JPH01262649A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPH01262649A JPH01262649A JP63090265A JP9026588A JPH01262649A JP H01262649 A JPH01262649 A JP H01262649A JP 63090265 A JP63090265 A JP 63090265A JP 9026588 A JP9026588 A JP 9026588A JP H01262649 A JPH01262649 A JP H01262649A
- Authority
- JP
- Japan
- Prior art keywords
- fins
- semiconductor device
- resin
- package
- sections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 11
- 239000011347 resin Substances 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 238000005452 bending Methods 0.000 abstract description 7
- 238000004080 punching Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（発明の目的〕
（産業上の利用分野）
本発明は半導体装置にかかり、特にフィンを備えた樹脂
モールド型の半導体装置に関する。DETAILED DESCRIPTION OF THE INVENTION (Objective of the Invention) (Industrial Field of Application) The present invention relates to a semiconductor device, and more particularly to a resin-molded semiconductor device having fins.
（従来の技術）
半導体装置でフィンを有する樹脂モールド型のＩＣを第
３図に示す。(Prior Art) FIG. 3 shows a resin mold type IC which is a semiconductor device and has fins.
第３図（ａ）に斜視図で、また（ｂ）に（ａ）のＡＡ線
に沿う断面図で示される１０１は平板状の樹脂モールド
外囲器で、その両側面から複数本のり−ド１０２が突出
し、樹脂モールド外囲器ｌｏｔに近い部位で下面側に向
は曲げ加工が施されており、さらに。3(a) is a perspective view, and FIG. 3(b) is a cross-sectional view taken along line AA in FIG. 102 protrudes, and a bending process is applied to the lower surface side at a portion close to the resin mold envelope lot.
上記リード群の中央にこのリードと同じ曲げ加工が施さ
れたフィン１０３が設けられている。叙上の如きＤＩＰ
型ＩＣは第４図に平面図で示されるリードフレーム１０
４によって形成される。すなわち、リードフレーム中央
部のチップベツド部１０３ａにチップ１０５（第３図（
ｂ））をチップボンディング、ワイヤボンディング等に
よって取着したのち、樹脂モールドを施して外囲器１０
１を形成する。ついで、リードカット、リード曲げ加工
（リードベンド）等を施してｉＣが得られるものである
。A fin 103 is provided at the center of the lead group, which is bent in the same way as the lead. DIP as described
The type IC has a lead frame 10 shown in plan view in FIG.
Formed by 4. That is, the chip 105 (see FIG.
b)) is attached by chip bonding, wire bonding, etc., and then resin molded to form the envelope 10.
form 1. Then, lead cutting, lead bending, etc. are performed to obtain an iC.
（発明が解決しようとする課題）
上記従来のＩＣにおいては、樹脂モールド封止後のリー
ド曲げ加工工程でリードとフィンの折曲げ部に応力がか
かる。特にフィンはリードに比し幅が広いために大きな
応力がかかる。このリードおよびフィンの折曲げ部を第
３図（ｂ）に破線円ＣＢ）で、また、該部の拡大図で第
３図（Ｃ）に示すように。(Problems to be Solved by the Invention) In the conventional IC described above, stress is applied to the bent portions of the leads and fins in the lead bending process after resin mold sealing. In particular, the fins are wider than the leads, so they are subject to a large stress. The bent portion of the lead and fin is shown in FIG. 3(b) as a broken line circle CB), and an enlarged view of the portion is shown in FIG. 3(c).
フィンの曲げ部には口開きを生ずる。１０６はフィンの
口開部を示す。An opening is created at the bend of the fin. 106 indicates the mouth opening of the fin.
上記口開きはリードやフィンの板厚が厚いほど生じやす
く、また、外囲器に発生をみるクラックの原因ともなっ
ている。これにより、水、異物等が浸入しやすく、ＩＣ
の信頼性に悪影響を及ぼす。The thicker the leads and fins are, the more likely the gap is to occur, and is also a cause of cracks that occur in the envelope. This allows water, foreign matter, etc. to easily enter the IC.
has a negative impact on reliability.
