JPH01296609A - Manufacture of solid electrolytic capacitor - Google Patents

Abstract

PURPOSE:To simplify the surface treatment work to be conducted on a cathode terminal by a method wherein a conductive film is provided on the whole surface of the cathode terminal without using a masking, and then high-pressure water is jetted on the part which becomes the connecting part with the cathode part of the main body of the capacitor of the conductive film. CONSTITUTION:A silver-plated layer 14 is formed by providing a silver-plating treatment on the lower surface of the tip part of a cathode terminal. Then, a solderable conductive film 15 is formed on the whole surface of the cathode terminal 7, including the silver-plated layer 14, and on the surface of an anode terminal 5. Subsequently, the conductive film 15 provided on the surface part of the silver-plated layer 14 of the cathode terminal 7 is stripped off by jetting high-pressure water on the film 15, and the surface of the silver-plated layer 14 is exposed. This work is conducted just before the cathode terminal 7 is connected to the cathode layer 8 of the capacitor main body 1 through the intermediary of a conductive bonding agent 13. As a result, the surface treatment work of the cathode terminal can be conducted in a simple manner.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method for manufacturing a solid electrolytic capacitor in which a capacitor body is molded with resin and an anode terminal and a cathode terminal protrude from the resin. .

<Prior art> An example of the conventional manufacturing method of the solid electrolytic capacitor described above is shown in the third example.
It is shown in FIG. As shown in FIG. 3(a), the capacitor body 1 is placed between the anode terminal 5 and the cathode terminal 7, which are protruded from opposite positions of the frame 12.12, which is a metal strip. do.

Note that both terminals 5.7 are subjected to surface treatment as described later. Then, the anode body 6 of the capacitor body l and the anode terminal 5 of the frame 12 are electrically connected by welding,
In addition, the cathode layer 8 of the capacitor body 1 and the cathode terminal 7 of the frame 12 are electrically connected via a conductive adhesive 13 such as silver paste or silver-copper paste, or by soldering. The entire outer surface of the capacitor body l and its anode body 6
The connecting portion between the anode terminal 5 and the cathode terminal 5, and the connecting portion between the cathode layer 8 and the cathode terminal 7 are integrally molded with resin 4, and then the anode terminal 5 and the cathode terminal 7 are attached to the frames 12 and 12, respectively. Cut the proximal end along the dashed lines indicated by B and C.

Surface treatment methods in the above-described solid electrolytic capacitor manufacturing method include, for example, a first method shown in FIG. 4 and a second method not shown.

In the first surface treatment method shown in FIG. 4, the surface of the cathode terminal 7 connected to the cathode layer 8 of the capacitor body 1 is applied to the anode terminal 5, cathode terminal 7, and frame 12 made of German silver, nickel, or copper. For example, silver plating is applied to the portion (the lower surface of the tip of the cathode terminal 7 shown in the figure). The silver plating layer 14 formed by this silver plating process is for improving the staining between the cathode terminal 7 and the conductive adhesive 13, and connects the cathode terminal 7 directly to the cathode layer 8 of the capacitor body l. This makes the electrical connection better than if it were made by using a wire (FIG. 4(a)). Next, an ultraviolet curable resin 16 is applied to the surface of this silver plating layer 14. Then, the silver plating layer 14 is masked by irradiating the resin 16 with light including ultraviolet rays and curing it.
b)). Furthermore, the frame 12, an anode and a cathode 1;
- A conductive:♂ radio wave film 15 (for example, a tin plating film) that is easily compatible with solder is formed on the entire surface of the element 5.7. However, since the silver plating layer 14 is masked by the resin 16, the conductive film 15 is not formed on the silver plating layer 14 (FIG. 4(C)). After this, the entire frame is immersed in an organic solvent to swell the resin 16 masking the silver plating layer 14 and peel it off (FIG. 4(d)).
). As a result, since a silver plating layer is formed at the connection portion of the cathode terminal 7 with the cathode layer 8 of the capacitor body 1, the cathode terminal 7 and the cathode layer 8 of the capacitor body 1 are well connected. In addition, the remaining part of the cathode terminal 7 and the entire surface of the anode terminal 5 are tin-plated.
Both terminals 5.7 and the printed circuit board can be soldered well.

In the second surface treatment method, the anode terminal 5, cathode terminal 7, and frame 12 are made of nickel or copper, or the anode terminal 5, cathode terminal 7, and frame 12 are nickel-plated or copper-plated on the surface. In this case, the ultraviolet curable resin 16 is directly applied to the surface portion of the cathode terminal 7 connected to the cathode layer 8 of the capacitor body l (the lower surface of the tip of the cathode terminal 7 shown in the figure) without forming a silver plating layer. do. The subsequent treatments are performed in the same manner as the first surface treatment method. In the second surface treatment method, although only silver plating is applied, the cathode terminal 7 and the cathode layer of the capacitor element 1 can be sufficiently connected.

