JPH01253989A - Film joining device - Google Patents

Abstract

PURPOSE:To prevent an adhering face from generating air bubbles and to improve reliability of wirings by providing a wet roller for adhering air bubble preventing agent on a board at a position before the board is conveyed to a temporary position, and means for substantially uniformly supplying air bubble preventing agent from the interior of the roller toward its surface. CONSTITUTION:Before an insulation board 11 is conveyed to a temporary position, a wet roller unit 30 to adhere water (air bubble preventing agent) to the board 11 is provided in a previous stage conveyor 17. A covering layer 33 made of a porous substance containing water such as sponge or the like is provided on the surface of a water supply pipe 32 provided with a plurality of water supply holes 32A, 32B on a pair of lower and upper wet rollers 31A and 31B, and before the board 11 is conveyed to the temporary position, the board 11 is coated with water by the rollers 31A, 31B. Thus, it can prevent air bubbles from being generated on the joining faces of the board 11 and a thin film 1B, thereby improving reliability of wiring of a printed board.

Description

Detailed Description of the Invention (1) Purpose of the Invention [Field of Industrial Application] The present invention relates to a thin film attachment technique, and is particularly effective when applied to a thin film attachment technique for attaching a thin film to a substrate surface. It is related to technology.

[Prior art]

2. Description of the Related Art Printed wiring boards used in electronic devices such as computers have a predetermined pattern of wiring made of copper or the like formed on one or both sides of an insulating substrate.

This type of printed wiring board can be manufactured by the following manufacturing process.

First, a laminate film consisting of a photosensitive resin (photoresist) layer and a transparent resin film (protective film) that protects it is thermocompressed onto a conductive layer (thin copper film) provided on an insulating substrate. Laminate. This thermocompression bonding lamination is carried out in mass production using a thin film pasting device, a so-called laminator. Thereafter, a wiring pattern film is placed on the laminate film, and the photosensitive resin layer is exposed to light for a predetermined period of time through the wiring pattern film and the transparent resin film. and,
After the transparent resin film is peeled off using a peeling device, the exposed photosensitive resin layer is developed to form an etching mask pattern. Thereafter, unnecessary portions of the conductive layer are removed by etching, and the remaining photosensitive resin layer is further removed to form a printed wiring board having a predetermined wiring pattern.

[Problem to be solved by the invention]

However, in the conventional thin film pasting method, a laminate consisting of a photosensitive resin (photoresist) layer and a transparent resin film (protective film) that protects it is placed on a conductive layer provided on an insulating substrate. Films are laminated by thermocompression, but the surface of the conductive layer has minute irregularities, and when the conductor layer surface and the laminate film are laminated, air remains in the minute concavities on the conductor layer surface. There was a problem in that voids were generated on the adhesive surface between the surface and the laminate film, and the adhesiveness between the conductor layer surface and the laminate film was reduced.

Furthermore, there is a problem in that the reliability of the wiring on the printed circuit board is reduced.

The present invention has been made to solve the above problems.

An object of the present invention is to provide a thin film pasting technique that can improve the reliability of a substrate to which a thin film is pasted.

Another object of the present invention is to provide a technique that can improve the reliability of printed circuit boards.

Another object of the present invention is to provide a technique that can prevent air bubbles from forming on the adhesive surface between the conductive layer (copper layer) surface of the substrate on which the conductive layer is formed and the laminate film. be.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

(2) Structure of the Invention [Means for Solving the Problems] In order to achieve the above-mentioned object, the present invention brings a tacking member close to the surface of the leading end in the conveying direction of the substrate to attach the leading end in the feeding direction of the thin film. After tacking and separating the tacking member from the substrate surface, a pressure roller is brought into contact with the tip of the thin film at the tacking position, and the pressure roller is rotated to convey the substrate, A thin film pasting device for pasting a thin film on a substrate, the device being disposed at a position before the substrate is transported to the temporary attachment position of the frame of the substrate transport path device, and applying a bubble preventing agent to the substrate. The main feature is that it is provided with a wet roller to which it adheres and a means for supplying the anti-foaming agent almost uniformly from the inside of the wet roller toward the surface.

[Effect]

As described above, the present invention provides a wet roller for adhering a bubble preventive agent to the substrate, which is disposed at a position before the substrate is transported to the temporary attachment position of the frame of the substrate transport path device; By providing a means to supply the anti-foam agent almost uniformly from the inside of the wet roller to the surface, the anti-foam agent is supplied almost uniformly over the entire area of the wet roller, and the substrate is transported to the temporary attachment position. Since the anti-bubble agent is applied almost uniformly to the substrate before being bonded, the surface of the conductive layer and the thin film are brought into close contact, and no voids are formed on the bonding surface between the surface of the conductive layer and the thin film.
can be prevented from occurring.

Thereby, it is possible to improve the adhesiveness between the substrate and the thin film, and to improve the reliability of the wiring of the printed circuit board.

[Embodiments of the invention]

Hereinafter, an embodiment of the present invention will be described based on the drawings, in which the present invention is applied to a thin film pasting device that heat-presses and laminates a laminate film consisting of a photosensitive resin layer and a transparent resin film to a printed wiring board. Explain in detail.

In addition, in all the figures for explaining the embodiment, parts having the same functions are given the same reference numerals, and repeated explanations thereof will be omitted.

FIG. 1 (schematic configuration diagram) shows a thin film adhering device which is an embodiment of the present invention.

As shown in FIG. 1, a laminate film 1 having a three-layer structure of a translucent resin film, a photosensitive resin layer, and a translucent resin film is continuously wound around a supply roller 2. As shown in FIG.

