JPH01271177A - Super abrasive grain vitrified bond grinding stone and manufacture thereof - Google Patents
Super abrasive grain vitrified bond grinding stone and manufacture thereofInfo
- Publication number
- JPH01271177A JPH01271177A JP9571288A JP9571288A JPH01271177A JP H01271177 A JPH01271177 A JP H01271177A JP 9571288 A JP9571288 A JP 9571288A JP 9571288 A JP9571288 A JP 9571288A JP H01271177 A JPH01271177 A JP H01271177A
- Authority
- JP
- Japan
- Prior art keywords
- vol
- vitrified bond
- grinding
- aggregate
- grinding stone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000227 grinding Methods 0.000 title claims abstract description 50
- 239000006061 abrasive grain Substances 0.000 title claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000004575 stone Substances 0.000 title abstract description 7
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 12
- 239000002245 particle Substances 0.000 claims description 16
- 239000000843 powder Substances 0.000 claims description 12
- 239000011148 porous material Substances 0.000 claims description 11
- 229920001187 thermosetting polymer Polymers 0.000 claims description 11
- 238000005245 sintering Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000000203 mixture Substances 0.000 abstract description 3
- 230000002708 enhancing effect Effects 0.000 abstract 2
- 230000006866 deterioration Effects 0.000 abstract 1
- 239000000428 dust Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 12
- 235000013339 cereals Nutrition 0.000 description 8
- 238000010304 firing Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000000465 moulding Methods 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 3
- 229920001353 Dextrin Polymers 0.000 description 2
- 239000004375 Dextrin Substances 0.000 description 2
- 229920000084 Gum arabic Polymers 0.000 description 2
- 241000978776 Senegalia senegal Species 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000000205 acacia gum Substances 0.000 description 2
- 235000010489 acacia gum Nutrition 0.000 description 2
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 235000019425 dextrin Nutrition 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000005018 casein Substances 0.000 description 1
- BECPQYXYKAMYBN-UHFFFAOYSA-N casein, tech. Chemical compound NCCCCC(C(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(CC(C)C)N=C(O)C(CCC(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(C(C)O)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(COP(O)(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(N)CC1=CC=CC=C1 BECPQYXYKAMYBN-UHFFFAOYSA-N 0.000 description 1
- 235000021240 caseins Nutrition 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000007849 furan resin Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000011146 organic particle Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229910052704 radon Inorganic materials 0.000 description 1
- SYUHGPGVQRZVTB-UHFFFAOYSA-N radon atom Chemical compound [Rn] SYUHGPGVQRZVTB-UHFFFAOYSA-N 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- -1 vitrified bond Substances 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野J
本発明は、骨材を配合しても切粉の目詰まりや融着をお
こさない切れ味を改善した超砥粒ビトリファイドボンド
砥石及びその製造方法に関する。[Detailed Description of the Invention] [Industrial Application Field J] The present invention provides a super-abrasive vitrified bond grindstone with improved sharpness that does not cause clogging or fusion of cutting chips even when aggregate is added thereto, and a method for manufacturing the same. Regarding.
[従来の技術]
ビトリファイドボンド砥石は、結合材の主要成分がSi
O□とBよ0.でしめられ、溶化により砥粒を結合した
形式の砥石である。もっとも広範な用途と、特に精密な
研削には欠かすことの出来ない特徴を有している。[Prior art] A vitrified bond grindstone has a bonding material whose main component is Si.
O□ and B 0. It is a type of whetstone in which the abrasive grains are bonded together by dissolution. It has the widest range of uses and features that are indispensable, especially for precision grinding.
すなわち、fit連続気孔を計画的に出来る。In other words, continuous fit pores can be created in a planned manner.
(11)砥石構造の三要素(砥粒、結合材、気孔)の調
整が容易であること、fiiil熱の逸散がレジノイド
砥石より優れていること、fiv)弾性がレジノイド砥
石より小さいため精密加工に適していることなどをあげ
ることが出来る。(11) It is easy to adjust the three elements of the grinding wheel structure (abrasive grains, bonding material, and pores), fiii) heat dissipation is superior to resinoid grinding wheels, and fiv) elasticity is smaller than resinoid grinding wheels for precision processing. You can list things that are suitable for you.
