JPH01278917A - Lead bending device for electronic parts - Google Patents

Abstract

PURPOSE:To improve the durability and bending accuracy of a device by equipping a specified number of bodies of revolution for pressure for bending leads of an electronic parts on axes and arranging necessary numbers of rock-suppress members at specified places in the circumferential place. CONSTITUTION:On the side on which outer leads 2 of an electronic parts is bent and pressurized a specified number of bodies 4 of revolution for pressure are arranged on the axes 13 through bearing mechanisms. Further, necessary numbers of rock-suppress members 5 are arranged in the circumferential parts of the bodies 4 of revolution. When the electronic parts body A is fitted and supported by a die 6 and a pressurizing part 7 and a punch 8 is lowered, the bodies 4 of revolution bends the leads 2 as far as the bending angle. In this case, the bodies 4 of revolution is prevented surely from deforming, curving and rocking. Further, since the bodies 4 of revolution can be revolved through the bearing mechanisms, the whole device is improved in durability. Since the bodies of revolution are prevented from deforming and curving, the bending accuracy, too, is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to improvements in lead bending devices for, for example, resin-to-soil molded products of semiconductor devices and other electronic components.

[Conventional technology]

Conventionally, a lead bending device for bending the external lead of an electronic component to a required angle (shape) in order to mount the electronic component on a board etc. has been used to support the main body of the electronic component (for example, a molded package). A device equipped with a support mechanism and an external lead bending mechanism for bending the external leads of an electronic component supported by the support mechanism to a required angle is known. It is known to use a bending mechanism such as a rotatably mounted roller (for example, Japanese Patent Application Laid-Open No. 1986-10
1266, etc.).

[Problem that the invention seeks to solve]

By the way, in the conventional device mentioned above, this type of product (
Based on the technical constraints specific to electronic components, there are the following problems.

That is, the electronic component described above is a relatively small product, and the required number of external leads protruding from the main body are further formed into a narrow shape and arranged in parallel at narrow width intervals.

Therefore, it is necessary to adopt an extremely small bending mechanism for the external leads arranged to accommodate this narrow shape and spacing. In particular, since the outer diameters of the rollers and their rotating shafts are made thinner, there are problems with the durability of the entire lead bending device, such as a decrease in the mechanical strength of the external lead bending mechanism. be.

In addition, when the external lead is bent under pressure by the roller,
The bending efficiency or bending process is such that the external lead cannot be bent to a predetermined angle because the pivot shaft on which the roller is mounted is bent in a direction opposite to the pressing direction as a reaction force. There are issues with accuracy.

In addition, for the purpose of improving the strength of the external lead bending mechanism described above, it is conceivable to make the outer circumferential diameter of the above-described roller and its rotation axis thicker (longer), for example.
In this case, the following other disadvantages occur, and as a result, there is a technical problem that a small member must be used as the bending member for the external lead.

In other words, the above-mentioned external leads are usually formed with a wide base on the main body (molded package) side and a narrow shape on the tip side. It is preferable that the outer circumferential surface of the roller is brought into contact with the base side of the external lead so that the bending force of the roller is applied from the wide part of the external lead. In this case, there is an advantage that the mechanical strength of the external lead bending mechanism can be improved, but on the other hand, the starting point of the bending force on the external lead on the outer peripheral surface of the roller is on the narrow width portion of the tip. Therefore, for example, there are technical problems in bending processing such as deformation and twisting of the tip portion, and quality problems.

The present invention provides a lead bending device for electronic components under special bending conditions as described above, by increasing the outer circumferential diameter of the rotary body for lead bending and its rotation axis in the external lead bending mechanism. It is possible to improve the mechanical strength of the external lead bending mechanism and improve the durability of the entire device without forming the outer lead. A lead bending device for electronic components that can obtain a predetermined bending efficiency or bending accuracy by preventing the rocking of the rotating body or the bending deformation of a pivot shaft on which the rotating body is mounted. The purpose is to provide

[Means for solving problems]

The electronic component lead bending device according to the present invention includes a support fi 111 that supports the electronic component main body A, and an external lead bending mechanism 3 that bends the external lead 2 of the electronic component supported by the support mechanism to a required angle. In the lead bending device for electronic components, the external lead bending mechanism 3 is mounted on a bending pressure side of the external lead 2, and a required number of pressurizing rotating bodies 4 are provided.
It is characterized in that a required number of anti-swing members 5 are disposed at predetermined positions around the pressurizing rotor to prevent it from swinging.