The laminate film 1 of the supply roller 2 is transferred to the thin film separation roller 3
Then, it is separated into a light-transmitting resin film (protective film) IA and a laminate film IB consisting of a light-transmitting resin film and a photosensitive resin layer whose negative side (adhesive surface) is exposed. The separated translucent resin film IA is configured to be wound up by a take-up roller 4.5 The laminate film IB separated by the thin film separation roller 3
As shown in FIGS. 1 and 2 (partially enlarged view of FIG. 1), the tip end in the supply direction is configured to be attracted to the main vacuum plate 10 through a tension roller 9.

The tension roller 9 is configured to apply appropriate tension to the laminate film IB between the supply roller 2 and the main vacuum plate (thin film supply member) 10. In other words, the tension roller 9 is configured so as not to cause wrinkles or the like on the supplied laminate film IB.

The main vacuum plate 10 is a laminate film IB.
from the supply roller 2 to the conductive layer of the insulating substrate 11 (for example,
(copper thin film layer). As shown in FIGS. 1 and 2, the main vacuum plate 10 is provided on a support member 12 that is close to and away from the insulating substrate 11 (moves in the direction of arrow B). The support member 12 is provided in the apparatus main body (casing of the thin film application apparatus) 7 so that the guide member 7A can be slid in the direction of arrow B. The support members 12 are provided in pairs above and below the transport path of the insulating substrate 11 . Upper support member 1
2 and the lower support member 12 are configured to operate in conjunction with each other (both approach or separate at the same time) by a rack and pinion mechanism. In other words, the pair of upper and lower support members 12 are operated in conjunction with the racks 12A provided respectively and the pinions 12B fitted with the racks 12A. The operation of this support member 12 is similar to that of the lower support member 1
This is performed by a drive source 12C provided at 2. Drive source 12C
is composed of, for example, an air cylinder. Further, the drive source 12C can be configured with a hydraulic cylinder, an electromagnetic cylinder, a step motor, a transmission mechanism that transmits the displacement to the support member 12, and the like.

The main vacuum plate 10 is provided on the support member 12 so as to approach and move away from the insulating substrate 11 (moves in the direction of arrow C) independently of movement of the support member 12. The main vacuum plate 10 is configured to operate by a drive source 12D provided on the support member 12 and a rack and pinion mechanism. This rack and pinion mechanism includes a pinion 12E provided on a drive source 12D, and a rack 12F provided on a support member 12.
, a rack I provided on the main vacuum plate 10
It is composed of OA. The drive source 12D is the drive source 12C.
It consists of the same things as.

The drive source 12C and the drive source 12D are each configured with an air cylinder, for example, and are controlled by an electromagnetic valve.

Although not shown, the main vacuum plate 10 is provided with a plurality of suction holes for sucking and holding the laminate film IB. This suction hole passes through the exhaust pipe,
Connected to a vacuum source such as a vacuum pump. The suction operation of the main vacuum plate 10 and the suction operation of the temporary attachment part 10E are configured to be independently controlled.

At the tip of the main vacuum plate 10 in the supply direction of the laminate film IB, a temporary attaching part 10E is provided in which the surface for adsorbing the laminate film IB is formed in an arc shape. The temporary attachment part 10E is configured integrally with the main vacuum plate 10.

Inside the temporary attachment part 10E, a heater IOF is provided that heats the arc-shaped portion, as shown in FIGS. 1 and 2. The temporary attachment part 10E is the main vacuum plate 10
The tip portion of the laminate film IB supplied in the above is configured to be temporarily bonded (temporary thermocompression bonding) onto the conductive layer of the insulating substrate 11.

In addition, in the present invention, the main vacuum plate 10 and the temporary attachment part 10E may be configured as separate members, and both may be supported by the support member 12.

A position close to the temporary attachment part 10E, that is, the temporary attachment part 10
A sub-vacuum plate (thin film holding member) 13 is provided near the supply path of the laminate film IB between E and the insulating substrate 11. Sub vacuum plate 1
No. 3 has a suction hole not shown in the figure, but as shown in FIG. (corresponding to the cutting position of the laminate film IB), the upper suction part 13a of the sub-vacuum plate 13 mainly suctions the leading end of the laminate film IB in the supply direction, and causes it to be suctioned (held) by the temporary attachment part 10E. It is configured as follows. The sub-vacuum plate 13 moves toward and away from the supply path of the laminate film IB (moves in the direction indicated by the arrow), for example, from an air cylinder so that the leading end of the laminate film IB can be adsorbed to the temporary attachment part 10E. It is attached to the support member 12 via a drive source 13A.

In addition, the lower suction part 13b of the sub-vacuum plate 13
is configured to cut the continuous laminate film IB with a cutting device 14, adsorb the rear end of the cut laminate film IB, and hold it within the supply path of the laminate film IB. After the start of thermocompression lamination, the lower suction part 13b forms a slack in the laminated film IB between it and the rotary vacuum plate 15, as shown in FIG. is configured to form This slack laminate film IB' is formed by controlling the supply speed of the laminate film IB of the main vacuum plate 10 to be faster than the circumferential speed of the thermocompression roller 16 (thermocompression lamination speed). be able to. Although not shown, both are controlled by a sequence control circuit.

In addition, the drive source 13A of the sub-vacuum plate 13 may be configured with a hydraulic cylinder or the like, similar to the drive g12c described above, in addition to an air cylinder.

Between the temporary attachment part 10E and the insulating substrate 11 (actually,
A cutting device 14 is provided (fixed) in the main body 7 of the apparatus near the supply path of the laminate film IB (between the temporary attachment part 10E and the rotary vacuum plate 15).

More specifically, the cutting device 14 is configured at a position facing the sub-vacuum plate 13 when the rear end of the laminate film IB is fed to the cutting position. Cutting device 14
is configured on the front-stage conveyance device 17 side that conveys the insulating group Fi11 (or may be configured on this front-stage conveyance device 17).

