JPH01264185A - Socket for measuring integrated circuit - Google Patents
Socket for measuring integrated circuitInfo
- Publication number
- JPH01264185A JPH01264185A JP9207888A JP9207888A JPH01264185A JP H01264185 A JPH01264185 A JP H01264185A JP 9207888 A JP9207888 A JP 9207888A JP 9207888 A JP9207888 A JP 9207888A JP H01264185 A JPH01264185 A JP H01264185A
- Authority
- JP
- Japan
- Prior art keywords
- socket
- contacts
- insulation body
- top surface
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005259 measurement Methods 0.000 claims abstract description 3
- 239000012212 insulator Substances 0.000 claims description 20
- 238000009413 insulation Methods 0.000 abstract 6
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Connecting Device With Holders (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、集積回路の電気特性測定の際に、被測定集積
回路のリード端子と測定装置との接続をとるために、被
測定集積回路が装着されるソケットに関する。Detailed Description of the Invention [Industrial Application Field] The present invention provides a method for connecting the lead terminals of the integrated circuit to be measured with a measuring device when measuring the electrical characteristics of the integrated circuit. Regarding the socket to which the is attached.
従来、例えばパッケージ本体の一つの面から一列に並ん
だ多数のリード端子が外方に突き出ている型の集積回路
(以下ICという)を装着するのに用いるソケットは、
例えば第2図の側面図に示すように、装着ICのリード
端子と接触する接触子2が、平行6面体のソケット絶縁
体11内の上面側に設けられ、この接触子とつながるソ
ケットピン3が絶縁体11の下面から外方に突き出され
ており、かつ、接触子2の上部露出部と絶縁体11の上
面とはほぼ同一面上にあった。Conventionally, sockets used to mount integrated circuits (hereinafter referred to as ICs) in which a large number of lead terminals lined up in a row protrude outward from one surface of a package body, for example, have been used.
For example, as shown in the side view of FIG. 2, a contact 2 that contacts the lead terminal of the attached IC is provided on the upper surface side of the parallelepiped socket insulator 11, and a socket pin 3 connected to this contact is provided. It protruded outward from the lower surface of the insulator 11, and the upper exposed portion of the contactor 2 and the upper surface of the insulator 11 were substantially on the same plane.
上述した従来のソケットは、接触子の上部と、これを内
部に保持するソケット絶縁体の上面がほぼ同一面上にあ
る為、被測定ICの温度が常温又は高温においては問題
とならないが、被測定1.Cが低温の場合には、被測定
ICのリード端子が突出しているパッケージ本体の下面
がソケット絶縁体の上面に密着し、接触子間に霜が付き
易く、測定を重ねるにつれ、ソケットの接触子間でリー
クを起こすという問題があった。In the conventional socket described above, the upper part of the contact and the upper surface of the socket insulator that holds it inside are almost on the same plane, so there is no problem when the temperature of the IC to be measured is room temperature or high temperature, but Measurement 1. When C is low, the bottom surface of the package body from which the lead terminals of the IC under test protrude will come into close contact with the top surface of the socket insulator, and frost will easily form between the contacts. There was a problem with leaks occurring between the two.
本発明のソケットは、被測定ICのリード端子と接触す
る接触子とこれを内部に保持固定しているソケット絶縁
体とからなり、かつ、前記接触子が設けられているソケ
ット絶縁体の上面側において、隣り合う接触子間の中間
部に、被測定ICを本ソケットに装着したとき、前記被
測定ICのリード端子が突き出ている。パッケージ本体
の下面が、前記ソケット絶縁体の上面と密着接触しない
ようにするための突起を設けている。The socket of the present invention comprises a contact element that comes into contact with a lead terminal of an IC to be measured, and a socket insulator that holds and fixes the contact element inside, and the upper surface side of the socket insulator on which the contact element is provided. In this case, when the IC to be measured is mounted on the main socket, the lead terminal of the IC to be measured protrudes from the intermediate portion between adjacent contactors. A protrusion is provided to prevent the lower surface of the package body from coming into close contact with the upper surface of the socket insulator.
つぎに本発明を実施例により説明する。 Next, the present invention will be explained by examples.
