,
Even if there is an electrically insulating material such as an oxide film on the surface of 2, it is sharply processed into a needle shape so as to break through the electrically insulating material.

■Contact Spring Probe Method FIG. 10 shows a probe card using a contact spring probe and a method of measuring electric circuit components using the probe card, which will be explained below based on FIG.

The probe card 809 has a structure in which a contact spring probe 811 is fixedly supported on a plate 815 made of an electrically insulating material so that a tip 812 of the contact spring probe 811 made of an electrically conductive material is placed at a desired position.

The tips 812 of the contact spring probes 811 of the probe card 809 made in this manner are pressed against the connecting portions 814 of the circuit board 813 which is the object to be measured by the spring pressure of the contact spring probes 811 to make a measurement. .

[Problems to be Solved by the Invention] The conventional probe card described above has the following problems.

■Probe card method ■Minimum adjacent pitch of connection part 802 of semiconductor element 801 (
Minimum center-to-center path of adjacent connections l! lI) is an amount determined by the diameter and attachment of the probing portion 810 of the needle 803, such as the angle and direction, but the adjacent pitch of the connecting portion 802 of the semiconductor element 801 is less than that amount. During measurement, the adjacent blobbing parts 810 tend to come into contact with each other, making measurement difficult. Therefore, the semiconductor element 801
When the semiconductor element 801 is a multi-pin semiconductor element with narrow adjacent pitches of the connecting portions 802, the semiconductor element 801 is subject to design constraints.

■Connection part 802 of semiconductor element 801 to semiconductor element 801
If the needle is designed so that it is located inside the outer peripheral edge of the
The arrangement of the probing parts 810 of No. 3 becomes complicated, and therefore the attachment of the needle 803 to the connecting part 807 of the circuit board 805 becomes more complicated, and furthermore, the adjacent probing parts 810 tend to come into contact during measurement. , which was difficult to measure.

Therefore, the connection portion 802 of the semiconductor element 801 needs to be placed around the semiconductor element 801, and especially when the semiconductor element 801 is a multi-bin semiconductor element, the semiconductor element 801 is not subject to restrictions in circuit design. I didn't get it.

Further, a connection portion 802 is provided at the peripheral portion of the semiconductor element 80゛1.
It was difficult to simultaneously measure a plurality of semiconductor elements 801 having .

(2) In order to arrange the tips 804 of the plurality of needles 803 at desired positions, a complicated tool is required and the cost is high because it takes time.

■The same probe card 809 cannot be used for semiconductor elements in which the connection parts 802 of the semiconductor elements 801 are arranged differently.
Therefore, conventional probe cards lacked versatility.

(2) The force of the tip 804 of the needle 803 applied to the connecting portion 802 of the semiconductor element 801 is mainly a spring force due to shape deformation if each of the plurality of needles 803 is made of the same material. When the shape of the needle 803 differs, the force applied to the connecting portion 802 of the semiconductor element 801 differs, and the contact resistance value between the connecting portion 802 of the semiconductor element 801 and the tip 804 of the needle 803 tends to vary. Furthermore, if the forces are different, problems such as damage to the connecting portion 802 of the semiconductor element 801 tend to occur. Further, if the needle 803 is deformed excessively, there arises a problem that the shape of the needle 803 cannot be returned to its original shape.

(2) When the length of the needle 803 becomes longer, problems in electrical measurement tend to occur, such as an increase in electrical resistance and stray capacitance.

■Use the probe card 809 repeatedly to remove the needle 803.
If the tip 804 of the needle 803 is brought into contact with the connecting portion 802 of the semiconductor element 801 many times, the tip 804 of the needle 803 will wear out. If the tip 804 of the needle 803 is worn out and becomes unusable, it is necessary to take measures such as replacing the probe card 809 or replacing the needle 803, and it cannot be regenerated in its original state. Ta.

■Contact spring probe method 0 The minimum adjacent pitch of the connection parts 814 of the concave circuit board 813 (the minimum distance between the centers of adjacent connection parts 11t) is the 10th contact spring probe 811 arranged almost perpendicularly to the circuit board 813. In the case of the figure, it is 1.5 to 2 times the diameter of the contact spring probe 811 or the diameter of the tip 812, whichever is larger, and the circuit board 813
It was difficult to measure if the adjacent pitch of the connecting portions 814 was less than that value. Therefore, if the circuit board 813 is a multi-point circuit board with narrow adjacent pitches of the connecting portions 814, there are design restrictions.

(2) Also, since the diameter of the contact spring probe 811 or the diameter of the tip 812, whichever is larger, is at least about 0.5 mm, the adjacent pitch is 0.1 to 0.
It was difficult to blow a semiconductor element of about 3 mm.

