JPH01279771A - Production of one side-plated metallic sheet - Google Patents

Abstract

PURPOSE:To produce the title metallic sheet with one side plated in a uniform plating amt. by supporting the rear of a traveling metallic sheet heated at a specified temp. by a supporting means, and bringing a plating metal into contact with the surface to melt the metal. CONSTITUTION:A band steel 1 is heated to a temp. higher than the m.p. of a plating metal, and traveled. The plating metal 2 is supplied by a plating metal feeder 10 provided with a preheater 5, a feed roller 12, etc., and brought into contact with the surface of the band steel 1 at a plating part A. The rear of the band steel 1 at the plating part A is supported by a supporting means such as a roll 11. As a result, the vibration of the band steel 1 is controlled, a specified amt. of the metal 2 is surely melted at a time, and a plating film 4 is formed in a highly precise plating amt. By this method, a plating can be continuously applied on one side of the band steel 1 in a uniform plating amt.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method capable of continuously manufacturing single-sided hot-dip plated metal sheets without using a molten metal bath.

[Conventional technology]

Conventionally, as a method of forming a plating film on the surface of a copper strip,
Hot-dip plating is a widely used method in which a copper strip is immersed in pre-molten plating metal.

When plating a copper strip on one side using continuous hot-dip galvanizing, which is a typical example of this type of plating method, the steel strip is heat-treated and surface-cleaned in a pretreatment furnace, and then the molten metal is pumped up from the molten zinc bath. A plating film is formed by bringing only one side into contact with the flow, and then the amount of plating deposited is adjusted by gas restriction, and the surface is adjusted by galvanealing or the like.

However, with this method of bringing the molten metal flow pumped up from the molten metal bath into contact with the surface of the copper strip, there is a problem that when trying to bring the molten metal into uniform contact with one side, the molten metal flows around to the non-plated side. There is.

Additionally, conventional hot dip galvanizing methods have various problems associated with the use of plating baths. Especially recently,
Home appliances on the plated steel strip.

Surface uniformity, smoothness, and beauty are required more than ever before, mainly for automotive exterior panel applications, and there is also high demand for new products such as multilayer plating in terms of quality. Problems with the quality of galvanized steel strip and the galvanizing process itself have become apparent. Some of such problems are discussed below.

1) Fe from the surface of the copper strip is eluted during the plating bath, and the plating metal is oxidized, which often generates so-called dross, which has to be pumped up and removed, so it does not adhere to the steel strip. Loss of plating metal occurs.

2) It is easy for impurities to be mixed into the plating bath, such as dross generated in the plating bath or debris from the bricks that make up the pot mixed into the bath, and these adhere to the copper strip and deteriorate its appearance. .

3) Since the components of the plating metal ingot put into the bath are different from the trace elements in the components that adhere to the steel strip and components discharged outside the bath as by-products such as dross, it is difficult to ensure that the necessary elements are included as per the target. It is difficult to adjust and control the bath components.

As a result, various plating defects occur, such as poor plating adhesion and poor alloying of the galvanic material.

4) Work near the high temperature and large amount of plating bath, such as the work of discharging the bottom dross that accumulates at the bottom of the column and the work of discharging the top dross that accumulates on the bath surface, does not place a heavy burden on the workers.
And it's dangerous.

5) Pot - Since only one type of plating can be done per group,
When performing various kinds of dissimilar plating, it is necessary to carry out routine practice by pumping out a bath, or to prepare a pot containing melted dissimilar plating metals in advance and move the pot.

6) When producing double-sided plated materials and single-sided plated materials using a single piece of equipment, it is necessary to change the plating equipment for the pot part, and in addition to the burden on the equipment, it takes a lot of time and effort to change over. It becomes necessary.

As described above, the conventional melt welding method has various problems.

In contrast to such conventional hot-dip plating methods, the present inventors have devised a new plating method that can eliminate all of the above-mentioned quantities m.

One of the methods is to bring a plated metal material (2) into contact with a moving copper strip (1) heated to m degrees above the melting point of the submerged metal, as shown in Figure 1. By continuously supplying the plated metal material (2) to the entire copper strip (1), the molten plating metal M (31) is continuously applied to the surface of the moving copper strip as a plating film (4). In addition, in this method, in order to ensure melting of the plated metal material (2), the plated metal material (2) can be preheated by a preheating device (5).

Another method is to use plated metal scrap material (as shown in Figure 2).
2) is continuously fed toward the surface of the moving steel strip (1), and the tip side of the plated metal material (2) is coated with the steel strip (1) K.
The facing heating melting device (61 (f force is the preheating device) is used to melt the molten metal (3) sequentially to form the plating film (
4) is a method in which the copper strip is continuously deposited on the surface of the copper strip.

In both of these methods, a plating metal material of the same phase is fed in the direction of the copper strip, and it is heated on or near the surface of the steel strip using the sensible heat of the copper strip or a melting device installed facing the steel strip. This method melts only the amount of plating and deposits this molten metal as plating metal. Therefore, it is possible to properly plate only one side without the molten metal going around to the non-plated surface. Since no molten metal bath is required, conventional problems associated with the use of plating baths can be solved at once, and by controlling the feeding speed of solid plated metal materials, the amount of plating deposited can be controlled with high precision. It can be carried out.