The cutting device 14 is configured to cut the laminate film IB continuously supplied by the main vacuum plate 10 into a predetermined length corresponding to the dimensions of the insulating substrate 11.

The laminate film IB whose tip end is temporarily bonded (temporarily thermocompression bonded) onto the conductive layer of the insulating substrate 11 at the temporary attachment portion 10E of the main vacuum plate 10 shown in FIGS. 1 and 2 is a thermocompression roller. The entire structure is laminated by thermocompression at step 16. The thermocompression roller 16 is disposed at a retracted position shown by a dotted line in FIG. 1 during a tacking operation for tacking the leading end of the laminate film IB at the tacking portion 10E. Thermocompression roller 16 (1) placed in the retracted position
, the tacking part 10 moves close to the tacking position during the tacking operation.
The thermocompression bonding roller 16 after the 9 tacking section, which is configured so as not to come into contact with E, moves from the retracted position shown by the dotted line labeled 16(1) to the temporary bonding roller 16 shown by the solid line labeled 16(2). It is configured to move to the attached position. The thermocompression roller 16 (2) that has moved to the tacking position presses the laminate film IB.
The structure is such that the insulating substrate 11 is sandwiched therebetween.

The rear end of the laminate film IB cut by the cutting device 14 is guided by a triangular rotating vacuum plate 15 to prevent wrinkles, etc., and is laminated by thermocompression bonding by a thermocompression roller 16. ing. The rotary vacuum plate 15 is supported coaxially with the thermocompression roller 16 and is configured to rotate around it, and has a suction surface facing the laminate film IB (not shown).

A plurality of suction holes 15A are provided. The suction hole 15
The structure of the suction surface on which A is arranged is similar to the suction surface of the main vacuum plate 10. Although not shown, a suction hole may also be provided on the upper surface of the rotary vacuum plate 15, and by configuring it in this way, as shown in FIG.
can be made easier to form.

As shown in FIGS. 1 and 2, the insulating substrate 11 is transferred to a thin film pasting device by a front-stage conveyance device @17 consisting of a driving conveyance roller (lower stage) 17A and an idle conveyance roller (upper stage) 17B. The laminate film IB is conveyed to the tacking position.

The pre-stage conveyance device 17 is provided with a water adhesion wet roller device 30 for adhering water (bubble prevention agent) to the insulating substrate 11 before the substrate 11 is conveyed to the temporary attachment position. .

The wet roller device 30 for applying water is shown in FIGS. 3 (a top view of the lower wet roller portion of the wet roller device shown in FIG. P
As shown in FIG. 5 (a cross-sectional view taken along line A-A in FIG.
A pair of lower wet rollers 31A and an upper wet roller 31B are rotatably attached to the frame 17C of the front-stage conveyance device 17 at the front stage of 6. The pair of lower wet rollers 31A and upper wet rollers 31B are As shown in Figure 6 (perspective view) and Figure 7 (cross-sectional view for explaining the arrangement of the water supply holes (drainage holes) shown in Figure 6), rust-resistant materials such as stainless steel and anti-corrosion treated aluminum are used. The surface of the water supply pipe 32, which has a cylindrical body made of metal or hard plastic and has a plurality of water supply holes 32A, 32B, is covered with a cover made of a porous material such as a sponge that easily contains water! One layer 33 is provided (FIG. 5).

And the water supply pipe 3 of the lower wet roller 31A
A plurality of water supply holes 32A provided in 2.

32B are provided facing each other in the radial direction of the water supply pipe 32, such as water supply holes 32A and 32A and water supply holes 32B and 32B, and the pair of water supply holes 32A and the pair of water supply holes 32B are provided in a predetermined manner. The phase is shifted by 90 degrees at intervals of .

Also, the water supply pipe 32 of the lower wet roller 31A
is the rotating shaft 31A□ of the lower wet roller 31A,
The connecting devices 34 and 35 provided at 31A2 allow the connection to be made detachable.

In addition, the rotating shaft 31A of the lower wet roller 31A is
It is rotatably connected to the same drive source via a bearing device 31AL so as to rotate in synchronization with the driving conveyance roller 17A. This bearing bag [31AL is attached to the frame 17C of the front-stage conveyance device 17 with a fixing screw.

Also, the other rotating shaft 3 of the lower wet roller 31A
1A2 is rotatably supported by a bearing bag [31AR. Gears 36 are attached to the eight rotating shafts 31. 37 is a bearing.

A water supply device 38 is provided at the left end of the lower wet roller 31A of the water supply pipe 32, and a drainage device 3 is provided at the right end.
9 is provided. Similarly, the upper wet roller 3
A water supply device 38 is provided at the left end of the wet roller of the water supply pipe 32 of 1B, and a drainage device 39 is provided at the right end. The water supply device 138 and the drainage device 39 are
Each of them is attached to the frame body 17C of the front-stage conveyance device 17 by a frame.

The upper wet roller 31B is a floating roller, and a rotating shaft 31 is attached to both ends of the water supply pipe 32.
B and 31B2 are provided, and these rotating shafts 3
1B1 and 31B2 are each provided with a bearing (bush) 40 made of a softer bearing material than the frame 17C. The bearing 40 of the upper wet roller 31B is fitted into a U-shaped groove 41 provided in the frame 17C, and is detachable.

Further, as shown in FIG. 4, the upper wet roller 31B
A gear 70 that meshes with the gear 36 attached to the rotating shaft 31A2 is attached to the right end of the rotating shaft 31B2 via a member 71.

Thereby, the rotation of the lower wet roller 31A is transmitted to the upper wet roller 31B.

Next, a detailed configuration of the water supply device 38 (drainage device 39) will be explained.