ビトリファイドボンド砥石は、その結合材を焼成中に溶
化して砥粒間隙を融着し、冷却後強固な結合を示すが、
その作用は最終的には研削刃の顕現に適する力で砥粒を
保持することにあるが、その保持の形は砥石の構造の諸
要素に適したものでなければならない。Vitrified bond grinding wheels melt the binding material during firing to fuse the gaps between the abrasive grains, and exhibit a strong bond after cooling.
Its action is ultimately to hold the abrasive grains with a force suitable for the manifestation of the grinding blade, but the form of this holding must be appropriate to the elements of the structure of the grinding wheel.
また、結合材は焼成後に砥粒間の結合を行なうことか主
な目的であるが、成形中および生砥石、焼成中の砥石の
構造までを最初から計画したとおりに完成品に至らせる
には適切な補助結合材が必要となる。このものは、乾燥
強度を有するが、焼成後に砥石に影響を与えないもの、
あるいは焼成中に消失するようなデキストリン、メリケ
ン粉。The main purpose of the binder is to bond the abrasive grains together after firing, but it is important to ensure that the structure of the grindstone during forming, raw grinding, and firing remains as planned from the beginning to the finished product. A suitable auxiliary binder is required. This item has dry strength but does not affect the whetstone after firing.
Or dextrin or meriken powder that disappears during baking.
ラドン粉、フ糊、アラビアゴム、メチルセルローズ、カ
ゼイン、CMC1水ガラスその他が使用されてきた。Radon powder, glue, gum arabic, methylcellulose, casein, CMC1 water glass, and others have been used.
また、砥粒としては各種酸化物、カーバイド、窒化物、
硼化物などが用いられているが、近年は超砥粒と呼ばれ
るダイヤモンド、立方晶窒化硼素(以下CBNという)
などが盛んに用いられる様になってきた。In addition, various oxides, carbides, nitrides,
Borides are used, but in recent years diamond, which is called a superabrasive, and cubic boron nitride (hereinafter referred to as CBN) have been used.
etc. have come to be widely used.
特に超砥粒は、硬度が極めて高いところから精密加工に
は欠かすことが出来ないものであるが。In particular, superabrasive grains are indispensable for precision machining due to their extremely high hardness.
砥粒そのものが極めて高価であるため、砥石強度の増大
と研削性もあるとのことで、アルミナ質砥粒や炭化ケイ
素砥粒を併用することが知られている。(特公昭52−
3147、特公昭56−41また、切削性を改良するた
め気孔の増大をはかり、有機質粘着剤の添加(特公昭5
6−41391)、砥粒径の2−4倍の粒子径を有する
有機性粒子を配合し、成形焼成する方法(特開昭59−
161269)など種々の提案がなされている。Since the abrasive grains themselves are extremely expensive, it is known that alumina abrasive grains and silicon carbide abrasive grains are used in combination to increase the strength of the whetstone and improve grinding performance. (Tokuko Showa 52-
3147, Special Publication No. 56-41 In addition, in order to improve machinability, pores were increased and organic adhesive was added (Special Publication No. 56-41).
6-41391), a method in which organic particles having a particle size 2 to 4 times the abrasive grain size are blended and molded and fired (JP-A-59-
Various proposals have been made, such as 161269).
しかし、これらの提案はいずれも一長一短あって、成形
工程、例えば超砥粒、ビトリファイドボンド(結合材)
及び骨材を混合し、金型に充填し加圧成形するが、成形
がうまく行かなかったり、あるいは型抜きが困難になっ
たり、場合によっては気孔の不均一性、砥石の強度など
に欠陥を招じたり、何れかの障害が避けられなかった。However, all of these proposals have advantages and disadvantages, and the forming process, such as superabrasive grains, vitrified bond (binding material)
Mixing aggregate and filling it into a mold and press forming it, but sometimes the molding does not go well or it becomes difficult to cut out the mold, and in some cases there may be defects such as non-uniformity of pores or strength of the grindstone. Some obstacles were inevitable.