Further, the electronic component lead bending device according to the present invention is characterized in that the above-mentioned rocking prevention member 5 is constituted by a required rotating body mounted on a shaft.

Further, in the lead bending device for electronic components according to the present invention, the structure of the rotary body 4 (and the rotary body of the swing prevention member 5) for pressurizing the bending of the external lead 2 is such that its rotation axis ( 13
・It is characterized by being composed of a ball bearing structure fitted in 17).

Further, in the lead bending device for electronic components according to the present invention, the structure of the rotary body 4 (and the rotary body of the swing prevention member 5) for pressurizing the bending of the external lead 2 is such that its rotation axis ( 13
・It is characterized by being composed of a roller bearing structure fitted in 17).

Further, the electronic component lead bending device according to the present invention includes the above-described bending pressurizing rotating body 41 (and the swing prevention member 5
The structure of the rotating body (of the rotating body) is directly fitted onto the rotating shaft (13, 17) via the rotating ball 15.

Further, the electronic component lead bending device according to the present invention includes the above-described bending pressurizing rotating body 41 (and the swing prevention member 5
The rotating body) is characterized by being directly fitted onto its rotating shafts (13, 17) via rotating rollers 16.

[Effect]

According to the present invention, at a predetermined position around the pressurizing rotating body 4,
Since it is configured by disposing a required number of anti-swing members 5 for preventing the swinging, when the external lead 2 is bent under pressure by the rotating pressurizing member, the rotating member for pressurizing does not swing. Alternatively, it is possible to efficiently and reliably prevent the pivot shaft 13 on which the rotating body is mounted from being bent in a direction opposite to the pressurizing direction.

Therefore, the external lead 2 can be bent to a predetermined angle to obtain a preset appropriate bending accuracy.

〔Example〕

Next, the present invention will be explained based on embodiment figures.

1 and 2 show essential parts of an electronic component lead bending device according to the present invention.

This bending device is equipped with a support mechanism 1 that supports a main body A of an electronic component, and an external lead bending mechanism 3 that bends an external lead 2 of an electronic component supported by the support mechanism 1 to a required angle. There is. Further, the external lead bending mechanism 3 includes:
It is composed of a required number of pressurizing rotating bodies 4 that are mounted on the bent pressure side of the external lead 2, and a required number of pressurizing rotating bodies 4 are installed at predetermined positions on the periphery of the pressurizing rotating bodies 4 to prevent their swinging. A rocking prevention member 5 is provided.

The support mechanism 1 includes a die 6 that fits and supports the upper half of an electronic component main body A provided on a fixed lower frame, and an upper half of an electronic component main body A provided on a movable upper frame facing the die 6. It is composed of a pressing part 7 that fits and supports the body. Further, the pressing portion 7 is vertically slidably fitted via a support rod 10 that is fitted into a vertical through hole 9 of a punch 8 installed on the upper frame side, and the upper end of the support rod 10 is An elastic member 11 such as a spring disposed in the
It is provided so as to be pushed downward toward the die 6 side by its elasticity.

Further, the pressurizing rotating body 4 in the external lead bending mechanism 3 is rotatably mounted on a pivot shaft 13 installed between arms 12 provided as a pair of front and rear arms at the lower part of the punch 8. Furthermore, the pressurizing rotating body 4 is connected to the support mechanism 1.
External leads in electronic components supported and fixed by (
They are arranged at positions corresponding to positions 2 and 2), respectively.

Furthermore, this pressurizing rotating body 4 is
It is arranged in the following manner.