The water supply device 38 (drainage device 39) is shown in FIG. 8 (cross-sectional view of main parts) and FIG. 9 (enlarged cross-sectional view taken along line B-B in FIG. 8).
As shown in FIG. 2, the water supply pipe 32 is passed through the support member 42 and rotatably sealed with a ring 43. A dam 44 is provided in the center of the support member 42, a water supply hole (drainage hole) 45 is connected to this dam 44, and a water supply port (drainage hole) 46 is connected to the end of this water supply hole 45. is provided. The water supply pipe 32 and the supporting member 42 of the water supply device 38 (drainage device 39) are arranged so that the water supply hole (drainage hole) 32A or 32B provided in the water supply pipe 32 is located in the dam 44. There is.

Next, the detailed configuration of the coupling device 34, 35 will be explained in the first section.
This will be explained using FIGS. 0 to 14.

FIG. 10 is a sectional view of the main parts of the coupling device 342, the rotating shaft 31A, and the bearing device 31AL.

As shown in FIG. 10, the coupling device 34 on the side of the rotating shaft 31A has a guide groove 52 in the center of the end opposite to the part where the pulley 51 of the one rotating shaft 31A□ is attached to the rotating shaft 31A1. It is installed in one piece. This rotating shaft 31A
A guide hole 53 is provided from inside the guide groove 52 toward the pulley 51 and is concentric with the rotating shaft 31A.

A connecting guide bar 55 is fitted into the guide hole 53 via a spring 54 made of, for example, a coil. Further, a long through hole 56 is provided at a predetermined position in the guide groove 52 of the rotating shaft 31A. A stopper pin 57 that is slidably fitted into this through hole 56 is provided at a predetermined position of the connecting guide bar 55 (first
Figure 1). Also.

As shown in FIG. 11, a connecting protruding member 58 is provided integrally with the connecting guide bar 55 at the tip end of the connecting guide bar 55 on the water supply pipe 32 side.

Also, the connecting partffl! 34 water supply pipe 32 side is the first
As shown in FIG. 2, a connecting protrusion member 60 is integrally formed at the center of the connecting member 59 provided at the end of the water supply pipe 32, and the connecting protrusion member 60 is rotated once at the center of the connecting member 59. A connecting groove 61 that engages with the connecting protruding member 58 on the shaft 31A1 side is provided.

Furthermore, as shown in FIGS. 13 and 14, the coupling device 35 of the rotating shaft 31A2 is provided with a coupling guide groove 62 at the tip of the rotating shaft 31A2 on the opposite side to the part where the gear 36 is attached. There is. A connecting member 63 is provided in the radial direction of the rotating shaft 31A2 so as to cross the connecting guide groove 62.

Further, the water supply pipe 32 side of the coupling device 35 is connected to the coupling device 3
4, as shown in FIG. 12, a connecting protrusion member 60 is integrated with the connecting member 59 at the center of the connecting member 59 provided at the end of the water supply pipe 32. Connecting member 6 on the 1-rotation shaft 31A2 side is located in the center of the
3 is provided with a connecting groove 61 that engages with the connecting groove 3 .

Next, the operation of the coupling devices 34 and 35 will be briefly explained.

First, the connecting groove 61 on the water supply pipe 32 side of the connecting device 35 and the connecting member 63 on the rotating shaft 31A2 side are engaged,
Connecting projection member 6 of the connecting device 34 on the rotating shaft 31A1 side
0 by hand against the spring 54, and then press the rotating shaft 31
The connecting protruding member 58 on the A1 side is engaged with the connecting groove 61 on the water supply pipe 32 side, and then released. Thereby, the water supply pipe 32 is reliably connected to the rotating shaft 31A1 and the rotating shaft 31A2, and the lower wet roller 31A is attached.

When removing the lower wet roller 31A from the rotating shaft 31A□ and the rotating shaft 31A2, move the stopper pin 57 of the coupling device 34 on the rotating shaft 31A1 side to the pulley 51 side by hand against the spring 54. Connecting projection member 60
, and connect the connecting protruding member 58 on the rotating shaft 31A1 side.
Disengage the connection groove 61 on the water supply pipe 32 side, and connect the connection groove 61 on the water supply pipe 32 side of the connection device 35 to the rotation shaft 31.
Disengage the connection member 63 on the A2 side.

In addition, the upper wet roller 31B is mounted on the bearings 4 provided at both ends of the water supply pipe 32, as described above.
0 is fitted into the U-shaped groove 41 provided in the frame 17C of the front-stage conveyance device 17 and can be attached or detached. Lift and remove.

In addition, Fig. 15 (front view) and Fig. 16 (C in Fig. 14)
As shown in the cross-sectional view taken along lines -C and W, a water absorption device 80 is rotatably provided downstream of the thermocompression roller 16(2) to remove water from the substrate on which the thin film is attached. ing.

As shown in FIGS. 15 and 16, this water absorption device 80 includes a pair of water suction rollers, a lower water absorption roller 81A and an upper water absorption roller 81B. The lower water absorption roller 81A and the upper water absorption roller 81B each have a water absorption layer 83 made of a porous material such as sponge coated on the surface of a drainage pipe 82 having a drainage hole 82A. A drainage device 84 is provided at both ends of the water absorption layer 83. This drainage system @84 has the same structure as the water supply system shown in FIGS. 8 and 9. This drainage device 84 is
It is rotatably attached to the support member 85 by means of a pin 86 (which serves as a rotating shaft). This support member 85 is attached to a support frame 88 whose movement is controlled by an air cylinder 87. Furthermore, free rollers 90 are provided at both ends of the drainage device 84 of the drainage pipe 82 with collars 89 interposed therebetween. This free roller 90
This is to enable the lower water absorption roller 81A and the upper water absorption roller 81B to be drawn in and rotated following the rotation of the thermocompression roller 1G(2). In addition, after the lower water absorption roller 81A, the upper water absorption roller 81B, and the free roller 90 are pulled together following the rotation of the thermocompression roller 16(2), in order to return them to their original positions, each A tension spring 91 that attracts the support members 85 is provided between the support members 85 .