(2) The same probe card 809 cannot be used for circuit boards 13 in which the connection portions 814 of the circuit boards 813 are arranged differently, and therefore, the conventional probe card 809 lacks versatility.

(2) If the probe card 809 is used repeatedly and the tip 812 of the contact spring probe 811 is brought into contact with the connecting portion 814 of the circuit board 813 many times, the tip 812 of the contact spring probe 811 will wear out. If the tip 812 of the contact spring probe 811 is worn out and becomes unusable, it is necessary to take measures such as replacing the probe card 809 or the contact spring probe 811. I wonder if playback will work.

(The following is a blank space) [Means for solving the problem] The first gist of the present invention is to have a holding body made of an electrically insulating material, and a plurality of metal members embedded in the holding body,
One end of the metal member is exposed on one surface of the holder, the other end of the metal member is exposed on the other surface of the holder, and the holder has a wiring pattern. A probe card characterized by having at least the following: an electrical connection member;

A second aspect of the present invention includes a holder made of an electrically insulating material and a plurality of metal members embedded in the holder,
two or more electrical connection members, one end of the metal member being exposed on one surface of the holder, and the other end of the metal member being exposed on the other surface of the holder; The probe card has a wiring pattern on the holder of at least one electrical connection member, and the two or more electrical connection members are laminated to form one laminated electrical connection member. At least one electrical connection member and at least one other electrical connection member are formed by metallizing and/or alloying at least one or more of the connection parts of the respective metal members or wiring patterns. Located on a probe card that is characterized by being connected.

A third aspect of the present invention includes a holder made of an electrically insulating material and a plurality of metal members embedded in the holder,
One end of the metal member is exposed on one surface of the holder, the other end of the metal member is exposed on the other surface of the holder, and the holder has a wiring pattern. electrically connecting at least one or more parts to be measured having at least one or more connection parts to the metal member exposed on the surface of the holder of the probe card having at least an electrical connection member; A method for measuring a part to be measured, characterized in that the electrical characteristics of the part to be measured are measured using a method of measuring the part to be measured.

A fourth aspect of the present invention includes a holder made of an electrically insulating material and a plurality of metal members embedded in the holder,
Two or more electrical connection members, one end of the metal member being exposed on one surface of the holder, and the other end of the metal member being exposed on the other surface of the holder: The probe card has a wiring pattern on the holder of at least one electrical connection member, and the two or more electrical connection members are laminated to form one laminated electrical connection member. At least one electrical connection member and at least one other electrical connection member are formed by metallizing and/or alloying at least one or more of the connection parts of the respective metal members or wiring patterns. At least one or more parts to be measured having at least one or more connection parts are electrically connected to the metal member exposed on the surface of the holder of the connected probe card. A method for measuring a component to be measured, which is characterized by measuring electrical characteristics.

The fifth gist of the present invention is that in the first gist of the present invention,
The wiring pattern included in the electrical connection member is located on a probe card provided on at least one surface of the holder.

The sixth gist of the present invention is the second gist of the present invention,
The wiring pattern included in the electrical connection member is on a probe card provided on at least one surface of the holder of the at least one electrical connection member.

The seventh gist of the present invention is, in the third gist of the present invention,
The wiring pattern provided on the electrical connection member is used to measure the component to be measured using a probe card provided on at least one surface of the holder.

The eighth gist of the present invention is the fourth gist of the present invention,
The wiring pattern provided on the electrical connection member is a method of measuring a component to be measured using a probe card provided on at least one surface of the holder of at least one electrical connection member.

The ninth gist of the present invention is that at least one of the first gist, second gist, fifth gist, or sixth gist of the present invention
The metal member of the electrical connection member to which the above-mentioned parts to be measured are electrically connected is provided in the probe card, which is formed in a convex shape from the surface of the holder.

The tenth aspect of the present invention is the electrical connection in which at least one or more parts to be measured are electrically connected in the third, fourth, seventh, or eighth aspect of the present invention. There is a method of measuring a part to be measured using a probe card in which the metal part of the member is formed in a convex shape from the surface of the holder.

The constituent elements of the present invention will be individually explained below.

(Electrical Connection Member) The electrical connection member according to the present invention has a plurality of metal members embedded in a holder made of an electrically insulating material and has a wiring pattern. Further, the electrical connection member of the present invention may be a single sheet or two or more sheets.

First, in the case of one sheet, the metal members are exposed on both sides of the holder and have a wiring pattern. The individual buried metal members and the wiring pattern may or may not be electrically connected. Further, the electrical connection may be made inside the holder or on one or both surfaces of the holder, although the latter is easier to manufacture.

