JPH01256190A - Conductive lead - Google Patents
Conductive leadInfo
- Publication number
- JPH01256190A JPH01256190A JP63084728A JP8472888A JPH01256190A JP H01256190 A JPH01256190 A JP H01256190A JP 63084728 A JP63084728 A JP 63084728A JP 8472888 A JP8472888 A JP 8472888A JP H01256190 A JPH01256190 A JP H01256190A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- solder
- conductive lead
- conductive
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、半田や導電性樹脂等によシ、基板上の複数の
被結線パターンと高密度に接続するフィルムキャリヤ等
の同一面内に配列された複数の導電性リードの構造に関
するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is applicable to solder, conductive resin, etc., which are arranged on the same plane of a film carrier or the like that connects a plurality of wired patterns on a substrate with high density. The present invention relates to the structure of a plurality of conductive leads.
従来の技術
従来の導電性リードの構造は例えば第４図に示すように
（実公昭６１−１７５４号公報）フィルム１に固定され
た導電性リード２に小穴３を設けて半田６が導電性リー
ド２と基板ｅ上の配線パターン７０間よシはみだす量を
少なくシ、隣シの導電性リードと電気的に短絡すること
を防いでいた。2. Prior Art The structure of a conventional conductive lead is, for example, as shown in FIG. 4 (Japanese Utility Model Publication No. 1754/1983), in which a small hole 3 is provided in a conductive lead 2 fixed to a film 1, and a solder 6 is attached to the conductive lead. The amount of protrusion between the wiring pattern 70 on the substrate e and the wiring pattern 70 on the substrate e is reduced, thereby preventing an electrical short circuit with an adjacent conductive lead.
発明が解決しようとする課題
しかし、前述の従来構造では小穴が貫通であるので導電
性リードの強度を大きくすることができず、小穴箇所以
外の半田は前記リードに押されて隣シの導電性リードの
方向へはみだし、高密度の結線では短絡しやすいという
問題がある。Problems to be Solved by the Invention However, in the conventional structure described above, since the small hole is a through hole, it is not possible to increase the strength of the conductive lead, and the solder in areas other than the small hole is pushed by the lead, causing the conductive lead of the adjacent wire to increase. There is a problem that it protrudes in the direction of the leads and is prone to short circuits in high-density connections.
課題を解決するための手段
本発明の導電性リード構造は、貫通する小穴と、塗布し
た半田等が充分に入る大きさの深さの浅い穴をもつもの
である。Means for Solving the Problems The conductive lead structure of the present invention has a small penetrating hole and a shallow hole large enough to accommodate applied solder and the like.
作 用
前記構造の作用は、塗布した半田等が充分に入る大きさ
の深さの浅い穴を設けたことよシ、半田が導電性リード
と基板上の配線パターンとが当接する面にはみださない
。従って、導電性リードよシはみださず隣シの導電性リ
ードと短絡することをなくすことができ、高密度の結線
を実現するととができる。The effect of the above structure is to provide a shallow hole large enough to contain the applied solder, etc., and to prevent the solder from penetrating the surface where the conductive lead contacts the wiring pattern on the board. I don't give out. Therefore, it is possible to prevent the conductive leads from protruding from the conductive leads and to prevent short circuits with adjacent conductive leads, and it is possible to achieve high-density connections.
実施例
以下、本発明の実施例を図面に基づいて説明する。なお
、従来例と共通する要素には同一番号を付す。第１図は
本発明の一実施例の構造をもつ導電性リード２を用いて
基板θ上の配線パターン７と接続した状態を示す断面図
である。同一面内に配列された複数の導電性リード２は
小穴３と小穴３よシ大径で深さの浅い穴４をもつ。基板
ｅ上の前記導電性リード２と同じ間隔をもつ複数の配線
パターン７上にはあらかじめ穴４に入る大きさの半田５
がメツキ又は印刷によシ塗布されている。Embodiments Hereinafter, embodiments of the present invention will be described based on the drawings. Note that elements common to those in the conventional example are given the same numbers. FIG. 1 is a sectional view showing a state in which a conductive lead 2 having a structure according to an embodiment of the present invention is connected to a wiring pattern 7 on a substrate θ. A plurality of conductive leads 2 arranged in the same plane have a small hole 3 and a hole 4 having a larger diameter and shallower depth than the small hole 3. On a plurality of wiring patterns 7 having the same spacing as the conductive leads 2 on the substrate e, solder 5 of a size that can fit into the holes 4 is placed in advance.
is applied by plating or printing.