[発明が解決しようとする課題]
上記の技術の中で、骨材を使用する砥石は骨材の使用に
起因する切粉の溶着や目詰まりが発生しやす(、切れ味
が充分とはいえなかった。一方高気孔の砥石を目的とし
た技術は、気孔に起因する砥石の強度低下、気孔の不均
一性などがうまく解決されず、問題がある。[Problems to be solved by the invention] Among the above-mentioned technologies, whetstones that use aggregate are prone to welding of chips and clogging due to the use of aggregate (and may not be sharp enough). On the other hand, the technology aimed at producing grinding wheels with high porosity has problems, such as the reduction in the strength of the grinding wheel caused by pores and the non-uniformity of pores.
さらに溶着や目詰まりの問題の解決のため軟らかな骨材
を使用する例も提案されてはいるが、溶着も目詰まりも
一部しか解決されず、切れ味も僅かしか改首されないの
でうまい解決策とはなっていない。Furthermore, the use of soft aggregate has been proposed to solve the problems of welding and clogging, but this is a good solution as it only partially solves the problems of welding and clogging, and only slightly improves sharpness. It is not.
[課題を解決するための手段]
気孔率を増やせば強度は低下するが切れ味は良くなるこ
とはよく知られているが、本発明は強度を落さず切れ味
の良い砥石を提供するものである。[Means for Solving the Problems] It is well known that increasing the porosity reduces strength but improves sharpness, and the present invention provides a whetstone that provides good sharpness without reducing strength. .
本発明者らはこの課題に取り組み、砥石の強度を落すこ
となく、高気孔率で骨材が被削材や切粉と干渉しないた
めに、骨材を平均粒径がIam以下である微粉とするこ
とで一応の解決を見た。The present inventors tackled this problem, and in order to prevent the aggregate from interfering with the work material or chips due to its high porosity and without reducing the strength of the grinding wheel, the aggregate was made into fine powder with an average particle size of Iam or less. I found a temporary solution by doing this.
さらに成形工程において、成形の容易性、型抜きの容易
性、生砥石の強度の向上などを得るため、熱硬化性樹脂
を使用し、その硬化温度にまで加熱し、熱硬化性樹脂を
硬化させ生砥石のそれ以降の工程の取扱の容易さを確保
した。この熱硬化性樹脂は、砥石の焼結工程が酸化性雰
囲気で行なわれるため完全に消失し、焼結後の砥石には
全く影響を与えない。Furthermore, in the molding process, in order to obtain ease of molding, ease of mold removal, and improvement of the strength of the green grindstone, thermosetting resin is used and heated to its curing temperature to harden the thermosetting resin. Ease of handling of the raw grindstone in subsequent processes was ensured. This thermosetting resin completely disappears because the grindstone sintering process is carried out in an oxidizing atmosphere, and has no effect on the grindstone after sintering.
以下、製造方法と共に本発明の詳細な説明する。Hereinafter, the present invention will be explained in detail along with the manufacturing method.
本発明で超砥粒とは、CBN、ダイヤモンド等の超硬物
質であり、粒度は通常砥石用として用いられているもの
全てに適用できる。近年特に細粉の利用が開発されてい
るが、本発明はその目的からみても粒度に制限はない。In the present invention, the superabrasive grains are superhard materials such as CBN and diamond, and the grain size can be applied to all those commonly used for grinding wheels. Although the use of fine powder has been particularly developed in recent years, the present invention is not limited in particle size for its purpose.
量的には、15〜55voI2%である。15vol%
より少ないときは、WASAなどの在来の砥石と性能的
に大差がなくなる。また、ビトリファイドボンドあるい
は骨材の配合lが当然に多くなるので各種の問題(後述
)が避けらね、なくなる2これとけ逆に55vo!!%
以」二になると、この分ビトリファイドボンドの量の゛
減少、気孔率の減少などを伴うため、切削性のよい高気
孔砥石をfgJ造するのが困難となってくる。Quantitatively, it is 15-55 vol 2%. 15vol%
When the amount is smaller, there is no big difference in performance from conventional whetstones such as WASA. In addition, since the amount of vitrified bond or aggregate added naturally increases, various problems (described later) are unavoidable and disappear2.On the contrary, 55vo! ! %
Second, the amount of vitrified bond decreases and the porosity decreases, making it difficult to produce a high-porosity grindstone with good cutting performance.