Next, in the case of two or more electrical connection members, a plurality of metal members are embedded in a holder made of an electrically insulating material, and the metal members are exposed on both sides of the holder. An electrical connection member having a wiring pattern is laminated on at least one surface of at least one holder of the electrical connection member, and one or more connection portions of one or both of the metal member or the wiring pattern of the electrical connection member and another electrical connection member. One or more connecting portions of one or both of the metal members or wiring patterns are connected by metallization and/or alloying. The individual buried metal members and the wiring pattern may or may not be electrically connected.

The holder materials of the plurality of electrical connection members to be stacked may be the same or different. Further, the metal members may be of the same type or may be of different types.

It is preferable that the surfaces of the plurality of stacked electrical connection members other than the connecting portions be joined by adhesive, fusion, etc. in order to reinforce the connecting portions.

Further, it is easier to connect the electrical connection members when the connection portions are convex.

Furthermore, although the electrical connection member is multilayered with two or more layers, if the sizes of the plurality of electrical connection members are different, there may be a partial single layer portion.

It is preferable that the metal member to which at least one or more measured parts of one or more electrical connection members is electrically connected is formed in a convex shape than the surface of the holder.

When the metal member or holder touches a surface other than the connecting portion of the part to be measured, it is preferable to use a material as soft as possible for the metal member or holder in order to prevent harm to the part to be measured.

Further, in the laminated electrical connection member, an electrically insulating material may be attached or applied to a location other than the exposed connection portion with the electrical circuit component to provide electrical insulation.

Furthermore, the material of the wiring pattern is not limited to a metal material, and may be any other conductive material.

(Metal member) The metal member is generally a metal material, but other than metal materials, it may also be a material exhibiting superconductivity.

As the material of the metal member, the metal material of the part connected to the part to be measured is preferably gold, which is highly wear-resistant.
Any metal or alloy can also be used. For example, Au, Ag, Mn.

Cr, Nb, Zr, Mg, Mo, Ni, W.

Fe, Ti, In, Ta, Zn, Cu, An.

Examples include metals or alloys such as Sn and Pb-5n.

In addition, the metal member and the alloy member may include the same type of metal or different types of metal in the same electrical connection member. Furthermore, one of the metal members and alloy members of the electrical connection member may be made of the same metal or alloy, or may be made of different metals or alloys.

Furthermore, the cross section of the metal member can be circular, square, or any other shape.

Further, the thickness of the metal member is not particularly limited. In consideration of the pitch of the connecting portions of the electric circuit members, the pitch may be set to, for example, 20 μm or more or 201.1 mφ or less.

Note that the exposed portion of the metal member may be on the same surface as the holder, or may be made to protrude from the surface of the holder.This protrusion may be on only one side or on both sides. It may be in the shape of a bump, but it is preferable that the connecting portion be convex.

In addition, the metal member does not need to be arranged vertically in the holder;
It may run obliquely from one side of the holder to the other side of the holder.

Further, the shape of the metal member exposed on the side of the part to be measured (which becomes the tip of the probe) may be needle-shaped with an acute angle, or may have a plurality of acute angles, or may have any shape.

Desirably, the shape is such that the contact resistance is small without causing damage to both.

(Holding body) The holder is made of electrically insulating material.

Any electrically insulating material may be used.

Examples of electrically insulating materials include organic materials and inorganic materials. It may also be a metal or alloy material that has been treated so that the metal members are electrically insulated from each other.Furthermore, the organic material may have a desired shape such as powder, fiber, plate-shaped body, rod-shaped body, ring-shaped body, etc. One or more of inorganic materials, metal materials, and alloy materials may be dispersed and held. Furthermore, one or more of organic materials, metal materials, and alloy materials having a desired shape such as powder, fibers, plate-like bodies, rod-like bodies, and annular bodies may be dispersed in the inorganic material. good. Also,
One or more kinds of inorganic materials or organic materials having a desired shape such as powder, fiber, plate-like material, rod-like material, or annular material may be dispersed and held in the metal material. When the body is made of a metal material, for example, an electrically insulating material such as resin may be provided between the metal member and the holding body.

Here, as the organic material, for example, an insulating resin may be used, and the resin may be any of thermosetting resin, ultraviolet curing resin, and thermosetting resin.For example, polyimide resin, polyphenylene sulfide resin, Polyether sulfone resin, polyetherimide resin, polystyrene resin, fluororesin, polycarbonate resin, polydiphenyl ether resin, polybenzylimidazole resin, polyamideimide resin, polypropylene/resin,
Polyvinyl chloride resin, polystyrene resin, methyl methacrylate resin, polyphenylene oxide resin, phenol resin, melanin resin, epoxy resin, urea resin, methacrylic resin, vinylidene chloride resin, alkyd resin, silicone resin and other resins can be used. .