第1図(a)は本発明の一実施例の平面図、同図(b)
は側面図、同図(c)は縦面図である。これらの図にお
いて、電気特性測定のために装着されるICのリード端
子と接触する多数の接触子2゜2、・・・は、平行6面
体のソケット絶縁体1の内部に保持固定されている。ま
た、各接触子につながるソケットピン3がソケット絶縁
体1の下面から外部に突き出されている。上部をソケッ
ト絶縁体1の上面部に露出している接触子2の隣り合う
中間部のソケット絶縁体lの上面には、この上面部を横
切るような凸条4が設けられており、この凸条4により
、このソケットに装着したICのパッケージ本体の下面
が、ソケット絶縁体の上面に密着接触しないようになっ
ている。FIG. 1(a) is a plan view of an embodiment of the present invention, and FIG. 1(b) is a plan view of an embodiment of the present invention.
is a side view, and the same figure (c) is a vertical view. In these figures, a large number of contacts 2゜2, . . Further, socket pins 3 connected to each contactor are protruded from the lower surface of the socket insulator 1 to the outside. On the upper surface of the socket insulator l at the intermediate part between adjacent contacts 2 whose upper portions are exposed on the upper surface of the socket insulator 1, a protruding strip 4 is provided so as to cross this upper surface. The strip 4 prevents the lower surface of the package body of the IC mounted in this socket from coming into close contact with the upper surface of the socket insulator.
上述のとおり本発明のソケットには、多数の接触子が一
列に並んで設けられているソケット絶縁体の前記接触子
の隣り合う中間の上面には凸条があることにより、この
ソケットに装着したICのリード端子が突き出ているパ
ッケージ本体下面は、ソケット絶縁体の上面に密着接触
しない。よって、装着ICが低温の場合でも、ICとソ
ケット絶縁体との間には距離があるため、接触子近傍に
霜が付き難く、よって霜付着によるリークは起らない。As mentioned above, in the socket of the present invention, a large number of contacts are arranged in a row, and the socket insulator has a convex strip on the upper surface between adjacent contacts. The lower surface of the package body from which the IC lead terminals protrude does not come into close contact with the upper surface of the socket insulator. Therefore, even when the mounted IC is at a low temperature, there is a distance between the IC and the socket insulator, so frost is difficult to form near the contacts, and therefore leakage due to frost does not occur.
さらに、凸条により接触子間の沿面距離が長くなってい
るため、電流のリーク経路が長くなり、これによっても
リーク防止効果が増大されている。Furthermore, since the creepage distance between the contacts is increased by the protrusions, the current leakage path becomes longer, which also increases the leakage prevention effect.
第1図(a) 、 (b) 、 (c)はそれぞれ本発
明の一実施例の平面図、側面図、縦面図である。第2図
は従来のソケットの側面図である。
1.11・・・・・・ソケット絶縁体、2・・・・・・
接触子、3・・・・・・ソケットピン、4・・・・・・
凸条(凸起)。
代理人 弁理士 内 原 音
(tz)
(b) (c)
第 l 図
箭Z図FIGS. 1(a), 1(b), and 1(c) are a plan view, a side view, and a vertical view, respectively, of an embodiment of the present invention. FIG. 2 is a side view of a conventional socket. 1.11...Socket insulator, 2...
Contact, 3...Socket pin, 4...
Convex rays (protrusions). Agent Patent Attorney Uchihara Oto (tz) (b) (c) Part l Diagram Z
Claims (1)
ケット絶縁体の上面側の穴内に配置され、この接触子と
つながるソケットピンが前記ソケット絶縁体の外方に引
出されている集積回路のソケットにおいて、前記接触子
の隣り合う中間の前記ソケット絶縁体の上面には、前記
装着集積回路のパッケージ本体のリード端子面が前記ソ
ケット絶縁体の上面と面接触するのを妨げるための突起
が設けられていることを特徴とする集積回路測定用ソケ
ット。A socket for an integrated circuit in which a contact that contacts a lead terminal of an integrated circuit to be mounted is arranged in a hole on the upper surface side of a socket insulator, and a socket pin connected to the contact is drawn out of the socket insulator. , a protrusion is provided on the upper surface of the socket insulator between the adjacent contacts to prevent the lead terminal surface of the package body of the attached integrated circuit from coming into surface contact with the upper surface of the socket insulator. An integrated circuit measurement socket characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9207888A JPH01264185A (en) | 1988-04-13 | 1988-04-13 | Socket for measuring integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9207888A JPH01264185A (en) | 1988-04-13 | 1988-04-13 | Socket for measuring integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01264185A true JPH01264185A (en) | 1989-10-20 |
Family
ID=14044413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9207888A Pending JPH01264185A (en) | 1988-04-13 | 1988-04-13 | Socket for measuring integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01264185A (en) |
-
1988
- 1988-04-13 JP JP9207888A patent/JPH01264185A/en active Pending
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