[Problem to be solved by the invention]

However, according to studies conducted by the present inventors, when plating a steel strip on one side using such a plating method, there is a problem in that the coating amount varies due to vibration of the steel strip. understood. That is, in this plating method, as shown in Fig. 1, the plating metal material (2) and the steel strip (
A molten layer (3) of the plating metal exists between the molten layer (3) and the molten layer (3). There is a need to.

However, the steel strip (1) that is threaded generally vibrates up and down (due to running), and this vibration causes the steel strip (1) to form a molten layer (
3) is displaced in the thickness direction, resulting in variations in the amount of plating deposited.

These problems are not limited to the plating methods mentioned above.
The same problem occurs in the plating method shown in Figure 2.

In view of these problems, the present invention aims to provide a method that can perform continuous single-sided plating while preventing variations in the amount of plating deposited.

[Means to solve the problem]

Therefore, the feature of the first invention of the present application is that the surface of the metal plate heated to a temperature higher than the melting point of the plated metal and passed through is plated by a plated metal material supplying device while the back side of the plated metal plate is supported by a supporting means. A metal material is fed and the plated metal material is brought into contact with a metal plate and melted, and the molten plating metal is continuously deposited as a plating film on the surface of the metal plate through which the plate is passed. The reason is that continuous plating is applied to one side.

Further, the second invention of the present application is characterized in that a plated metal material is charged into a plated metal supply device having a heat melting device for the plated metal material, and the tip side of the plated metal material is heated and melted by the heat melting device. Sequentially melt the molten metal,
The purpose is to apply continuous plating to one side of the metal plate by continuously depositing a plating film on the front surface of the metal plate to be passed, while supporting the back side of the metal plate with a support means.

By supporting the back surface of the metal plate in the K plating processing section with the support means, vibration of the metal plate in the plating processing section can be suppressed and a uniform amount of plating can be ensured.

The most commonly used support means is a roll, but other appropriate means such as a gas cushion device that supports the metal plate by jetting high-pressure gas onto the surface of the metal plate can also be used. .

In addition, even with the method of the present invention, there may still be some unevenness in the amount of plating film deposited, and in order to equalize this unevenness, a surface conditioning device (8
), and the surface conditioning device is, for example, one equipped with an ultrasonic vibrator (so-called
(ultrasonic iron) is used. This device is held by a cylinder device (not shown) having a buffer mechanism, etc., and is brought into light contact with the surface of the copper strip on which the plating film is formed, and applies ultrasonic vibrations to the plating film. equalize.

In addition, in the above plating process, in order to properly prevent uneven plating adhesion caused by vibration of the steel strip, the steel strip (1) is placed in contact with the plated metal material as shown in Figure 3 or Figure 4. Pinch can be performed by a pinch roll (9) on the upstream side.

〔Example〕

Figures 5 and 6 illustrate one embodiment of a method in which plated metal material is melted by contacting it with a copper strip.

In Jin's method, a plated metal material (2) is completely fed by a plated metal material supply device 00 to a copper strip (1) that is heated to a temperature higher than the melting point of the plated metal and passed through, and then the plated metal material (2) is melted by contacting it with the steel strip (1), and the molten tamping metal M (3) is continuously attached as a plating film (4) to one side of the steel strip (1) through which the plate is passed. It is.

This example is an example in which a roll aυ is used as a support means on the non-plated side, and the roll Qll is a plated metal material (2).
supports the back side of the steel strip of the plated part (A).

Plated metal material supply device Q (I is plated metal material (plate)
The plated metal material preheating device (6) is provided with a feed roller α2) (pinch roller) for feeding the metal material in the direction of the surface of the copper strip at a predetermined feed rate. A large number of plated metal materials (2) are set in a holder (not shown), and are automatically fed by a feeding cylinder (not shown) K so as to be bitten by a feeding roller Z. Then, the plating metal material (2) is sent to the surface of the copper strip by the feed roll α31C in an amount commensurate with the amount consumed for plating.

Note that this is done to ensure that the preheating device (5) can preheat and melt the fitted metal material, and is not necessarily essential. However, in order to obtain a stable plating film thickness using the method of the present invention, the thickness of the molten layer (3) formed when the plating metal material is melted by the sensible heat of the copper strip is required! It is necessary to secure an A degree. If the sensible heat of the steel strip (1) is relatively low compared to the plating metal material used, then the molten layer (3
) is not sufficiently formed, making it difficult to ensure a stable film thickness, and the solid contact between the plated metal material (2) and the steel strip (1) becomes significant, causing damage to the metal plate. Therefore,
In cases where such problems may occur, the plated metal material (2) is preheated and then supplied to the steel strip (1), which prevents the melting of the plated metal material. can be promoted.