この発明は叙上の課題を解決するためになされたもので
、樹脂モールド外囲器から板状のフィンを突出させた樹
脂封止型半導体装置の改良構造を提供することを目的と
する。The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide an improved structure of a resin-sealed semiconductor device in which plate-shaped fins are protruded from a resin molded envelope.
（課題を解決するための手段）
本発明にかかる半導体装置は、樹脂モールド外囲器から
板状のフィンを突出させた樹脂封止型半導体装置におい
て、フィンが外囲器からの突出部分にその板厚方向の透
孔を具備したことを特徴とするものである。(Means for Solving the Problems) A semiconductor device according to the present invention is a resin-sealed semiconductor device in which plate-shaped fins protrude from a resin-molded envelope, and the fins are attached to the protruding portion from the envelope. It is characterized by having through holes in the thickness direction.
（作 用）
本発明はフィンとリード、特にフィン部に曲げ加工によ
って生ずる応力が低下でき、口開きや樹脂外囲器のクラ
ックが防止できる。(Function) The present invention can reduce the stress caused by bending in the fins and leads, especially in the fin portion, and can prevent openings and cracks in the resin envelope.
（実施例）
以下５本発明にかかる一実施例のフィン付きＩＣにつき
図面を参照して説明する。なお、説明において従来と変
わらない部分については、図面に従来と同じ符号をつけ
て示し、説明を省略する。(Embodiment) Hereinafter, five finned ICs according to an embodiment of the present invention will be described with reference to the drawings. In addition, in the description, parts that are the same as the conventional one are shown in the drawings with the same reference numerals as the conventional one, and the explanation will be omitted.
第１図（ａ）に斜視図で、また（ｂ）に（ａ）のＣＣ線
に沿う断面図で示されるように、樹脂モールド外囲器１
０１から突出したフィン１１に一例の長孔１１ａが設け
られている。この長孔１１ａの寸法はフィン１１の幅や
、板厚により設定されるが、フィンの熱伝導性、強度等
からしてフィンの幅の略１７２程度がよい。なお、第３
図（ｂ）におけるＩｌｂはチップ１０５がマウントされ
るチップベツド部である。As shown in FIG. 1(a) in a perspective view and in FIG. 1(b) in a sectional view taken along line CC in FIG.
An example long hole 11a is provided in the fin 11 protruding from the fin 01. The dimensions of this elongated hole 11a are determined by the width of the fin 11 and the thickness of the plate, but from the viewpoint of the thermal conductivity and strength of the fin, it is preferably about 172 mm of the width of the fin. In addition, the third
Ilb in Figure (b) is a chip bed portion on which the chip 105 is mounted.
次に、第２図に叙上のＩＣの組立に用いられるリードフ
レーム■を平面図で示す、このリードフレームＵにおい
ては、フィン１１が樹脂モールド外囲器の側面から突出
する部位に、このリードフレームのプレス抜き加工と同
時に予め形成される。Next, FIG. 2 shows a plan view of the lead frame (2) used for assembling the above-described IC. It is preformed at the same time as the frame press punching process.
叙上の実施例はＤＩＰ型ＩＣの場合を例示したが。In the above embodiment, the case of a DIP type IC was exemplified.
これに限られるものでなく、外囲器の西側面からフィン
を突出させたもの等、広く適用できる。The present invention is not limited to this, and can be widely applied to a structure in which fins are protruded from the west side of the envelope.
この発明によれば、フィンの樹脂封止部からの突出部に
長孔が設けられて曲げ加工による応力を低下させること
ができ、口開きや、外囲器に生ずるクラックが完全に防
止される。これにより、品質の安定と、向上に顕著な効
果がある。According to this invention, the elongated hole is provided in the protruding part from the resin sealing part of the fin, so that the stress caused by bending can be reduced, and openings and cracks that occur in the envelope are completely prevented. . This has a significant effect on stabilizing and improving quality.