次に、結合材としてのビトリファイドボンドは通常超砥
粒用として使用されているものは全て使用できる9配合
すべき量は10〜30voI2%である。l 0vol
%を下回ると、超砥粒の固定力が弱く砥粒の脱落が多く
なり、工具としては不遣当なものとなる。一方、30v
oI2%以」二になると、ボンドが多くなり過ぎて、砥
石が発泡し易くなり、またうまく成形できたとしても切
れ味が低下した砥石となりやすい。Next, as the bonding material, any vitrified bond that is normally used for superabrasive grains can be used.9 The amount to be blended is 10 to 30 vol 2%. l 0vol
If it is less than %, the fixing force of the superabrasive grains is weak and the abrasive grains often fall off, making the tool unsuitable. On the other hand, 30v
If the oI is 2% or more, there will be too much bond and the whetstone will tend to foam, and even if it is formed well, the whetstone will tend to have poor sharpness.
骨材としては、酸化物系のものであって、アルミナ、ム
ライト、ジルコニア等が含まれ、平均粒径約2Lj、m
以下の微粉を使用する。The aggregate is oxide-based and contains alumina, mullite, zirconia, etc., and has an average particle size of approximately 2Lj, m.
Use the following fine powder.
骨材の粒度としては、はぼ2μm以下のものがよく、こ
れ以上の粒度となると被削材と干渉し始め、研削動力が
大きくなり切れ味も悪くなる。The grain size of the aggregate is preferably 2 μm or less; if the grain size is larger than this, it will begin to interfere with the workpiece, resulting in increased grinding power and poor cutting quality.
配合量についても、2〜l Ovoβ%であって、これ
以下であると砥石が発泡し膨張し易く、仕様通りのサイ
ズの砥石を製造することか困難になる7一方、1ovo
I2%を越えて配合すると、ボンドの溶けが悪くなり、
また製造した砥石の砥粒も脱落し易くなり、工具として
は劣ったものとなり易い。Regarding the blending amount, it is 2 to 1 Ovo β%, and if it is less than this, the whetstone tends to foam and expand, making it difficult to manufacture a whetstone of the size specified.7 On the other hand, 1 ovo
If more than 2% I is added, the bond will not dissolve well,
Furthermore, the abrasive grains of the manufactured whetstone tend to fall off, resulting in an inferior tool.
この結果、従来の如く平均粒径の大である骨材を使用し
た場合と比較して、両方共にほぼ同じ様に強化するが、
研削に際しては1粒径が十分に微細であるためほとんど
研削に関与せず、したがって切れ味を損なう切粉の溶着
や目詰まりがなく、適度に切削刃が再生されるものと推
定している9補助結合材として使用する熱硬化製樹脂と
しては、フェノール樹脂、フラン樹脂、エポキシ樹脂な
ど通常の熱硬化性樹脂を使用できる0通常使用されるデ
キストリン、メリケン粉などの補助結合材では充分な強
度が得られず、生砥石の取扱の困難性だけでなく、気孔
率を高く確保することも困難になる。As a result, compared to the conventional case of using aggregate with a large average particle size, both types of reinforcement are almost the same, but
During grinding, since each particle size is sufficiently fine, it is hardly involved in grinding, so there is no welding or clogging of chips that impair sharpness, and it is estimated that the cutting edge will be regenerated appropriately. As the thermosetting resin used as the binding material, ordinary thermosetting resins such as phenolic resin, furan resin, and epoxy resin can be used.However, sufficient strength cannot be obtained with the commonly used auxiliary binding materials such as dextrin and American flour. Not only is it difficult to handle the green grindstone, but it is also difficult to maintain a high porosity.