That is, a large number of pressurizing rotors are separately mounted via appropriate ring-shaped spacers 14, corresponding to the positions and numbers of the external leads (2, 2) of the electronic components described above. Alternatively, two of the external leads may be
It is also possible to adopt a configuration in which a small number of pressurizing rotating bodies are mounted separately (see Figures 3 to 6). A configuration may be adopted in which a single pressurizing rotating body is mounted on all external leads on the same side edge of the main body A, and these selections can be made arbitrarily as necessary.

Further, the pressurizing rotating body 4 is configured in the following manner.

That is, as shown in FIGS. 1 to 3, the pressurizing rotating body may have the same structure as the ball bearing fitted to the pivot shaft 13, or as shown in FIG. The pressurizing rotor may have the same structure as the roller bearing fitted on the pivot shaft 13, or as shown in FIG. Alternatively, as shown in FIG.
Alternatively, the pressure rotating body may be directly fitted onto the pivot shaft 13 via the rotating roller 16.
When adopting a structure in which the rotating ball 15 or the rotating roller 16 is directly fitted onto the top of the bearing structure, the member corresponding to the inner race in the bearing structure can be omitted, and the pressure rotating body 41 There is an advantage that the wall thickness t can be increased without changing (thickening) the outer peripheral diameter.

Moreover, the above-mentioned rocking prevention member 5
It is arranged at a predetermined position around the periphery of. This arrangement at a predetermined position in the peripheral area means a position where the pressing rotary body 4 can be prevented from swinging when the external lead 2 is bent under pressure by the pressurizing rotary body 4, or a position thereof. In order to prevent rocking,
This refers to the manner in which the rotating body is disposed at a position that can prevent the pivot 13 on which the rotating body is mounted from being bent in a direction opposite to the direction of pressure applied as a reaction force. In addition, on the national side, the rocking prevention members 5 are disposed at two locations, one on the outer side of the pressurizing rotary body 4 and the other at a slightly upper position, and these rocking prevention members 5 are placed on the outside of the pressurizing rotating body 4 and at a slightly upper position. By bringing it into contact with the outer peripheral surface of the pressure rotating body 4, it directly prevents the pressure rotating body 4 from swinging, and thereby prevents the pivot 13 on which the rotating body is mounted from being deformed in a curved manner. However, for example, in a case where a space in the axial direction is provided between the pressurizing rotary bodies 4 in which the rocking prevention member 5 can be inserted, the rocking can be prevented indirectly. The member 5 is connected to the above-mentioned pivot 13
It is also possible to employ a configuration in which the holder is brought into direct contact with the outer circumferential surface of the holder, and in this case as well, substantially the same functions and effects can be obtained.

Further, the rocking prevention member 5 is constituted by a rotating body rotatably mounted on a similar pivot shaft 17 installed in parallel to the pivot shaft 13 described above. Further, the rotary body may be a normal sleeve-shaped rotary body 51 mounted on the pivot shaft 17 as shown in the Japanese version, but the arrangement of the pressurizing rotary body 4 with respect to the pivot shaft 13 described above may be It is preferable to adopt the same arrangement and configuration aspects as the above and configuration aspects.

Next, the bending effect of the leads in the configuration of the above embodiment will be explained.

First, the upper half of the electronic component main body A is fitted and supported on the die 6 side, as shown by the chain line in FIG.

Next, the punch 8 is moved down to fit and support the upper half of the electronic component main body A by the pressing portion 7. At this time, the electronic component main body A is fitted and supported in a predetermined posture by the fitting recess 61 provided on the die 6 side and the fitting recess 71 on the pressing part 7 side that is pushed down by the elasticity of the elastic member 11. Along with being
The external leads (2, 2) are in a state of protruding in the left and right horizontal directions.