Among these resins, it is more preferable to use a resin with good thermal conductivity because even if the semiconductor element has heat, the heat can be radiated through the resin.

In addition, specific examples of metal materials and alloy materials include, for example,
Ag, Cu, Au, All, Be, Ca.

Mg, Mo, Fe, Ni, St, Co, Mn.

W, Cr, Nb, Zr, Ti, Ta, Zn.

Examples include metals or alloys such as Sn and Pb-5n.

Examples of inorganic materials include 5in2°B20s, A
j2203, Na20. 20°Cab, ZnO, B
ad, pbo, Sb203°As203, La20.
,' ZrO2, Bad.

P20S, Ti02, MgO, SiC,
Bed.

BP, BN, AftN, B4 C, TaC, T
i B2°CrB, , TiN, St, N4. Ta2 o
, ceramic, diamond, glass, carbon, etc.
Examples include boron and other inorganic materials.

The size and shape of the powder and fibers to be dispersed, as well as the position and quantity of the dispersed particles in the insulator, must be within a range that does not cause contact or short circuit between the metal parts embedded in the insulator due to the powder or fibers. If so, it is optional. However, the size of the powder and fibers is preferably smaller than the distance between adjacent metal members. That is, it is preferable that the metal members do not come into contact with each other even through powder or fibers. Further, the powder and fibers may or may not be exposed to the outside of the insulator. Further, the powder and fibers may or may not be in contact with each other.

(Connection; Connection by metallization and/or alloying) When there are two or more electrical connection members, the connections between the connecting parts of the electrical connection members are made by metallization and/or alloying. The connection may be between metal members, between a metal member and a wiring pattern, or between wiring patterns. Connection by metallization and/or alloying causes the metals to diffuse into each other, and if the metals are of the same type, the same type of crystal structure is obtained, and if the metals of the different types are different, a solid solution, an intermetallic compound, etc. are formed.

Next, the above connection will be described.

When the metal member to be connected and the connection portion are made of the same type of pure metal, the connection layer formed by metallization has the same type of crystal structure as the metal member or the connection portion. Note that, as a method of metallization, for example, an end of a metal member and a connecting portion corresponding to the end may be brought into contact with each other, and then heated to an appropriate temperature.

The heating causes diffusion of atoms in the vicinity of the contact portion, and the diffusion portion becomes metalized to form a connection layer.

When the metal member to be connected and the connecting portion are made of different types of pure metals, the connecting layer to be formed is made of an alloy of both metals. As a method for alloying, for example, an end of a metal member and a connecting portion corresponding to the end may be brought into contact with each other, and then heated to an appropriate temperature. The heating causes diffusion of atoms in the vicinity of the contact portion, and a layer made of a solid solution or an intermetallic compound is formed in the vicinity of the contact portion.

In addition, when Au or Al1 is used for the metal member, 2
A heating temperature of 00 to 350°C is preferred.

When one of the metal members to be connected and the connecting portion is made of a pure metal and the other is made of an alloy, or when both are made of the same or different types of alloys, the connecting interface is made of an alloy.

Regarding multiple metal members in one electrical connection member, if each metal member is made of the same kind of metal or alloy, if each is made of different kinds of metal or alloy, or if one metal member is made of different kinds of metal or alloy, The above-mentioned metallization or alloying is performed in cases where the members are made of the same kind of metal or alloy, different kinds of metal or alloy, or in other cases.

As a heating method, in addition to methods such as thermocompression bonding, internal heating methods such as ultrasonic heating method, high frequency induction heating method, high frequency dielectric heating method, microwave heating method, etc., and other external heating methods may be used. Either of the heating methods may be used in combination to directly or indirectly heat the connection part to connect.

In the case of a metal member and a wiring pattern, the connecting part between the wiring patterns may be made of metal or an alloy at the contact part between the two, and the other parts may be made of metal mixed with an inorganic material such as glass. It may be in a state where an organic material such as a resin is mixed with metal. Furthermore, a plating layer made of a metal or alloy that is easily alloyed may be provided on the surface of the portion to be connected.

Furthermore, there are methods such as soft brazing and hard brazing, such as brazing and soldering. In order to facilitate metal connection, the connection portion may be subjected to treatments such as plating or cladding.

(Parts to be measured) Examples of parts to be measured that can be measured by the present invention include:
Examples include semiconductor elements, circuit boards such as resin circuit boards, ceramic boards, metal boards, and silicon boards, and lead frames.

Further, one or a combination of two or more of these parts to be measured may be used.

The part to be measured that is the object of measurement in the present invention is a part having a connection part. Although the number of connection parts does not matter, the greater the number of connection parts, the more remarkable the effects of the present invention will be. Further, although the location of the connection portion does not matter, the effect of the present invention becomes more pronounced as the connection portion is located inside the component to be measured.