<Invention or problem to be solved> In the above-mentioned double surface treatment method, the portion of the cathode terminal where tin plating is not desired is masked with an ultraviolet curable resin, then tin plating is applied, and then the ultraviolet curable resin is applied. It is being removed. Therefore, this method has problems in that the material cost of the ultraviolet curable resin is high and that it takes time and effort to apply the ultraviolet curable resin to the cathode terminal and peel it off. Furthermore, since it takes time and effort to peel off the ultraviolet curable resin applied to the cathode terminal, the capacitor at the cathode terminal must be carefully managed before connecting the cathode terminal and the capacitor body. There is a problem in that the surface of the connection portion with the cathode layer of the capacitor body may be corroded or contaminated, making it impossible to make a good connection between the cathode terminal and the cathode layer of the capacitor body.

The present invention has been made in view of these problems of the conventional technology, and its purpose is to simplify the work of surface treatment of cathode terminals and provide a constantly clean connection surface. As a result, it is an object of the present invention to provide a manufacturing method that improves the electrical connection of this connection part.

<Means for Solving the Problem> In order to achieve the above object, the method for manufacturing a solid electrolytic capacitor according to claim (1) provides terminals protruding from opposing positions of both sides of the strip-shaped frame. In the method for manufacturing a solid electrolytic capacitor, the method includes a step of surface-treating the cathode terminal, and a step of electrically connecting the cathode terminal and the cathode layer of the capacitor body via a conductive adhesive. The step of performing surface treatment on the cathode terminal 71' includes plating the surface portion of the cathode terminal 71' connected to the cathode layer of the capacitor body with a metal that is compatible with the conductive adhesive, and plating the cathode terminal. A step of applying a conductive film that is compatible with the solder to the entire surface including the applied surface portion, and then peeling off the conductive film applied to the plated surface portion by spraying high-pressure water, and completing the plating treatment. It consists of a step of exposing the applied surface area.

Further, in the method for manufacturing a solid electrolytic capacitor according to claim (2), the step of subjecting the cathode terminal to a surface treatment in the method for manufacturing a solid electrolytic capacitor according to claim (1) is performed on the surface of the cathode terminal. A step of applying a conductive film that is compatible with solder, and removing the conductive film applied to the surface portion of the cathode terminal that connects to the cathode layer of the capacitor body by spraying high-pressure water, and making the cathode terminal conductive. exposing the surface before the coating is applied.

According to the manufacturing method described in claims (1) and (2), a conductive film that is easily compatible with solder is applied to the entire surface of the cathode terminal as in the conventional method without masking, and then The conductive coating is stripped off by spraying high-pressure water onto the part that will connect to the cathode layer of the capacitor body. Therefore, there is an advantage that there is no need for applying an ultraviolet curable resin to the cathode terminal and then peeling it off, which was done in the conventional method. Furthermore, since this ultraviolet curable resin is not used, there is also the effect that there is no material cost. In addition, since it was time-consuming to apply UV-curable resin to the cathode terminal and then peel it off, it is now possible to perform this work immediately before connecting the cathode terminal to the cathode layer of the capacitor body. Although it was not possible to do so, it is easy to remove the conductive coating on the surface of the cathode terminal by spraying high-pressure water, so this work can be done just before connecting the cathode terminal and the capacitor body. . This has the effect of preventing corrosion and staining of the surface portion of the cathode terminal that is connected to the cathode layer of the capacitor body, and making the electrical connection better than that of the conventional one.

<Example> A first example of the present invention will be described with reference to FIG.

In the solid electrolytic capacitor of this embodiment, parts equivalent to those shown in the conventional example are indicated by the same reference numerals in the drawings, and detailed description thereof will be omitted. FIGS. 1(a), 1(b), and 1(c) are diagrams showing the procedure of a surface treatment method for a cathode terminal 7 in a method of manufacturing a solid electrolytic capacitor, and will be described below in the order of the diagrams. FIG. 1(a) is a longitudinal sectional side view showing the tip of the cathode terminal 7 protruding from the frame 12, in which the anode terminal 5, the cathode terminal 7, and the frame 12 are made of, for example, nickel silver, nickel, or copper. . The lower surface of the tip of the cathode terminal 7 is silver plated by a conventionally known method to form a silver plating layer 14. However, although silver plating was used here, it is compatible with the conductive adhesive 13 and is suitable for the cathode terminal 7 and the capacitor body l1. Any metal plating treatment may be used as long as it can improve the electrical connection with the cathode layer 8. For example, gold plating or copper plating may be used (first
Figure (a)). Next, a conductive film 15 (for example, a tin plating film) that is easily compatible with solder is formed on the entire surface of the cathode terminal 7 including the silver plating layer 14 and on the surface of the anode terminal 5 (not shown) (FIG. 1(b)). ). Thereafter, the conductive coating 15 applied to the surface of the silver plating layer 14 of the cathode terminal 7 is peeled off by spraying high-pressure water, and the silver plating layer 14 is removed by spraying high-pressure water.
(Figure 1(C)). When performing this stripping, for example, the water pressure of high-pressure jet water should be set to 500 to 15
00Kg/cm2, the diameter of the nozzle that spouts high-pressure water is about 0.1 to 0.5 mm, the distance between the tip of the nozzle and the conductive coating 15 when spraying high-pressure water to the conductive coating 15 is about 40 to 10 hm, the nozzle The relative moving speed between the conductive film 15 and the conductive film 15 is set to about 0.1 to 1. It is preferable to spray high-pressure jet water onto the conductive coating 15 as Oi/sin. Also, it is desirable to use deionized water for this high-pressure jet water. This is to prevent surface contamination such as reaction between the silver and chlorine ions in the water when the silver plating layer 14 is applied to the cathode terminal 7 by using deionized water. Further, the conductive liquid [1] of the cathode terminal 7 shown in FIG.
The work of peeling off the silver plating surface by spraying it with high-pressure water to expose the silver plating surface may be done immediately before connecting the cathode terminal 7 to the cathode layer 8 of the capacitor body l via the conductive adhesive 13. This is to prevent the surface of the silver plating layer 14 applied to the cathode terminal 7 from corroding or becoming dirty.