7 and 8 show another embodiment of the present invention, in which a gas cushion device a3 is used as the support means. This gas cushion device (2) is equipped with a gas cushion header 0 made of a steel strip, and the nozzle α9 of the header
Gas is blown onto the surface of the copper strip, and this gas supports the copper strip (1).

Note that the supporting means is not limited to the above-mentioned embodiments, and may have any suitable structure.

The structure of the support means as described above is exactly the same in the plating method shown in FIG. 2, that is, the method in which the tip side of the plated metal material (2) is sequentially melted by a melting device.

FIG. 9 shows one embodiment thereof.

In this method, a plated metal material (2) is continuously charged into a plated metal supply device OI having a heating and melting device for the plated metal material facing the copper strip threading line, and the tip of the plated metal material (2) is The sides are sequentially melted using a heating melting device, and the molten glazing metal (3) is applied as a plating film to one side of the copper strip to be passed in a continuous pattern.

Also in this embodiment, as in the case of FIG. 5, a roll (l) is used as the supporting means.

Note that in this method as well, the supporting means may be any suitable device such as a gas cushion device.

Note that the plated metal supply device α [is comprised of a feed roller (17J) and a plated metal material preheating device (7J) similar to those in the above embodiment.
) and a heating melting device (6).

As shown in FIG. 2, the heating melting device (6) is a cylindrical body having a heating body (heater, etc.) on the circumferential body, and a nozzle a7) is formed on the -1 side, and the nozzle opening (170) is formed on the -1 side. i
It is arranged so as to be close to the surface of the copper strip through which the plate is passed. The preheated metal material (2) is preheated by the preheating device (7).
The molten metal (3
) is supplied from the nozzle (17) to the surface of the copper strip to form a plating film (4).

In addition, in the plating method of the present invention, the steel strip can be plated into round rings at room temperature. It is preferable to heat the copper strip with a heating device and plate the copper strip. Moreover, although this preheating temperature is not particularly limited, it is particularly preferable that the preheating temperature is higher than the melting point of the plated metal material (2).

Further, in this embodiment, the plated metal material (2) charged into the plated metal supply device α1 is plate-shaped, but the plated metal material may be, for example, a powder.

The plating method according to the present invention can be applied to various metal plating or alloy plating (for example, Zn plating, Zn-kl plating, etc.). Furthermore, the plating method of the present invention can be carried out by running the copper strip (1) in a direction other than the horizontal direction; for example, it can be carried out by running the copper strip (1) in a vertical direction. and,
In the case of this vertical line, the running direction can be either up or down.

〔Effect of the invention〕

According to the present invention described above, the solid-phase plated metal material is melted on or near the surface of the metal plate to be plated by the amount of the plating area, and this is adhered to the metal plate surface as a plating film. 'l of molten gold 4 on the plating surface! A: Only one side can be properly hot-dipped without causing any dents. In addition, since a molten metal bath is not used, there are no problems associated with the use of conventional plating baths.
It is possible to continuously form the plating skin Ffx using the metal plate KM melting metal, and by controlling the feeding speed of the solid plating metal material, the amount of plating can be controlled with high precision. The plating film can be formed uniformly without changing the amount of adhesion.

[Brief explanation of the drawing]

FIGS. 1 and 2 are explanatory diagrams schematically showing the principle of the plating method that is the basis of the present invention. FIGS. 3 and 4 are explanatory diagrams each showing a case in which a pinch roll is provided on the upstream side in the present invention. 5 and 6 show an embodiment of the present invention, with FIG. 5 being a perspective view and FIG. 6 being a schematic side view. FIGS. 7 and 8 show other embodiments of the present invention, with FIG. 7 being a perspective view and FIG. 8 being a schematic side view. FIG. 9 is a perspective view showing another embodiment of the invention. In the figure, (1) is a copper strip, (2) a fitted metal material, (
3) is a melting layer, (4) a plating film, (5) a preheating device, (6) a heating melting device, and (8) a surface conditioning deviceff%.
α1 is a fitting metal material supply device, 04 is a fitting metal supply device, α9 is a roll, αJ is a gas cushion device, (A
) is the fitting processing section. Figure 11 Figure 3 Figure 4 Figure 5

Claims (2)

[Claims] (1) Feeding a plating metal material by a plating metal material supplying device to the surface of a metal plate heated to a temperature equal to or higher than the melting point of the plating metal and being passed through the plated metal material, while supporting the back side of the plated metal plate with a support means; Continuous plating is applied to one side of the metal plate by melting the plated metal material by contacting it with the metal plate and continuously attaching the molten plated metal as a plating film to the surface of the metal plate through which the plate is passed. A method for producing a single-sided plated metal plate. (2) Plating metal materials are charged into a plating metal supply device having a heat melting device for plating metal materials, and the tip side of the plating metal materials is sequentially melted by the heat melting device, and the melted metal materials are melted. Single-sided plating, characterized in that continuous plating is applied to one side of a metal plate by continuously attaching metal as a plating film to the surface of the metal plate through which the plate is passed, with the back side supported by a support means. Method of manufacturing metal plates.