配合量は5〜30vof2%である。5voβ%以下だ
と生砥石の強度、保持に充分でなく、また、30 v
o 12%を越えた配合は、カサが大きくなるため成形
時に弾性を有し、加圧を解除したとき弾性回復が生じて
砥石割れの原因となる6熱硬化性樹脂を使用したため、
その硬化温度、例えば150〜160℃位まで加熱し、
硬化させてから型抜きすれば成形も型抜きも容易に行な
える。The blending amount is 5 to 30 vof2%. If it is less than 5voβ%, it will not be strong enough to maintain the raw whetstone, and 30v
o If the blend exceeds 12%, the bulk will increase, so it will have elasticity during molding, and when the pressure is released, elastic recovery will occur, causing cracking of the grindstone.6 Because thermosetting resin was used,
Heating to the curing temperature, for example, about 150 to 160°C,
If you let it harden and then cut it out from the mold, you can easily mold it and cut it out from the mold.
この生砥石は次に焼成するが、その温度は使用したビト
リファイドボンド成分によって好ましい温度は若干異な
るが、通常は800〜1050℃程度の)温度が必要で
ある。これより低温であると、ビトリファイドの溶けが
悪<、出来た砥石の砥粒の保持力が小さいため、砥粒の
脱落が多くなる。一方、あまり高温であると発泡、膨張
を生じ易くなる。This green whetstone is then fired at a temperature of approximately 800 to 1050° C., although the preferable temperature differs slightly depending on the vitrified bond component used. If the temperature is lower than this, the vitrified melts poorly, and the resulting grindstone has a low ability to hold the abrasive grains, resulting in more abrasive grains falling off. On the other hand, if the temperature is too high, foaming and expansion tend to occur.
これらの量的割合は、焼成後の砥石として容積で示せば
、砥粒15〜55voi!、%、ビトリファイドボンド
10〜30vol%、骨材(微粉)2〜10 v o
(1,%、気孔20−50 v o 12%である。原
料組成として、超砥粒15〜55vol%、骨材2〜1
0vol%、ビトリファイドボンド10〜30voβ%
、熱硬化性樹脂5〜30voQ%であるが、熱硬化性樹
脂は焼成段階で燃焼して気孔になるためか、砥石構成と
あまり大きな差はないようである
[実施例1
以下、実施例により本発明を説明する。These quantitative ratios are 15 to 55 voi of abrasive grains if expressed in volume as a grindstone after firing! , %, vitrified bond 10-30 vol%, aggregate (fine powder) 2-10 vo
(1.%, pores 20-50 vol%. Raw material composition: super abrasive grains 15-55 vol%, aggregate 2-1 vol%.
0vol%, vitrified bond 10-30voβ%
, the thermosetting resin is 5 to 30 voQ%, but it seems that there is not much difference from the grinding wheel structure, probably because the thermosetting resin burns during the firing stage and becomes pores [Example 1 Below, according to the example The present invention will be explained.
(実施例1)
CB N砥粒(SBN−B昭和電工製、粒度170/2
00)25vol%とホウケイ酸系のビトリファイドボ
ンド(SiO□75%、Aff。(Example 1) CB N abrasive grains (SBN-B manufactured by Showa Denko, particle size 170/2
00) 25vol% and borosilicate-based vitrified bond (SiO□75%, Aff.
0.3%、B20310%、残アルカリ及びアルカリ土
類金属酸化物)28voj2%に骨材(アルミナ、平均
粒径0.45μ)7Voff%を加え、−次結合材とし
てフェノール樹脂を砥石容積の15v02%を加えたも
のを原料(気孔25voI2%)とした、CBN砥粒、
ビトリファイドボンドおよび骨材の比率は焼成後の砥石
が容積割合で砥粒25voQ%、ビトリファイドボンド
28vo12%、骨材7voJ2%、気孔率40vol
%になった。加圧成型と同時に金型温度が150〜16
0℃になるまで加熱した。この後、950℃で6時間保
持の条件で焼結した。0.3%, B203 10%, residual alkali and alkaline earth metal oxides) 28voj2%, aggregate (alumina, average particle size 0.45μ) 7Voff% was added, and phenol resin was added as a secondary binder to 15v02 of the grinding wheel volume. CBN abrasive grains with 25% pores as raw material (25voI2%)
The ratio of vitrified bond and aggregate is that the volume ratio of the grindstone after firing is abrasive grains 25voQ%, vitrified bond 28vo12%, aggregate 7voJ2%, and porosity 40vol.