このようにした複数の導電性リード２と基板６上の複数
の配線パターン７とを穴４を配線パターンγ側にし半田
５が穴４内に位置するようにして、導電性リード２を加
圧、加熱することによりフィルム１上の導電性リード２
と基板ｅ上の配線パターン７とを半田接合する。この時
、穴４の深さは半田５が溶融した降接する程度とする。The plurality of conductive leads 2 and the plurality of wiring patterns 7 on the substrate 6 are connected so that the holes 4 are on the wiring pattern γ side and the solder 5 is located in the holes 4, and the conductive leads 2 are pressurized. , conductive leads 2 on film 1 by heating
and the wiring pattern 7 on the substrate e are soldered together. At this time, the depth of the hole 4 is set to such a level that the melted solder 5 descends.
このようにして接続することによシ半田５は穴４と小穴
３に存在し、導電性リード２よりはみだして隣シの導電
性リードと短絡することがない。By connecting in this manner, the solder 5 is present in the hole 4 and the small hole 3, and does not protrude from the conductive lead 2 and cause a short circuit with an adjacent conductive lead.
上記実施例は半田による接続について説明したが、導電
性の接着樹脂等を用いて接続することもできる。In the above embodiment, connection by solder has been described, but connection can also be made by using conductive adhesive resin or the like.
第２図（ａ）、［有］）及び第３図（ａ） 、 （ｂ）
は、導電性り一ド２の構造を示す実施例の要部上面図及
び側面図である。なお、穴４側に半田６をあらかじめ塗
布しておくこともできる。Figure 2 (a), [Yes]) and Figure 3 (a), (b)
1A and 1B are a top view and a side view of main parts of an embodiment showing the structure of a conductive wire 2. FIG. Note that the solder 6 can also be applied to the hole 4 side in advance.
発明の効果
以上述べてきたように、本発明によれば、半田等が導電
性リードよシはみだして隣りの導電性リードと短絡する
ことがなく、高密度の結線を可能とする。Effects of the Invention As described above, according to the present invention, high-density connection is possible without the solder or the like protruding beyond the conductive lead and causing a short circuit with an adjacent conductive lead.
第１図は本発明の一実施例の構造をもつ導電性リードの
接続状態図、第２図は同導電性リードの構造図、第３図
は本発明の他の実施例の導電性リードの構造図、第４図
は従来例の導電性リードの接続状態図である。
２・・・・・・導電性リード、３・・・・・・小穴、４
・・・・・・穴、６・・・・・・半田、７・・・・・・
配線パターン。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
第４図FIG. 1 is a connection state diagram of a conductive lead having a structure according to an embodiment of the present invention, FIG. 2 is a structural diagram of the same conductive lead, and FIG. 3 is a diagram of a conductive lead according to another embodiment of the present invention. The structural diagram and FIG. 4 are diagrams showing the connection state of conductive leads in a conventional example. 2... Conductive lead, 3... Small hole, 4
...hole, 6...solder, 7...
wiring pattern. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 4
Claims (1)
ドに対向させた複数の被結線パターンとの結線において
、導電性リードに貫通する小穴と、前記小穴と連通し、
塗布した半田等が収容される深さを有する浅い穴を設け
たことを特徴とする導電性リード。In connection between a plurality of conductive leads arranged in the same plane and a plurality of connected patterns facing the leads, a small hole penetrating the conductive lead communicates with the small hole,
A conductive lead characterized by having a shallow hole having a depth to accommodate applied solder, etc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63084728A JPH01256190A (en) | 1988-04-06 | 1988-04-06 | Conductive lead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63084728A JPH01256190A (en) | 1988-04-06 | 1988-04-06 | Conductive lead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01256190A true JPH01256190A (en) | 1989-10-12 |
Family
ID=13838749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63084728A Pending JPH01256190A (en) | 1988-04-06 | 1988-04-06 | Conductive lead |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01256190A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01308092A (en) * | 1988-06-07 | 1989-12-12 | Fuji Photo Optical Co Ltd | Structure of connecting part for printed board |
| KR101008884B1 (en) * | 2008-05-14 | 2011-01-17 | 주식회사 씨엔플러스 | Flexible Cable Connector |
-
1988
- 1988-04-06 JP JP63084728A patent/JPH01256190A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01308092A (en) * | 1988-06-07 | 1989-12-12 | Fuji Photo Optical Co Ltd | Structure of connecting part for printed board |
| KR101008884B1 (en) * | 2008-05-14 | 2011-01-17 | 주식회사 씨엔플러스 | Flexible Cable Connector |
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