Next, when the punch 8 is further moved downward, the pressurizing rotary body 4 on the pivot shaft 13 is moved downwardly from the external lead (2) as shown in FIG.
- The external lead is bent to the required bending angle while contacting the upper surface of the base side of 2). At this time, a bending force is applied to the pivot shaft 13 on which the pressurizing rotor 4 is mounted via the pressurizer rotor 4 in a direction opposite to the press bending direction of the external lead 2. However, the rocking prevention member 5 disposed at a predetermined position on the periphery of the pressurizing rotating body 4 can efficiently and reliably prevent the curved deformation. Furthermore, since the pressurizing rotary body 4 is rotatably provided, it descends while rotating on the upper surface of the external lead. Therefore, the peeling of the solder plating layer applied to the upper surface of the external lead can be efficiently prevented. This is something that can be easily prevented.

In addition, when the bending process of the external lead 2 in the electronic component described above is completed, the punch 8 side is raised to the original position to release the fitted support state with respect to the electronic component body A, and then the die 6 side is Through the electronic component extraction mechanism 18,
The electronic component may be taken out from inside the fitting recess 6 to the outside.

Note that the present invention is not limited to the embodiments described above, and, for example, the manner in which the pressurizing rotating body 4 is disposed with respect to the pivot shaft 13 and its configuration, and the manner in which the anti-swing member 5 is disposed and its configuration are applicable. The aspect, etc. can be changed and selected arbitrarily as necessary without departing from the spirit of the present invention, such as configuring one set of the die 6 and the punch 8 as a plurality of sets. It is.

〔Effect of the invention〕

According to the configuration of the present invention, in a lead bending device for electronic components under special bending processing conditions as described above, there is a rotary body for bending the lead in the external lead bending mechanism, Since the mechanical strength of the external lead bending mechanism can be improved without increasing the outer circumferential diameter of the pivot, the overall durability of the lead bending device can be improved. It is something to play.

Further, when the external lead is bent under pressure by the rotating body, it is possible to prevent the rotating body from swinging, or to reliably prevent the curved deformation of the shaft on which the rotating body is mounted. This has the effect of providing an electronic component lead bending device that can obtain a predetermined bending efficiency or bending accuracy.

Therefore, it is ideal as a lead bending device for this type of product where high quality and high reliability are particularly required, and it is also an excellent practical device that can reliably solve the conventional problems mentioned above. This has the following effects.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention, and FIG. 1 is a partially cutaway front view showing the main parts of the lead bending device according to the present invention. FIG. 2 is a partially cutaway front view showing a state in which the leads of an electronic component are bent by the device. FIG. 3 is a partially cutaway enlarged side view showing the main part of the pressurizing rotating body in the device. 4 to 6 are partially cutaway side views showing other essential parts of the pressurizing rotating body. [Explanation of symbols] A...Electronic component main body 1...Support mechanism 2...External lead 3...Lead bending mechanism 4...Rotating body for pressurization 5...Swing prevention member 6... ...Diare...Press portion 8...Punch 13...Pivot 14...Spacer 15...Rotating ball 16...Rotating roller 17...Pivot

Claims (6)

[Claims] (1) In an electronic component lead bending device that includes a support mechanism for an electronic component body and an external lead bending mechanism that bends an external lead of an electronic component supported by the support mechanism at a predetermined angle, The bending mechanism is composed of a required number of pressurizing rotating bodies mounted on the bending pressure side of the external lead, and a required number of oscillators at predetermined positions around the pressurizing rotating bodies to prevent the swinging. What is claimed is: 1. A lead bending device for electronic components, characterized in that the lead bending device includes a movement preventing member. (2) Claim No. 1, characterized in that the rocking prevention member is constituted by a required rotating body mounted on a shaft.
A lead bending device for electronic components as described in 2. (3) The electronic component according to claim (1) or (2), wherein the structure of the rotating body is comprised of a ball bearing structure fitted to a pivot. Lead bending device. (4) The electronic component according to claim (1) or (2), wherein the structure of the rotating body is composed of a roller bearing structure fitted to a pivot shaft. Lead bending device. (5) Claim (1) or (2) characterized in that the structure of the rotating body is directly fitted onto the pivot via a rotating ball. A lead bending device for electronic components as described in 2. (6) Claim (1) or (2) characterized in that the structure of the rotating body is directly fitted onto the pivot via a rotating roller. A lead bending device for electronic components as described in 2.