%Became. At the same time as pressure molding, the mold temperature is 150-16
It was heated until it reached 0°C. Thereafter, sintering was carried out under the condition of holding at 950° C. for 6 hours.
(比較例1)
CBN砥粒(SUN−B昭和電工製、粒度170/20
0)とホウケイ酸系のビトリファイドボンドにアルミナ
WAの骨材(粒度#220)を加え、−次結合材として
4%水溶液のアラビゴムを原料の5wt%を加えた。C
BN砥粒、ビトリファイドボンドおよび骨材の比率は焼
成後の砥石が容積割合で砥粒25voI2%、結合材2
8voI2%、骨材17vol%、気孔30vot2%
になる様に配合割合を決定して作成したものである。加
圧成型後、950℃で6時間保持の条件で焼結した。(Comparative Example 1) CBN abrasive grains (SUN-B manufactured by Showa Denko, particle size 170/20
Alumina WA aggregate (particle size #220) was added to 0) and borosilicate-based vitrified bond, and 5 wt% of the raw material was added with a 4% aqueous solution of gum arabic as a secondary binder. C
The ratio of BN abrasive grains, vitrified bond, and aggregate is that the volume ratio of the grindstone after firing is 25voI2% abrasive grains and 2% binding material.
8voI2%, aggregate 17vol%, pores 30vot2%
It was created by determining the blending ratio so that After pressure molding, it was sintered at 950°C for 6 hours.
(比較例2)
実施例1における骨材(平均粒径0645μm)に代え
て、平均粒径3μmのアルミナ粉末を使用した以外は全
く同じ製造法を繰り返した6以上の方法で砥石用セグメ
ントを作成し、これをアルミ台金上にエポキシ系の接着
剤で張り付は砥石にした。研削性能を調べるため、以下
の条件で研削試験を行なった。(Comparative Example 2) Segments for grinding wheels were created by repeating the same manufacturing method in six or more ways except that alumina powder with an average particle size of 3 μm was used instead of the aggregate (average particle size of 0645 μm) in Example 1. This was then attached to an aluminum base using epoxy adhesive to form a grindstone. In order to examine the grinding performance, a grinding test was conducted under the following conditions.
砥石+ 14AI型150°x L25’x 15”
x 5’x 3Xx 76.2’研削盤:横軸平面研削
盤(砥石軸モータ3.7KW l被削材:SにH51f
H11G62〜64)被研削面200慣×100關5K
IIII fHRc62−641被研削面200mX
100mm研削方法:湿式平面トラバース研削
砥石周速度: 1500rM/分、テーブル速度: 1
5n+/分切 込: 20LL、クロス送り 2rs
rs/バス研削液:ソリュブルタイプ、50倍液、9ρ
/分上記の条件で、被削材を各々#60ccづつ削った
時に得られた試験結果を表1にまとめた。Whetstone + 14AI type 150° x L25'x 15"
x 5'x 3Xx 76.2' Grinding machine: horizontal axis surface grinding machine (grinding wheel shaft motor 3.7KW l Work material: S to H51
H11G62~64) Surface to be ground 200mm x 100mm 5K
III fHRc62-641 Ground surface 200mX
100mm grinding method: wet plane traverse grinding wheel peripheral speed: 1500 rM/min, table speed: 1
5n+/min depth of cut: 20LL, cross feed 2rs
rs/bath grinding fluid: soluble type, 50x fluid, 9ρ
Table 1 summarizes the test results obtained when each workpiece was cut by #60cc under the above conditions.
(以下余白)
表1
研削比=被削材研削量/砥石損耗量
研削動カニ砥石軸モータの研削時の消費電力(W)(以
下余白)
[効果J
以上の結果からもわかる様に、本発明の砥石は研削量は
同一でも研削動力が小さくて済み、切れ味が優れている
ことが明らかであり、また研削比の値も大きく、砥石の
寿命が長いことも明らかである。(Left below) Table 1 Grinding ratio = Workpiece material grinding amount / Grinding wheel wear amount Grinding Power consumption (W) during grinding of the movable crab grinding wheel shaft motor (Left below) [Effect J As can be seen from the above results, It is clear that the grinding wheel of the invention requires less grinding power even though the amount of grinding is the same, and has excellent sharpness.It is also clear that the value of the grinding ratio is large, and the life of the grinding wheel is long.