第１図は本発明にかかる一実施例のＩＣの（ａ）は斜視
図、（ｂ）は（ａ）のＣＣ線に沿う断面図、第２図は本
発明の一実施例に用いられるリードフレームの正面図、
第３図は従来例のＩＣの（ａ）は斜視図。
（ｂ）は（ａ）のＡＡ線に沿う断面図、（Ｃ）は（ｂ）
のＢ部を拡大して示す断面図、第４図は従来例のＩＣに
用いられるリードフレームの正面図である。
１１−−−−フィン
１１ａ−−−一長孔
１１ｂ−−−−チップベツド
Ｕ−一一一リードフレーム
１０１−−−一樹脂モールド外囲器
１０５−−−−チップ
代理人 弁理士 大 胡 典 夫
ｌｌ： フ（ン ／／ａ ： 長子ムｔｔｎ
； テ、２プ公ッド
渠１図
＠ ２ 図
７０１ ７ 末灯月をモールドタト団名シ１ｏｚ ：
リード １０３ ： フィン１０３ａ：チップ
イッド部 １０ｓ：ナツツ。
第 ３ 図 （蔓のＩン
（Ｃ）
／（Ｍｓ：Ｄ開部
第 ３ 図 （受Φ２）
第 ４ 図FIG. 1 is a perspective view of an IC according to an embodiment of the present invention, FIG. 2B is a sectional view taken along line CC in FIG. 2, and FIG. front view of the frame,
FIG. 3 is a perspective view (a) of a conventional IC. (b) is a cross-sectional view along line AA in (a), (C) is (b)
FIG. 4 is an enlarged sectional view showing part B of FIG. 4, and FIG. 4 is a front view of a lead frame used in a conventional IC. 11---Fin 11a---Elongated hole 11b---Chip bed U-111 Lead frame 101---1 Resin molded envelope 105---Chip agent Patent attorney Norifu Ogo ll: Fu(n) //a: Firstborn Muttn
; Te, 2 Pukoddo 1 Figure @ 2 Figure 701 7 Mold Tato group name 1oz:
Lead 103: Fin 103a: Chip id part 10s: Natsutsu. Fig. 3 (Vine I (C) / (Ms:D opening Fig. 3 (Reception Φ2) Fig. 4
Claims (1)
脂封止型半導体装置において、フィンが外囲器からの突
出部分にその板厚方向の透孔を具備したことを特徴とす
る半導体装置。1. A resin-sealed semiconductor device having a plate-shaped fin protruding from a resin molded envelope, characterized in that the fin has a through hole extending in the thickness direction of the fin in the protruding portion from the envelope.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63090265A JPH01262649A (en) | 1988-04-14 | 1988-04-14 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63090265A JPH01262649A (en) | 1988-04-14 | 1988-04-14 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01262649A true JPH01262649A (en) | 1989-10-19 |
Family
ID=13993674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63090265A Pending JPH01262649A (en) | 1988-04-14 | 1988-04-14 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01262649A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6165818A (en) * | 1997-05-21 | 2000-12-26 | Nec Corporation | Method of manufacturing a semiconductor device with a pair of radiating terminals and a plurality of lead terminals formed from a single lead frame |
| KR20010087803A (en) * | 2001-06-07 | 2001-09-26 | 김덕중 | Small Out-line Package improving thermal performance |
-
1988
- 1988-04-14 JP JP63090265A patent/JPH01262649A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6165818A (en) * | 1997-05-21 | 2000-12-26 | Nec Corporation | Method of manufacturing a semiconductor device with a pair of radiating terminals and a plurality of lead terminals formed from a single lead frame |
| KR20010087803A (en) * | 2001-06-07 | 2001-09-26 | 김덕중 | Small Out-line Package improving thermal performance |
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