The drainage device 84 is configured to be suctioned by a suction device.

In this way, after the thermocompression roller 16 (, 2),
Since the water absorption device 80 for removing water on the substrate to which the thin film is attached is rotatably provided, stains and dirt such as water blob marks occur on the laminated film IB attached to the insulating substrate 11. Because I don't.

The reliability and yield of pattern formation by exposure can be improved.

Further, as shown in FIGS. 1 and 2, after the laminate film IB is temporarily pressed onto the main vacuum plate 10, air is blown to separate the laminate film IB from the main vacuum plate 10 using a nozzle. 100 are arranged.

For air blowing, the nozzle 100 is as shown in FIG.
The air blower is connected to a compressed air generator 102 via a speed regulator 101, and the speed of the air blower is adjusted as necessary.

The reason why the nozzle 100 is provided for the air blowing is that water is applied to the insulating substrate 11 and the laminate film IB is attached to the main vacuum plate 10 so that the tip of the temporary attaching part 10E, which is provided at the tip of the main vacuum plate 10, gets wet with water. In addition, the water vapor is cooled and condensed by the temporary attachment part 10E and the main vacuum plate 10, so that the laminate film IB adheres to the temporary attachment part 10E and the main vacuum plate 10, and follows the movement of the main vacuum plate 10. This is because the laminate film IB will peel off from the insulating substrate 11 that has been temporarily attached. This is provided to prevent this peeling.

In FIG. 17, 103 is a pump unit.

Reference numeral 104 indicates a flow rate adjustment flow meter that measures the flow rate of water supplied to the lower wet roller 31A and upper wet roller 31B, and 105 indicates a flow rate adjustment regulator that adjusts the flow rate of water supplied to the lower wet roller 31A and upper wet roller 31B. 106 is a trap for removing water from the suction flow, and 107 is a water tray. 6 In addition, as shown in FIG. The upper wet roller 31B rotates and the insulating substrate 11 is conveyed, thereby rotating and applying water to the surface of the insulating substrate 11.

The remaining water at this time is collected in a water tray 107 and sent to the pump unit 103 through a drainage hose. In addition, water removed when the insulating substrate 11 and the laminate film IB' are bonded by the thermocompression roller 16 (2) and water adhering to the insulating substrate 11 to which the laminate film IB' is bonded. The water is also collected in a water tray 107 and sent to the pump unit 103 through a drainage hose.

Further, the flow rate to the lower wet roller 31A and the upper wet roller 31B is controlled by adjusting the flow rate of water from the pump unit 103 using a flow meter 104, as shown in FIG. ! ! After measuring, lower wet roller 31A
Water is supplied to the upper wet roller 31B, and the flow rate of the supplied water is adjusted by a flow rate adjustment valve 105.

In this way, before the insulating substrate 11 and the laminate film IB' are conveyed to the temporary attachment position, the lower wet roller 31A of the wet roller device 30 for water adhesion is removed.

The upper wet roller 31B moves the insulating substrate 11
A bubble preventive agent such as water is applied to the surface of the insulating substrate 11 in the feeding direction, and the leading end in the feeding direction of the laminate film IB' is tacked on the surface of the leading end in the conveying direction of the insulating substrate 11 in contact with the tacking part 10E. After separating the temporary attachment part 10E from the surface of the insulating substrate 11,
A thermocompression roller 16 (2) is brought into contact with the tip of the laminate film IB' at the tacking position, and the thermocompression roller 16 (2) is rotated to transport the insulating substrate 11 and , laminated film IB' on one insulating substrate
When the surface of the conductive layer of the insulating substrate 11 and the laminate film IB' are laminated together, water accumulated in minute recesses on the surface of the conductive layer removes air bubbles, and the laminate film Since the photoresist (in the case of water-soluble photosensitive resin) of IB' is melted and acts as an adhesive, the surface of the conductor layer and the laminate film IB' are brought into close contact, and the surface of the conductor layer and the laminate film IB' are bonded. ' It can prevent the formation of voids on the adhesive surface.

As a result, the insulating substrate 11 and the laminate film IB
' It is possible to improve the adhesion with the printed circuit board and also improve the reliability of the wiring on the printed circuit board.

Further, as the photoresist (photosensitive resin) of the laminate film IB, a water-soluble one is suitable.

Further, as the anti-bubble agent adhesive, a surface tension adjusting agent, a copper surface adhesive, etc. may be added to water in some cases.

As shown in FIG. 1, the front-stage transport device 17 detects the position of the leading end of the insulating base plate 11 in the transport direction near the board transport path (substrate leading edge detection position) before the temporary attachment position. A detection sensor S1 is arranged.

This detection sensor S1 is configured to output a detection signal that starts the operation of a preset counter of a microcomputer (CPU) when detecting the leading end of the insulating substrate 11 in the transport direction. The preset counter is configured to output a control signal to stop the leading end of the insulating substrate 11 in the transport direction at the temporary attachment position when the preset counter counts the required dimension that has been artificially set in advance. The detection sensor S1 is composed of, for example, a photoelectric switch.

Further, in the front-stage conveyance device 17, in the vicinity of the substrate conveyance path before the detection sensor S1 (substrate rear end cloth detection position),
A detection sensor S2 is arranged to detect the position of the rear end of the insulating substrate 11 in the transport direction.