すなわち、骨材を微粉化することにより、骨材を研削に
関与させず、さらに熱硬化性樹脂を併用することにより
生砥石の取り扱いを容易にしながら気孔率を高くして研
削性を高めた。That is, by pulverizing the aggregate, the aggregate is not involved in grinding, and by using a thermosetting resin in combination, the raw grinding stone is made easier to handle, and the porosity is increased to improve grindability.
本発明は、従来骨材の使用が砥石の強度向上には資して
も、研削に関与して切れ味を悪くしていたのを完全に刈
除したものである。The present invention completely eliminates the conventional use of aggregate, which contributes to improving the strength of the grindstone, but contributes to the grinding process and impairs sharpness.
Claims (4)
使用した超砥粒ビトリファイドボンド砥石。(1) A super-abrasive vitrified bond whetstone that uses fine powder with an average particle size of 2 μm or less as the aggregate of the whetstone.
2μm以下の酸化物微粉2vol%〜10vol%、ビ
トリファイドボンド10〜30vol%、残り気孔であ
る超砥粒ビトリファイドボンド砥石。(2) A superabrasive vitrified bond grinding wheel comprising 15 to 55 vol% of superabrasive grains, 2 vol% to 10 vol% of oxide fine powder with an average particle size of 2 μm or less as aggregate, 10 to 30 vol% of vitrified bond, and remaining pores.
の酸化物微粉2〜10vol%、ビトリファイドボンド
10〜30vol%、熱硬化性樹脂5〜30vol%を
混合し、成形して800〜1050℃で焼結させること
を特徴とする超砥粒ビトリファイドボンド砥石の製造方
法。(3) 15 to 55 vol% of super abrasive grains, 2 to 10 vol% of oxide fine powder with an average particle size of 2 μm or less, 10 to 30 vol% of vitrified bond, and 5 to 30 vol% of thermosetting resin are mixed and molded to a powder of 800 to 1050 vol. A method for producing a super-abrasive vitrified bond grindstone characterized by sintering at ℃.
の酸化物微粉2〜10vol%、ビトリファイドボンド
10〜30vol%、熱硬化性樹脂5〜30vol%を
混合し、金型にて成型、150〜160℃に加熱後金型
より取り出し、ついで、800〜1050℃で焼結させ
ることを特徴とする超砥粒ビトリファイドボンド砥石の
製造方法。(4) 15 to 55 vol% of super abrasive grains, 2 to 10 vol% of oxide fine powder with an average particle size of 2 μm or less, 10 to 30 vol% of vitrified bond, and 5 to 30 vol% of thermosetting resin are mixed, and molded in a mold, A method for producing a superabrasive vitrified bond grindstone, which comprises heating to 150 to 160°C, removing it from a mold, and then sintering at 800 to 1050°C.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63095712A JP2678288B2 (en) | 1988-04-20 | 1988-04-20 | Superabrasive vitrified bond grindstone and manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63095712A JP2678288B2 (en) | 1988-04-20 | 1988-04-20 | Superabrasive vitrified bond grindstone and manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01271177A true JPH01271177A (en) | 1989-10-30 |
JP2678288B2 JP2678288B2 (en) | 1997-11-17 |
Family
ID=14145103
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63095712A Expired - Lifetime JP2678288B2 (en) | 1988-04-20 | 1988-04-20 | Superabrasive vitrified bond grindstone and manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2678288B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995008417A1 (en) * | 1993-09-23 | 1995-03-30 | Norton Company | Process for inducing porosity in an abrasive article |
JP2006346800A (en) * | 2005-06-15 | 2006-12-28 | Disco Abrasive Syst Ltd | Vitrified bond whetstone and manufacturing method thereof |
JP2014061585A (en) * | 2012-08-29 | 2014-04-10 | Allied Material Corp | Vitrified bond super-abrasive wheel and method for grinding wafer using the same |
US12017328B2 (en) | 2022-09-28 | 2024-06-25 | Tokyo Diamond Tools Mfg. Co., Ltd. | Synthetic grindstone, synthetic grindstone assembly, and method of manufacturing synthetic grindstone |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102658606A (en) * | 2012-05-11 | 2012-09-12 | 香港雅诚国际有限公司 | Method for manufacturing resin diamond wire |