Note that the connecting portion is an electrically conductive member.

[Function] In the present invention, a part to be measured is measured using a probe card, which is an electrical connection member as described above. Since the pitch of the metal members of the connection member can be narrowed, the number of connection parts can be increased, and it is possible to measure electrical circuit components having multiple pin connection points.

According to the present invention, at least the electrical connection member is a probe card, and the electrical connection member can be manufactured easily and cheaply into a high-density multi-bin structure, so that a probe card suitable for high-density multi-bins can be produced inexpensively and easily. can be provided to

Further, since the insulating material is present even near the tip of the metal member of the electrical connection member exposed to the part to be measured, it is easy to arrange the tip at a desired position. Furthermore, since the shape of the tip is shaped like a gap, substantially the same force is applied to the plurality of connecting portions of the part to be measured, making it possible to perform stable measurements without harming both.

Furthermore, in the present invention, by making the pitch of the metal members of the electrical connection member narrower than the pitch of the connection parts of the part to be measured, the connection parts of the part to be measured can also be used for other electrical circuit parts that indicate the open position. measurement, increasing the versatility of the probe card.

Furthermore, it is also possible to use wire bonding, TAB, and CCB connections for the parts to be measured.

In addition, the electrical connection member can be made thinner, and the shorter the length of the metal member of the electrical connection member, the lower the electrical resistance value and the reduced stray capacitance, which is advantageous for electrical measurements. .

Furthermore, even if the metal member of the electrical connection member wears out, it can be regenerated.

Furthermore, by selecting a material that reduces noise as the insulator of the electrical connection member, it is possible to reduce the noise that enters the semiconductor element from the outside world, and it also becomes possible to reduce the electromagnetic noise that is emitted from the semiconductor element to the outside world.

Furthermore, if an insulator with good thermal conductivity is selected for the electrical connection member, even if the semiconductor element has heat, the heat can be dissipated more quickly, resulting in a probe card with good heat dissipation characteristics. It will be done.

(Margin below) [Example] (First Example) A first example of the present invention will be described based on FIGS. 1(a) to (C) and FIGS. 2(a) to (C).

The probe card 200 according to this embodiment includes an electrical connection member 125. The electrical connection member 125 connects the holder 111 and the holder 1 made of an electrically insulating organic material.
11, one end of the metal member 107 is exposed on one surface of the holder 111, and the other end of the metal member 107 is exposed on the other surface of the holder 111. and has a wiring pattern 300.

This example will be explained in more detail below.

First, the electrical connection member 125 will be explained by explaining one manufacturing example of the electrical connection member 125.

A manufacturing example is shown in FIGS. 2(a) to 2(C).

First, as shown in FIG. 2(a), a solder-plated metal wire 121 of 20 μm diameter made of metal or alloy such as W is wound around a rod 122 at a pitch of 40 μm.
After wrapping, the metal wire 121 is embedded in a resin 123 such as polyimide.

Before embedding, a powder of 5 iOz is mixed in the resin 123 in advance. After embedding, the resin 123 is cured. The cured resin 123 becomes an insulator. Thereafter, it is sliced at the dotted line 124 to produce an electrical connection member 125. FIGS. 2(b) and 2(c) show a perspective view and a cross-sectional view of the electrical connection member 125 manufactured in this way.
Shown below.

In the electrical connection member 125 produced in this way,
The metal wire 121 constitutes the metal member 107, and the resin 123 constitutes the holder (insulator) 111.

In this electrical connection member 125, metal wires 121 serving as metal members are electrically insulated from each other by resin 123.

In this example, the end of the metal wire 121 exposed on the side of the part to be measured is shaped like a point. In order to obtain the pointed shape, approximately 10 μm of the surface of the resin 123 facing the part to be measured is removed by etching using a resin etching material, and the metal wire is made to protrude (see Fig. 3(a)). , (b)) Furthermore, this protruding metal wire may be etched using a metal etching material (FIG. 4).

In this embodiment, one end of the metal wire was made to protrude in a pointed shape toward the part to be measured, but it may be made to protrude from both sides, or both protrusions may be made into a pointed shape.

Further, in this embodiment, the amount of protrusion of the metal wire 121 was set to 10 μm, but the amount of protrusion may be any amount.

Furthermore, the method for making the metal wire 121 protrude is not limited to etching, and other chemical or mechanical methods may be used.

After that, in order to create a wiring pattern 300 on the electrical connection member 125, copper is applied by vapor deposition or sputtering, and patterned by etching unnecessary parts.
Add more gold plating. In order to form the wiring patterns shown in FIGS. 3(a), (b) and 4 using the electrical connection member 125 produced in this way, copper is deposited and patterned, and then gold plating is applied. Although it has been mentioned that it is attached, it may be done using a method other than this method.