According to the procedure described above, the cathode terminal 7 is connected to the capacitor body 1.
Immediately before connecting to the cathode layer 8 of the
By spraying the conductive liquid I81!15 on the surface of
This film is peeled off to expose the silver-plated surface, and then this exposed surface and the cathode layer 8 of the capacitor body 1 are connected via the conductive adhesive 13, so the cathode terminal 7 The silver plating surface may corrode or
You can connect it without getting it dirty. Therefore,
The electrical connection between the silver plating layer 14 and the conductive adhesive 13 is good.

;t' A second embodiment of the present invention will be described with reference to FIG.

FIG. 2(a) shows an anode terminal 5, a cathode terminal 7, and a frame 12 made of, for example, nickel or copper, or an anode terminal 5, a cathode terminal 7, and a frame whose surfaces are plated with nickel or copper. 12 is a longitudinal sectional side view showing the tip of the cathode terminal 7 protruding from the frame 12. FIG. A conductive coating 15 (for example, tin plating) is formed on the entire surface of the cathode terminal 7 and the anode terminal 5 (not shown) (FIG. 2(a)). Thereafter, the conductive coating 15 applied to the lower surface of the tip of the cathode terminal 7 is peeled off by spraying high-pressure water to expose the surface of the cathode terminal 7 before the conductive coating 15 is applied (FIG. 2(b)). . However, the water pressure of this high-pressure jet water, the diameter of the nozzle that spouts high-pressure water,
When spraying high-pressure jet water onto the conductive coating 15, the distance between the tip of the nozzle and the conductive coating 15, the relative speed of movement between the nozzle and the conductive coating 15, etc. may be the same as those described in the first embodiment, but there are some important points. In this case, the conductive coating 15 applied to the surface of the cathode terminal 7 may be peeled off, and high-pressure jet water may be sprayed to expose the surface of the cathode terminal 7 before the coating 15 is applied.

According to the above-mentioned procedure, the cathode terminal 7 and the capacitor body l can be connected without corroding or soiling the surface of the cathode terminal 7.
Since the cathode layer 8 can be connected to the cathode layer 8, the electrical connection at this connection portion is good.

[Brief explanation of the drawing]

FIGS. 1(a), (b), and (c) are diagrams showing a first embodiment of the method for surface treatment of a cathode terminal in the method for manufacturing a solid electrolytic capacitor of the present invention, and FIGS. 2(a), (b)
FIG. 3(a) is a plan view showing a state in which a solid electrolytic capacitor is attached between an anode and a cathode terminal protruding from a frame. , FIG. 3(b) is a side view of the solid electrolytic capacitor shown in FIG. 3(a) as seen from the A-A direction, and FIG.
), (b), (c), and (d) are diagrams showing a method for surface treatment of a cathode terminal in a conventional method for manufacturing a solid electrolytic capacitor. l... Capacitor body, 7... Cathode terminal, 8...
... cathode layer, 12 ... frame, 13 ... conductive adhesive, 14 ... silver plating layer, 15 ... conductive coating.

Claims (2)

[Claims] (1) The step of surface-treating the cathode terminals of the terminals protruding from opposite positions of the frame on both sides of the strip, and connecting the cathode terminals and the cathode layer of the capacitor body with electricity via a conductive adhesive. In the method for manufacturing a solid electrolytic capacitor, the step of surface-treating the cathode terminal includes the step of surface-treating the cathode terminal so that the surface portion of the cathode terminal to be connected to the cathode layer of the capacitor body is compatible with the conductive adhesive. a step of applying a conductive coating that is compatible with solder to the entire surface including the plated surface portion of the cathode terminal; A method for manufacturing a solid electrolytic capacitor, comprising the step of peeling off the conductive film by spraying high-pressure water to expose the surface portion subjected to the plating treatment. (2) Surface treatment of the cathode terminal includes a step of applying a conductive film that is compatible with solder to the surface of the cathode terminal, and a surface portion of the cathode terminal that is connected to the cathode layer of the capacitor body. The solid electrolytic capacitor according to claim 1, further comprising the step of peeling off the conductive coating by spraying high-pressure water to expose the surface of the cathode terminal before the conductive coating is applied. manufacturing method.