Similar to the detection sensor S1, the detection sensor S2 is configured to output a detection signal that starts the operation of a preset counter of the CPU when the rear end of the insulating substrate 11 in the transport direction is detected. The preset counter forms a slack part IB' in the laminate film IB at the rear end in the feeding direction after a preset required time has elapsed, and sets the cutting position of the laminate film IB with the cutting device 14. It is configured to output a control signal for cutting and thermocompression-bonding the rear end portion of the cut laminate film IB in the supply direction to the insulating substrate 11. Further, the preset counter outputs a control signal for laminating the rear end of the laminate film IB in the feeding direction onto the insulating substrate 11 by thermocompression bonding and moving the thermocompression roller 16 from the temporary attachment position to the vicinity of the retreat position. It is composed of The detection sensor S2 is configured with, for example, a photoelectric switch, similarly to the detection sensor S1.

In addition, the conveyance roller (lower stage) 18A and the conveyance roller (upper stage)
18B is configured to transport the insulating substrate 11 on which the laminate film IB is laminated by thermocompression bonding using the thermocompression roller 16 of the thin film pasting device to the exposure device that forms the wiring pattern. has been done.

As shown in FIGS. 1 and 2, the main vacuum plate 10 is provided in the apparatus main body 7 (or the front conveyance device 117 or the support member 12) near the movement path (thin film supply path) of the temporary attaching portion 10E. , a thin film correction device 19 is provided. The thin film straightening device 19 is configured to straighten the leading end of the laminate film IB in the supply direction in the direction of bringing it into close contact with the temporary attachment portion 10E (direction of arrow G). Thin film correction device 19
is composed of a fluid transport pipe 19A extending in the width direction of the laminate film IB, and a plurality of fluid spray holes 19B provided in the fluid transport pipe 19A.

The fluid transport pipe 19A has a hollow interior and is configured to flow fluid at a pressure higher than normal pressure. Although the fluid transport pipe 19A has a substantially circular cross-sectional shape in this embodiment, the cross-sectional shape is not limited to this, and may be rectangular or elliptical.

The fluid spray holes 19B are provided so as to spray fluid in a direction to straighten the laminate film IB.

As the fluid used in the thin film correction device 19, air is used. In addition, as a fluid, gas such as inert gas, water,
A liquid such as oil may also be used.

Furthermore, the lower suction part 13 of the sub-vacuum plate 13
As shown in FIGS. 1 and 2, the device main body 7 (or the front-stage conveying device 17. or the support member 12) close to the laminate film IB' supplied between the rotary vacuum plate 15 and the A thin film ejection device 2° is provided at . In other words, the thin film ejecting device 2o is configured to form the laminated film IB' with the slack in the direction of bringing it into close contact with the thermocompression roller 6 (in the direction of arrow H). The thin film protruding device 2o includes a fluid transport pipe 20A extending in the supply width direction of the laminate film IB, and a plurality of fluid spray holes 20B provided in the fluid transport pipe 20A.

The fluid transport pipe 2OA has a hollow interior and is configured to flow fluid at a pressure higher than normal pressure. In this embodiment, the cross-sectional shape of the fluid transport pipe 20A is approximately circular, but like the fluid transport pipe 19A, the cross-sectional shape is not limited to this, and may be rectangular or elliptical.

The fluid spray holes 2OB are provided so as to spray fluid in a direction that causes the slack of the laminate film IB' to protrude as described above.

As the fluid used in the thin film ejection device 20, air is used as in the thin film correction device 19. Further, as the fluid, a gas such as an inert gas, or a liquid such as water or oil may be used.

Note that 5 the present invention is a thin film correction device 19 or a thin film protrusion device 2.
0 may be constituted by a fluid spray nozzle that sprays fluid so that a plurality of laminate films IB provided in the width direction of the laminate film IB are straightened or projected in an appropriate direction as described above.

Further, the present invention provides a suction tube provided extending in the width direction of the laminate film IB, and a plurality of laminates provided in the suction tube. It may also be configured with a suction hole that sucks the film IB in a direction to straighten or project the film IB in an appropriate direction as described above.

Further, the present invention provides a thin film correction device 19 or a thin film protrusion device 2.
0 may be constituted by a protruding member that straightens or protrudes the laminate film IB in an appropriate direction as described above.

Further, the present invention provides a thin film correction device 19 with a thin film protruding device 20.
Alternatively, it is also possible to use the thin film straightening device 19 as the thin film ejecting device 20.

The apparatus main body 7 (or the rear conveyance device 18) between the thermocompression bonding roller 16(2) disposed at the tacking position and the driving conveyance roller 18A of the rear conveyance device 18 is provided with a structure shown in FIGS. 1 and 2. As shown, a substrate guide member 21 is provided.

The substrate guide member 21 is an insulating substrate 11 on which a laminate film IB is laminated by thermocompression bonding.

From the thermocompression laminating position (temporary attachment position) to the conveyance roller 18
The six-substrate guide member 21 configured to guide the insulating substrates 11 to the positions A and 18B has, for example, a comb-shaped configuration in which a plurality of rod-shaped portions extending in the transport direction of the insulating substrate 11 are arranged in the transport width direction. do. The substrate guide member 21 configured in a comb shape is configured to
Since the contact area with the insulating substrate 11 can be reduced and the frictional resistance can be reduced, the insulating substrate 11 can be guided smoothly.

In addition, in the present invention, the substrate guide member 21 may have a network structure or a plate-like structure.

Next, a laminate film I produced by the thin film pasting device of this embodiment
The thermocompression lamination method B will be briefly explained using FIGS. 1 and 2.

First, as shown in FIGS. 1 and 2.

The leading end of the laminate film IB separated by the thin film separation roller 3 in the feeding direction is manually placed between the sub-vacuum plate 13 and the cutting device 14.