EP3231558B1 (en) | 2016-04-11 | 2020-02-05 | 3M Innovative Properties Company | A green body, a grinding wheel and a method for manufacturing at least a green body |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5641391A (en) * | 1979-09-13 | 1981-04-18 | Kasatani Hatsujo Kk | Automatic continuous alkali cleaning device |
JPS6219377A (en) * | 1985-07-18 | 1987-01-28 | F S K:Kk | Superfine-sand grindstone |
-
1988
- 1988-04-20 JP JP63095712A patent/JP2678288B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5641391A (en) * | 1979-09-13 | 1981-04-18 | Kasatani Hatsujo Kk | Automatic continuous alkali cleaning device |
JPS6219377A (en) * | 1985-07-18 | 1987-01-28 | F S K:Kk | Superfine-sand grindstone |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995008417A1 (en) * | 1993-09-23 | 1995-03-30 | Norton Company | Process for inducing porosity in an abrasive article |
JP2006346800A (en) * | 2005-06-15 | 2006-12-28 | Disco Abrasive Syst Ltd | Vitrified bond whetstone and manufacturing method thereof |
JP2014061585A (en) * | 2012-08-29 | 2014-04-10 | Allied Material Corp | Vitrified bond super-abrasive wheel and method for grinding wafer using the same |
US12017328B2 (en) | 2022-09-28 | 2024-06-25 | Tokyo Diamond Tools Mfg. Co., Ltd. | Synthetic grindstone, synthetic grindstone assembly, and method of manufacturing synthetic grindstone |
Also Published As
Publication number | Publication date |
---|---|
JP2678288B2 (en) | 1997-11-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6209636B2 (en) | Abrasive article | |
KR100359401B1 (en) | Abrasive Tools | |
JP5539339B2 (en) | High porosity vitrified superabrasive product and manufacturing method | |
JPH10113875A (en) | Super abrasive grain abrasive grindstone | |
JP2006346857A (en) | Polishing tool | |
JP2003500229A (en) | Abrasive tool for grinding electronic components | |
JP2001205566A (en) | Resin-impregnated vitrified grinding wheel and its manufacturing method | |
JP2003512937A (en) | Thin whetstone rigidly connected | |
KR20000048975A (en) | Silicon carbide abrasive wheel | |
US9266219B2 (en) | Bonded abrasive article and method of grinding | |
JPH03281174A (en) | Porous grinding stone having huge blow hole | |
KR20000005280A (en) | Glass grinding machine including metal-clothed abrasive | |
JPH01271177A (en) | Super abrasive grain vitrified bond grinding stone and manufacture thereof | |
CN111571462A (en) | Grindstone and method for producing grindstone | |
JPS63256364A (en) | Porous grindstone of super abrasive grain | |
JPH08257920A (en) | Porous vitrified super abrasive grinding wheel and manufacture therefor | |
JPH03264263A (en) | Porous metal bond grinding wheel and manufacture thereof | |
JPH11188626A (en) | Ceramics dress substrate | |
JP2008030157A (en) | Porous abrasive wheel and manufacturing method thereof | |
JPS62251077A (en) | Vitrifide grinding element | |
JPH10138148A (en) | Vitrified extra-abrasive grain grinding wheel | |
JP2000246647A (en) | Vitrified extra-abrasive grain grinding wheel and manufacture thereof | |
KR100334430B1 (en) | Tip manufacturing method of grinding wheel | |
JP2003094342A (en) | Resinoid grinding wheel using epoxy resin opacifier liquid and its manufacturing method | |
JPS60186376A (en) | Abrasive molded body |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080801 Year of fee payment: 11 |