JPH01254571A - embossed tape - Google Patents
embossed tapeInfo
- Publication number
- JPH01254571A JPH01254571A JP63070681A JP7068188A JPH01254571A JP H01254571 A JPH01254571 A JP H01254571A JP 63070681 A JP63070681 A JP 63070681A JP 7068188 A JP7068188 A JP 7068188A JP H01254571 A JPH01254571 A JP H01254571A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- cover
- carrier
- tapes
- cover tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000007789 sealing Methods 0.000 abstract description 3
- 238000000926 separation method Methods 0.000 abstract 3
- 238000004049 embossing Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
【発明の詳細な説明】
(発明の技術分野)
本発明は、電子部品を収納するエンボステープに関する
。DETAILED DESCRIPTION OF THE INVENTION (Technical Field of the Invention) The present invention relates to an embossed tape for housing electronic components.
(発明の技術的背景とその問題点)
近時、種々の電子機器が小型化され、かつ組み立て工程
の自動化が図られると共にこれらの機器に使用する電子
部品も、所謂リードレスのチップ型の部品が多用される
傾向にある。(Technical background of the invention and its problems) In recent years, various electronic devices have become smaller and their assembly processes have been automated, and the electronic components used in these devices have also become so-called leadless chip-type components. tends to be used frequently.
特に自動組立工程では、チップ型の電子部品を封入した
エンボステープをロールに巻回し、このロールからテー
プを巻き出しながら、電子部品をハンドラの先端に設け
た真空ビンセットでつまみ上げて、例えばプリント基板
の所定の位置に実装することが行われている。Particularly in automatic assembly processes, embossed tape containing chip-shaped electronic components is wound around a roll, and as the tape is unwound from this roll, the electronic components are picked up by a vacuum bin set at the tip of a handler, and printed, for example. Mounting is performed at a predetermined position on a board.
第4図は、このようなエンボステープの一例を示す斜視
図で、例えばポリスチレン等の合成樹脂製のキャリアテ
ープlの長手方向に沿って、多数の部品収納用の凹所2
を一定の間隔で形成している。FIG. 4 is a perspective view showing an example of such an embossed tape, in which a large number of recesses 2 for storing parts are formed along the longitudinal direction of a carrier tape l made of synthetic resin such as polystyrene.
are formed at regular intervals.
そして、各凹所2には、たとえば第5図に示すように立
方体に成形し、底面両端部に電極11を形成した電子部
品12を収納する。Each recess 2 houses an electronic component 12 formed into a cube, for example as shown in FIG. 5, with electrodes 11 formed on both ends of the bottom surface.
そして、各凹所2の底部中央に、部品12を真空ビンセ
ットでつまみ上げる際に凹所2から突き上げるための透
孔3を穿設している。A through hole 3 is bored in the center of the bottom of each recess 2 for pushing the component 12 up from the recess 2 when picking it up with a vacuum bottle set.
そして、このエンボステープの一例には巻取り、巻出し
を制御するためのガイド孔4を一定の間隔で穿設してい
る。An example of this embossed tape is provided with guide holes 4 at regular intervals for controlling winding and unwinding.
そして、上記凹所2に電子部品を収納した後にキャリア
テープlと同幅のカバーテープ5を上からかぶせて、た
とえば幅方向の両側部をヒートブロックで加熱溶融して
キャリアテープlの各凹所2に収納した電子部品12を
封止してエンボステープを構成するようにしている。After storing the electronic components in the recesses 2, a cover tape 5 having the same width as the carrier tape L is placed over the top, and both sides in the width direction are heated and melted using a heat block, so that each recess of the carrier tape L is heated and melted. The electronic components 12 housed in the tape 2 are sealed to form an embossed tape.
ところで、このような封止工程は、たとえば第6図に示
す平面図のように、キャリアテープlにカバーテープ5
を確実に加熱溶融させる為に、ヒートブロックの端部が
オーバーラツプするように移動させて封止を行う。By the way, such a sealing process is performed by attaching a cover tape 5 to a carrier tape l, for example as shown in the plan view shown in FIG.
In order to reliably heat and melt the heat block, move the ends of the heat block so that they overlap and seal.