Next, the laminate film I is removed using the sub-vacuum plate 13.
Attach the tip of B. After adsorption of the laminate film IB,
The sub-vacuum plate 13 is moved to a position away from the supply path of the laminate film IB by the driving source 13A, and the tip of the laminate film IB is attracted to the temporary attachment part 10E. At this time, the main vacuum plate 10 and the temporary attachment part 1
Since the suction operation of 0E is performed and the laminate film IB can be straightened by the thin film straightening device 19, the leading end of the laminate film IB can be reliably attracted to the temporary attaching portion 10E. Note that when the continuous operation is performed, the leading end of the laminate film IB cut by the cutting device 14 is attracted to the temporary attachment part 10E.

Next, the insulating substrate 11 is transported by the drive transport roller 17A and the idle transport roller 17B of the pre-stage transport device 17.

Then, before the insulating substrate 11 is transported to the temporary attachment position,
Lower wet roller 31A, upper wet roller 31B
By this, water is applied to the surface of the insulating substrate 11.

Next, when the leading edge of the insulating substrate 11 in the transport direction passes the substrate leading edge detection position, the detection sensor S1 is activated;
Its position is detected. The detection signal of this detection sensor S1 is input to the CPU and operates a preset counter. This preset counter counts a predetermined time period for stopping the leading end of the insulating substrate 11 in the transport direction at the temporary attachment position.

Furthermore, the detection signal of the detection sensor S1 operates another preset counter of the CPU. The other preset counter counts the start time of moving the tacking section 10E close to the conveyance path while the leading edge of the insulating substrate 11 in the conveying direction is being conveyed from the substrate tip detection position to the tacking position. is configured to do so.

In this state, the tacking section 10E (main vacuum plate 10) is located at the start position of the tacking operation, and the thermocompression roller 16 is placed at the retracted position.

The start position of the temporary attachment operation is a state in which the upper and lower support members 12 are stopped closest to the substrate transport path, and the drive source 12D that moves the main vacuum plate 10 is moved.
is the operating position.

Next, while the leading end portion of the insulating substrate 11 in the transport direction is being transported from the substrate leading end detection position to the tacking position, the tacking unit 10E starts approaching. The approaching operation of the temporary attachment part 10H is started by controlling the drive source 12D by the CPU based on the output signal of the other preset counter.

Next, when the leading end of the insulating substrate 11 in the transport direction reaches the temporary attachment position based on the output signal of the preset counter,
Conveyance of the insulating substrate 11 is stopped.

Substantially at the same time as this stopping of the insulating substrate 11, and a little later than that, the tacking part 10E, which is moving in close contact with the leading end in the conveying direction on the conductive layer of the insulating substrate 11, makes the tacking The tip of the laminate film IB adsorbed to the portion 10E is temporarily attached (temporary thermocompression bonding).

In this way, in the method of pasting the laminate film IB,
The leading edge of the insulating substrate 11 in the conveying direction is detected at the substrate leading edge detection position before being conveyed to the temporary attachment position, and this detection signal causes the leading edge of the insulating substrate 11 in the conveying direction to be moved from the substrate leading edge detection position. After being conveyed to the temporary attachment position, the insulating substrate 11 is stopped, and while the leading end portion of the insulating substrate 11 in the conveyance direction is being conveyed from the detection position to the temporary attachment position, the temporary attachment part 10E is brought close to the substrate conveyance path, and the insulating substrate 11 After stopping the leading end in the conveying direction of the laminate film IB at the temporary attachment position, the leading end in the feeding direction of the laminate film IB is temporarily attached onto the conductive layer of the insulating substrate 11 at the temporary attachment part 10E. A portion of the time for moving the temporary attachment part 10E close to the conveyance path is incorporated into the time period for conveying the leading end in the conveyance direction from the substrate front end detection position to the temporary attachment position. time (time from the stop of the leading end of the insulating substrate 11 in the conveying direction to the completion of the tacking operation at the tacking position)
Since the time required for attaching the laminate film IB can be shortened, the time required for attaching the laminate film IB can be shortened.

As a result, the number of times the laminate film IB is pasted per unit time can be increased, so the production capacity for thin film pasting can be improved.

When the temporary attachment part 10E comes into contact with the leading end in the conveyance direction on the conductive layer of the insulating substrate 11, the drive source 12D is activated. This operation is input to the CPU, and after holding the tacking operation for a predetermined time, the CPU stops the suction operation of the main vacuum plate 10 and the tacking part 10E, and the drive g12c and 12D
The main vacuum plate 10 and the temporary attachment part 10E are separated from the conveyance path. This separation means that the drive source 12 is placed in a position further away from the position shown in FIGS. 1 and 2.
G and 12D to move the main vacuum plate 10, temporary attachment part 10E, and sub vacuum plate 13.

This amount of movement is proportional to the amount of slack that the laminate film IB' has.

Next, the thermocompression roller 16 is moved from the retracted position shown by the dotted line to the tacking position shown by the solid line, and the tip of the thermocompression roller 16 in the feeding direction is brought into contact with the tacking laminated film IB.

Next, by rotating the insulating substrate 11 while holding it between thermocompression rollers 16, the laminate film IB is thermocompression laminated onto the conductive layer of the insulating substrate 11.

At this time, the main vacuum plate 10, temporary attachment part 10E
, the sub-vacuum plates 13 have stopped their adsorption operations, so the thermocompression roller 16 has its rotational force and
Due to the clamping force between the insulating substrate 11 and the insulating substrate 11, the laminate film IB is automatically supplied from the supply roller 2.