Note that the electrical connection member 125 has wiring patterns 300 on both sides of the holder 111.

Furthermore, a reinforcing plate 305 is provided on the side of the holder opposite to the side where the electrical connection portion of the metal member 107 is made into a pointed shape.
was attached to form a probe card 200 (Fig. 1(a)
), (b)) Here, the pointed portion serves as a connection portion for electrically connecting to the component to be measured.

In addition, in the case of this embodiment, the plate 305 was attached, but the plate 3
The probe card 200 may be made with only the electrical connection member 125 without attaching the probe 05.

Next, the probe card 200 produced as described above
Figure 1 (C) shows the method for measuring the electrical characteristics of the part under test.
Based on the following.

In this example, a semiconductor element 101 was prepared as the component to be measured. In this semiconductor element 101, connection portions are arranged at a pitch of 40 μm.

Connection portion 105 of semiconductor element 101 and electrical connection member 1
After positioning, the connecting portion 105 of the semiconductor element 101 (made of Al1 in this example) and the connecting portion 109 of the electrical connecting member 125 (made of W (Fig. 1(c)), and the electrical characteristics were measured. Note that the connection in this case is a temporary connection and can be detached after the measurement is completed.

In this example, measurements were repeated while repeatedly attaching and detaching the semiconductor element 101 to and from the probe card, but there was little wear on the metal members. In addition, we were able to measure electrical characteristics extremely accurately.

(Second example) FIG. 5 shows a second embodiment.

In the second embodiment, three electrical connection members each having a wiring pattern on both sides are laminated, and each member is metallized and/or alloyed (brazed in this embodiment) to connect them. This is a probe card with a board attached to it. Furthermore, this probe card is a probe card that can simultaneously measure two different semiconductor devices.

The manufacturing method of the electrical connection members 125, 128, and 129 is the same as that of the first embodiment, but the electrical connection member 129 does not have a metal member in a pointed shape, but is made in the state shown in FIGS. 3(a) and 3(b). I used something. Further, the difference from the first embodiment is the size of the electrical connection member, the arrangement and quantity of the metal wires 121, and the wiring pattern 300. Furthermore, the electrical connection member 125°12
As the metal wire 121 of No. 8, a W solder-plated wire was used. Further, the metal wire 121 of the electrical connection member 129 is C
A solder-plated one was used for u. After the three electrical connection members 125, 128° and 129 were positioned, their connecting portions were connected to each other by soldering.

It should be noted that the wiring pattern 300 has an insulating film except for the connecting portions, so that they are not electrically connected to each other when stacked. Furthermore, the parts other than the laminated connection parts were bonded with adhesive.

This embodiment also has a reinforcing plate 305 similar to the first embodiment.
was pasted on the probe card 200.

This embodiment allows two different semiconductor devices to be measured simultaneously. That is, the electrical connection members 125 and 1
Each of the pointed portions 28 is electrically connected to a connection portion of a different semiconductor element 101, and the electrical characteristics are measured. Other points are similar to the first embodiment.

In this example, the measurement was repeated while the semiconductor element 101 was repeatedly attached and detached from the probe card, but the wear of the metal member was small. Furthermore, we were able to measure the electrical characteristics extremely accurately.

(Third example) FIG. 6 shows a probe card used in the third embodiment.

FIG. 6(a) is a cross-sectional view of the electrical connection member during manufacture, and FIG. 6(b) is the above-mentioned cross-sectional view.

A hole 142 having a diameter larger than 20 μmφ is drilled in advance in the holder 126 made of alumina ceramic. Next, a metal wire 121 made of a metal such as Au or an alloy with a diameter of 20 μm is passed through the hole 142, and the resin 123 is attached to the holder 126.
and the metal wire 121, and the resin 123 is cured. The hardened resin 123 becomes an inclusion. Thereafter, the metal wire 121 is sliced at the dotted line 124 to produce an electrical connection member 125.

Further, the electrical connection member of this example may be processed, for example, by changing the cutting position of the metal wire 121, and as shown in FIGS. 3(a) and (b).
A protrusion may be provided as shown in FIG. 4, or a pointed shape may be provided as shown in FIG.

After that, a wiring pattern 300 is provided, and the probe card 2
It was set as 00.

Other points are similar to the first embodiment.

In this example as well, the electrical characteristics could be measured extremely accurately. Furthermore, the reliability of various characteristics was also excellent.

(Fourth example) FIG. 7 shows a fourth embodiment.