このためキャリアテープlとカバーテープ5とを溶融加
熱して固着した部分6に、二重に加熱溶融される部分7
を生じ、このように二重に加熱溶融した部分7は、キャ
リアテープlにカバーテープ5が必要以上に溶融し固着
する。For this reason, a portion 6 where the carrier tape l and the cover tape 5 are melted and heated and fixed, and a portion 7 which is heated and fused doubly.
The portion 7 heated and melted in this way causes the cover tape 5 to melt and adhere to the carrier tape 1 more than necessary.
したがって、第7図に示すカバーテープを剥離するため
に要する力、すなわち剥離力の表のようにエンボステー
プを一定の速さで巻出しつつカバーテープ5を剥す際に
、通常の部分6の剥離力Plに比して二重に加熱溶融し
た部分7で剥離力P2は著しく大きくなる。Therefore, when peeling off the cover tape 5 while unwinding the embossed tape at a constant speed, as shown in the table of force required to peel off the cover tape shown in FIG. The peeling force P2 becomes significantly larger in the portion 7 that is heated and melted twice as compared to the force Pl.
しかして、このようなエンボステープに収納した部品は
、自動組立て機械により、たとえばプリント基板の所定
位置に部品を装着するために用いるので、カバーテープ
の剥離力も所定の範囲内に納まっていることを要求され
、各別に大きな剥離力を必要とすることは問題がある。Since the parts housed in such embossed tape are used, for example, to attach parts to predetermined positions on printed circuit boards using automatic assembly machines, it is necessary to ensure that the peeling force of the cover tape is within a predetermined range. The required and individually large peeling forces are problematic.
(発明の目的)
本発明は、上記の事情に鑑みて成されたもので、電子部
品をエンボステープから取り出す際にカバーテープを剥
すために必要な剥離力の変動を小さくすることができる
エンボステープを提供することを目的とするものである
。(Object of the Invention) The present invention has been made in view of the above circumstances, and is an embossed tape that can reduce fluctuations in the peeling force required to peel off a cover tape when removing electronic components from the embossed tape. The purpose is to provide the following.
(発明の概要)゛
本発明は、キャリアテープとカバーテープを一定長さ毎
に端部に間隙を存しかつ幅方向に一部分をオーバーラツ
プさせて加熱溶融して固着することを特徴とするもので
ある。(Summary of the Invention) The present invention is characterized in that a carrier tape and a cover tape are bonded by heating and melting with gaps at the ends of each fixed length and partially overlapping in the width direction. be.
(実施例)
以下、本発明の一実施例を第1図に示す平面図を参照し
て詳細に説明する。なお第6図と同一部分には同一符号
を付与してその説明を省略する。(Example) Hereinafter, an example of the present invention will be described in detail with reference to a plan view shown in FIG. Note that the same parts as in FIG. 6 are given the same reference numerals and their explanations will be omitted.
図中8は、キャリアテープlとカバーテープ5とを加熱
溶融して固着した部分である。この固着部分8は、たと
えば長手方向の端部を平行かつ斜めに形成したし一ドブ
ロックを用いて、一定の長さ毎に所定の間隙を存して、
かつ端部がオーバーラツプするように固着している。8 in the figure is a portion where the carrier tape 1 and the cover tape 5 are heated and melted and fixed. The fixed portion 8 is made of, for example, a cutter block whose longitudinal ends are parallel and diagonal, with a predetermined gap at each fixed length, and
And the ends are fixed so that they overlap.
このような構成であれば、予め電子部品を収納したエン
ボステープを巻出して部品を取り出し、たとえばプリン
ト基板に実装する場合、そのカバーテープブを剥す際に
、テープを加熱溶融した部分8に比して、その端部は間
隙を存しているので格別大きな剥離力を必要とすること
もない。With such a configuration, when an embossed tape containing electronic components is unwound in advance and the components are taken out and mounted on a printed circuit board, for example, when the cover tape is peeled off, the part 8 where the tape is heated and melted is removed. Since there is a gap at the end, no particularly large peeling force is required.