Next, a certain amount of the laminate film IB is laminated by thermocompression bonding, and the rear end of the insulating substrate 11 in the transport direction is detected by the detection sensor S2 at the substrate front end detection position shown in FIG. The detection signal of the substrate rear end detection sensor S2 is CP
U is input, and the suction operations of the main vacuum plate 10, sub-vacuum plate 13, and rotary vacuum plate 15 are started substantially simultaneously. and,
The support member 12 is moved by the drive source 12G from the position farthest from the substrate transport path, and the main vacuum plate 1
0, the laminate film IB is excessively supplied to the insulating substrate 11 side, and as shown in FIG.
The rear end in the supply direction (cutting position) of the cutting device 14 is made to coincide with the cutting position of the cutting device 14. The supply speed of the laminate film IB (the moving speed of the support member 12) is the thermocompression lamination speed by the thermocompression roller 16 (2) (the circumferential speed of the thermocompression roller 16).
is set faster than

In this state, the laminate film IB can form a laminate film IB' with slack between the sub-vacuum plate 10 and the rotary vacuum plate 15. By straightening the thin film straightening device 19, both ends of the laminated film IB' with the slack in the supply direction are straightened by the lower suction part 1 of the sub-vacuum plate 13.
3b and the rotary vacuum plate 15, respectively.

Next, the rear end portion of the laminate film IB in the feeding direction, which is aligned with the cutting position of the cutting device 14, is cut by the cutting device 14 into a predetermined size corresponding to the size of the insulating substrate 11.

Then, the thermocompression roller 16 is moved in the same direction as the substrate conveyance direction while thermocompression laminating the rear end portion of the laminate film IB in the feeding direction.

Next, the thermocompression roller 16 is used to convey the insulating substrate 11 until the rear end of the laminate film IB in the supply direction is substantially laminated by thermocompression bonding onto the conductive layer of the insulating substrate 11 using the rotating vacuum plate 15. move with. This thermocompression roller 16 can be moved to the vicinity of the retracted position. The rotary vacuum plate 15 rotates at a speed slightly slower than the rotational speed of the thermocompression roller 16, and laminates the rear end of the laminate film IB onto the conductive layer of the insulating substrate 11 by thermocompression bonding. In other words, the rotating vacuum plate 15.

By rotating at a speed slightly slower than the rotational speed of the thermocompression roller 16, an appropriate tension can be applied to the laminate film IB between it and the thermocompression roller 16, so that wrinkles etc. do not occur in the laminate film IB. Thermocompression lamination can be performed.

Next, when the thermocompression bonding lamination is completed, the thermocompression bonding roller 1
6 moves in a direction away from the substrate transport path from near the retreat position to the retreat position.

Furthermore, the present invention can be applied to a thin film pasting device that preheats the insulating substrate 11 of the above embodiment and then heat-presses and laminates the laminate film IB onto the insulating substrate 11 using a non-heated pressing roller.

Furthermore, the present invention can be applied to a thin film pasting device for pasting a protective film on a decorative board used as a building material.

(3) Detailed Description of the Invention As described above, according to the present invention, it is possible to prevent air bubbles from forming on the bonding surface between the substrate and the thin film.
Adhesion between the substrate and the thin film can be improved. Thereby, the reliability of the wiring on the printed circuit board can be improved.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram for explaining the schematic configuration of a thin film sticking device that is an embodiment of the present invention, FIG. 2 is a partially enlarged configuration diagram of FIG. 1, and FIG. FIG. 2 is a plan view of the lower wet roller portion of the water adhesion wet roller device shown in FIG. 1, viewed from above. FIG. 4 is a plan view seen from the arrow direction P in FIG. 3. Figure 5 shows A-A in Figure 4! 6 is a perspective view showing the schematic configuration of the water supply pipe in FIG. 5; FIG. 7 is a sectional view for explaining the arrangement of the water supply holes shown in FIG. 6; The figure is a sectional view of the main parts of the water supply device in Figure 4, and Figure 9 is
An enlarged cross-sectional view taken along line B-B in Figure 8, Figures 10 to 14 are diagrams for explaining the detailed configuration of the connecting member, and Figure 15 is for explaining the schematic configuration of the water absorption device. FIG. 16 is a sectional view taken along line C-C in FIG. 15, and FIG. 17 is a diagram for explaining the schematic system configuration of the water supply and drainage section of the thin film pasting device of this embodiment. . In the figure, IB... Laminated film (thin film), 7... Device main body, 10... Main vacuum plate (thin film supply member), IOE... Temporary attachment part, 11... Insulating substrate, 13...Sub-vacuum plate (thin film holding member)
, 14... Cutting device, 15... Rotating vacuum plate, 16... Thermocompression bonding roller, 30... Bubble prevention wet roller device, 31A. 31B...Wet roller, 32...Water supply pipe,
34.35...Connection device, 80...Water absorption device, 10
0...Air blowing is done through a nozzle.

Claims (5)

[Claims] (1) After bringing a tacking member close to the surface of the tip of the substrate in the conveying direction and tacking the tip of the thin film in the feeding direction, and separating the tacking member from the substrate surface, the tacking position is set. A thin film pasting device that abuts a pressure roller against the tip of the thin film and rotates the pressure roller to transport the substrate and paste the thin film onto the substrate, the thin film pasting device comprising: A wet roller is disposed at a position before the substrate is transported to the temporary attachment position, and the anti-foam agent is applied to the substrate. A thin film pasting device characterized by having a means for uniformly supplying the film. (2) The wet roller is comprised of a pipe having a plurality of air bubble prevention agent supply holes and a coating layer made of a porous material provided on top of the pipe. The thin film adhesion device described in 2. (3) The plurality of anti-foam supply holes provided in the pipe are respectively provided to face each other in the radial direction of the pipe, and the opposing pairs of anti-foam supply holes are each 90 degrees in phase. The thin film adhesion device according to claim 1 or 2, characterized in that the thin film adhesion devices are provided at predetermined intervals in a staggered manner. (4) The thin film applying device according to any one of claims 2 to 3, wherein the wet rollers are a pair of upper and lower parts. (5) The thin film pasting device according to any one of claims 1 to 4, wherein the wet roller is detachably provided from the main body of the device.