In this embodiment, the electrical connection member 125 is different from the electrical connection member shown in the first embodiment. That is, in the electrical connection member 125 of this example, the pitch between the metal members 107 is narrower than that shown in the first example. Also,
In this example, the pitch between the metal members 107 is set to be narrower than the interval between the connecting portions 105 of the semiconductor element 101, which is the component to be measured.

In other words, in the first embodiment, accurate positioning of the semiconductor element 101 and the electrical connection member 125 was required during measurement using the probe card, but in this embodiment, the connection dimension of the semiconductor element (P ll + d ++) By selecting appropriate values for the connection dimensions (P 12. d 12) of the electrical connection member and the electrical connection member, it is also possible to connect with substantially accurate positioning.

Other points are similar to the first embodiment.

In this example as well, the electrical characteristics could be measured extremely accurately.

[Effects of the Invention] By having the above configuration, the present invention has obtained the following numerous effects.

First, in the first aspect of the present invention, the following effects were obtained.

(Claims 1 to 10) Since blobbing can be performed no matter where the component to be measured, especially the connection part of the semiconductor element, is placed (especially inside), it can be It has become possible to blow a semiconductor device with several connection points, and we have been able to provide a probe card suitable for blowing with a large number of bins. Moreover, from the above, simultaneous multi-chip probing of semiconductor devices has become possible.

Furthermore, since there is an insulating material between adjacent metals of the electrical connection member, there is no conduction between the adjacent metal members even if the adjacent pitch is narrowed, making it possible to blow semiconductor devices at more points than with the CCB method. It became.

(Claims 1 to 10) Since the electrical connection member can be manufactured easily and at low cost in high-density multi-bin form, it becomes possible to provide a probe card suitable for high-density multi-pin at low cost and easily. Ta.

(Claims 1 to 10) The shape of the plurality of metal members exposed in the vicinity of the object to be measured of the electrical connection member is substantially concave, so that the force applied to the connection part of the object to be measured is reduced. A probe card was obtained which was substantially concave and could perform stable measurements without damaging the object to be measured. Furthermore, since the tip of the metal member can be easily placed at a desired position, any probe card can be manufactured at low cost.

(Claims 1 to 10) By reducing the thickness of the electrical connection member, the wiring length is shortened, thereby reducing electrical resistance, and further reducing stray capacitance and noise from the outside world. This has become advantageous in measuring the electrical characteristics of components to be measured such as semiconductor devices.

(Claim 9 and Claim 10) Even if the tip of the metal member of the electrical connection member is worn out, it can be regenerated, so a highly durable probe card was obtained.

■ (Claims 1 to 10) The electrical connection members of the probe card can be easily replaced.

(Claim 9 and Claim 10) The electrical connection member and the component to be measured can be more reliably connected, and the measurement can be performed better.

(Claims 1 to 10) During the manufacturing process, there is no need to use a jig or the like to hold and attach each metal member one by one, making it possible to simplify the process and shorten the manufacturing time. Ta.

(Claim 9 and Claim 10) The electrical connection member and the part to be measured can be connected more reliably, and measurements can be performed better.

[Phase] (Claims 1 to 10) Positioning during measurement is facilitated, substantially concave semiconductor elements, etc. can be measured with the same probe card, and further,
It is now possible to easily measure a plurality of semiconductor elements and the like at the same time, making it possible to improve the efficiency of measurement work.

0 (Claim 2.Claim 4.Claim 6゜Claim 8-Claim 10) By configuring a laminated electrical connection member, the electrical characteristics of a plurality of components to be measured such as a plurality of semiconductor devices can be simultaneously measured. It became possible. This also simplifies measurement work,
Efficiency has become even more possible.

@ (Claim 2.Claim 4.Claim 6゜Claims 8 to 10) The electrical connection members can be reliably connected to each other by metallization and/or alloying, thereby preventing electrical defects and contact. It has become possible to significantly reduce resistance, and it has also become possible to obtain a robust probe card with strong mechanical strength. Furthermore, this also facilitates management and handling after fabrication, making it possible to further simplify and improve the efficiency of measurement work.

Note that the following effects were obtained with the embodiment of the present invention.

■By selecting a material that reduces noise for the insulator of the electrical connection member, it is possible to reduce electromagnetic noise generated from semiconductor elements and noise from the outside world, making it possible to obtain a probe card with excellent characteristics. Ta.

■By selecting a material with good thermal conductivity for the insulator of the electrical connection member, it has become possible to quickly dissipate the heat generated from the semiconductor element during measurement.

■ By setting the pitch between the metal members of the electrical connection member to be narrower than the interval between the connection parts of the parts to be measured such as semiconductor elements, it is possible to connect with almost accurate positioning, simplifying the measurement work. It has become possible to improve efficiency and efficiency.