第2図は、上記実施例のカバーテープの剥離力を示す表
で、上記固着した部分8の端部では剥離力はむしろ低下
し、その変動も少ない。FIG. 2 is a table showing the peeling force of the cover tape of the above example. The peeling force is rather lower at the end of the fixed portion 8, and its fluctuation is small.
したがって、自動組立装置等を用いて組立を行う場合、
カバーテープを剥す機構に対する性能要求を緩くでき、
多くの自動組立装置を問題なく使用することができる。Therefore, when assembling using automatic assembly equipment, etc.,
The performance requirements for the cover tape peeling mechanism can be relaxed,
Many automatic assembly devices can be used without problems.
(発明の効果)
以上詳述したように、本発明によればキャリアテープか
らカバーテープを剥す際に必要な応力を小さく、かつそ
の変動を少なくでき、しかも確実な封止を行なうことが
できるエンボステープを提供することができる。(Effects of the Invention) As detailed above, according to the present invention, the stress required when peeling the cover tape from the carrier tape can be reduced and its fluctuation can be reduced, and the embossed material can be reliably sealed. tape can be provided.
第1図は本発明の一実施例を示す平WI図、第2図はL
記実施例の剥離力の変動を示す図、第3図は本発明の他
の実施例の封止状態を示す平面図、
第4図は従来のエンボステープの一例を示す斜視図、
第5図は電子部品の一例を示す斜視図、第6図は従来の
エンボステープを示す平面図、第7図は従来のエンボス
テープの剥離力を示す図である。
1・・・・キャリアチー1
2・・・・凹所
4・・・・ガイド孔
5・・・・カバーテープ
8・・・・固着部分
12・・・部品Fig. 1 is a flat WI diagram showing one embodiment of the present invention, and Fig. 2 is an L
3 is a plan view showing the sealed state of another embodiment of the present invention; FIG. 4 is a perspective view showing an example of a conventional embossed tape; FIG. 5 6 is a perspective view showing an example of an electronic component, FIG. 6 is a plan view showing a conventional embossed tape, and FIG. 7 is a diagram showing the peeling force of the conventional embossed tape. 1...Carrier chi 1 2...Recess 4...Guide hole 5...Cover tape 8...Fixed part 12...Parts
Claims (1)
部品収納用の凹所を形成して各凹所に電子部品を収納し
てこの上からカバーテープで封止するものにおいて、 上記キャリアテープとカバーテープとを一定長さ毎に端
部に間隙を存しかつ幅方向に一部分をオーバーラップさ
せて加熱溶融して固着したことを特徴とするエンボステ
ープ。[Scope of Claims] A carrier tape in which a large number of recesses for storing components are formed at regular intervals along the longitudinal direction of the carrier tape, electronic components are stored in each recess, and the electronic components are sealed from above with a cover tape. An embossed tape characterized in that the carrier tape and the cover tape are fixed to each other by heating and melting the carrier tape and the cover tape at fixed lengths with gaps at the ends and partially overlapping each other in the width direction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63070681A JPH01254571A (en) | 1988-03-24 | 1988-03-24 | embossed tape |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63070681A JPH01254571A (en) | 1988-03-24 | 1988-03-24 | embossed tape |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01254571A true JPH01254571A (en) | 1989-10-11 |
Family
ID=13438633
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63070681A Pending JPH01254571A (en) | 1988-03-24 | 1988-03-24 | embossed tape |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01254571A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006182399A (en) * | 2004-12-27 | 2006-07-13 | Tdk Corp | Electronic component array |
JP2014205511A (en) * | 2013-04-15 | 2014-10-30 | 株式会社ティ−アンドケイ東華 | Crimp head and crimp apparatus |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6114660B2 (en) * | 1981-03-09 | 1986-04-19 | Hitachi Seisakusho Kk |
-
1988
- 1988-03-24 JP JP63070681A patent/JPH01254571A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6114660B2 (en) * | 1981-03-09 | 1986-04-19 | Hitachi Seisakusho Kk |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006182399A (en) * | 2004-12-27 | 2006-07-13 | Tdk Corp | Electronic component array |
JP2014205511A (en) * | 2013-04-15 | 2014-10-30 | 株式会社ティ−アンドケイ東華 | Crimp head and crimp apparatus |
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