[Brief explanation of the drawing]

FIGS. 1(a) to (C) show a first embodiment of the present invention, with FIG. 1(a) being a perspective view and FIG. 1(b) being a perspective view. (C) is a sectional view. Figure 2 (a) to (C), Figure 3 (a), (b) and Figure 4
The figures show an example of manufacturing an electrical connection member used in the first embodiment of the present invention, where FIG. 2(a) is a perspective sectional view, FIG. 2(b) is a perspective view, and FIG. 2(C) is a cross-sectional view. 3(a) is a perspective view, FIG. 3(b) is a sectional view, and FIG. 4 is a sectional view. FIG. 5 is a sectional view showing a second embodiment of the present invention. 6(a) and 6(b) show a third embodiment of the present invention, FIG. 6(a) is a sectional view during manufacture, and FIG. 6(b) is a sectional view. FIG. 7 is a sectional view showing a fourth embodiment of the present invention. FIGS. 8 to 10 are cross-sectional views showing conventional examples. 101.801...Semiconductor element, 105°108.1
09,802,807,814...Connection part, 107・
...metal member, 111...holding body (insulator), 121
...metal wire, 122...rod, 123...resin, 1
24... Dotted line, 125, 128, 129... Electrical connection member, 126... Holder, 142... Hole, 20
0.809...Probe card, 230°808...
・Brazing metal, 300...Wiring pattern, 305.815
... Plate, 803 ... Needle, 804° 812 ... Tip part, 805,813 ... Circuit board, 806 ... Fixing member, 810 ... Blobbing part, 811 ... Contact spring probe. Figure 1 (a) Figure 6 (0) Figure 6 (b) Figure 7 Figure 10 a+q 813

Claims (10)

[Claims] (1) It has a holder made of an electrically insulating material and a plurality of metal members embedded in the holder, one end of which is exposed on one surface of the holder, and 1. A probe card comprising at least the following: an electrical connection member having the other end of the metal member exposed on the other surface of the holder and having a wiring pattern on the holder. (2) It has a holder made of an electrically insulating material and a plurality of metal members embedded in the holder, one end of which is exposed on one surface of the holder, and , two or more electrical connection members whose other ends are exposed on the other surface of the holder; a wiring pattern on the holder of at least one electrical connection member; The two or more electrical connection members are laminated to form one laminated electrical connection member, and at least one electrical connection member and at least one other electrical connection member are connected to each other. A probe card characterized in that the probe cards are connected to each other by metallizing and/or alloying at least one or more connecting portions of the respective metal members or wiring patterns. (3) A holder made of an electrically insulating material and a plurality of metal members embedded in the holder, one end of which is exposed on one surface of the holder, and , the other end of the metal member is exposed on the other surface of the holder, and an electrical connection member having a wiring pattern on the holder; A part to be measured, characterized in that the electrical characteristics of the part to be measured are measured by electrically connecting at least one part to be measured having at least one or more connection parts to the exposed metal member. measurement method. (4) A holder made of an electrically insulating material and a plurality of metal members embedded in the holder, one end of which is exposed on one surface of the holder, and , two or more electrical connection members whose other ends are exposed on the other surface of the holder, the probe card having a wiring pattern on the holder of at least one electrical connection member. The two or more electrical connection members are laminated to form one laminated electrical connection member, and at least one electrical connection member and at least one other electrical connection member are connected to each other. The metal exposed on the surface of the holder of the probe card, which is connected by metallizing and/or alloying at least one connecting portion of each metal member or wiring pattern. A method for measuring a part to be measured, comprising electrically connecting at least one part to be measured having at least one connection part to a member and measuring the electrical characteristics of the part to be measured. (5) The probe card according to claim 1, wherein the wiring pattern included in the electrical connection member is provided on at least one surface of the holder. (6) The probe card according to claim 2, wherein the wiring pattern included in the electrical connection member is provided on at least one surface of the holder of at least one electrical connection member. (7) A method for measuring a component to be measured using a probe card according to claim 3, wherein the wiring pattern included in the electrical connection member is provided on at least one surface of the holder. (8) A component to be measured using the probe card according to claim 4, wherein the wiring pattern included in the electrical connection member is provided on at least one surface of the holder of at least one electrical connection member. measurement method. (9) Claim 1, Claim 2, Claim 5, or Claim 6, wherein the metal member of the electrical connection member to which at least one or more parts to be measured is electrically connected is formed in a convex shape from the surface of the holder. The probe card according to any one of the above. (10) Claim 3, Claim 4, Claim 7, or Claim 8, wherein the metal part of the electrical connection member to which at least one or more parts to be measured is electrically connected is formed in a convex shape from the surface of the holder. A method for measuring a part to be measured using the probe card according to any one of the above.