JPH01249163A - Dispenser nozzle and die bonder equipped with it - Google Patents

Abstract

PURPOSE:To stably attain the precise discharge state equal to the discharge state of screen printing by forming the discharge face of a nozzle to a structure which is plane and is bored with many holes and providing a margin to the nozzle to provide the specified spacing between the discharge face of the nozzle and the surface to be discharged. CONSTITUTION:The discharge face of the nozzle which discharges an adhesive agent, etc., by using a dispenser is made into the structure which is plane and is bored with the many holes. Further, the margin 105 is provided to the nozzle in order to provide the specified spacing between the discharge face and the surface to be discharged. As a result, the fine discharge state equal to the discharge state of the screen printing is stably attained.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application 1] The present invention relates to the structure of a nozzle used when dispensing adhesive using a dispenser during assembly or mounting of a semiconductor device.

[Summary of the Invention] The present invention provides a method in which the discharge surface of the nozzle is made flat and a large number of holes are formed when dispensing adhesive using a dispenser in the process of bonding a pellet to a lead frame etc. during semiconductor device assembly or mounting. It has an open structure. Furthermore, by applying a perforation to the nozzle to provide a constant gap between the ejection surface of the nozzle and the ejection target surface, it is possible to stably achieve a uniform ejection condition equivalent to screen printing.

[Prior Art 1] A conventional dispenser nozzle having a structure as shown in FIG. 3 is known.

In FIG. 3, 301 is a nozzle main body, and the upper part is a connection part with a cylinder containing an adhesive, a hose, etc.

302 is a nozzle tip into which an injection needle 303 is driven.

The adhesive is discharged from the tip of this injection needle 303.

[Problems to be Solved by the Invention] As the pellets of recent semiconductor devices have become larger, it is necessary to increase the adhesive discharge area when bonding the pellets. Further, from the viewpoint of reliability, in order to make the adhesive area ratio on the back surface of the pellet as close to 100% as possible, it is necessary to discharge the adhesive as finely and uniformly as possible.

However, since the conventional dispenser nozzle shown in Fig. 3 has a structure in which the needles are inserted, if the number of needles is increased in order to increase the adhesive discharging area, it becomes difficult to insert the needles into the needles during use. The probability that the adhesive will become clogged will also increase.Also, if you try to reduce the pitch of the holes in order to finely discharge the adhesive, the needle will also become thinner, making it even more likely that the adhesive will clog. During the bonding work, the gap and parallelism between the nozzle and the lead frame etc. change slightly, resulting in problems such as not being able to achieve a stable discharge state.

Therefore, in order to solve these conventional problems, it is an object of the present invention to stably provide a fine ejection state equivalent to screen printing.

[Means for Solving the Problems 1] In order to solve the above-mentioned problems, the dispenser nozzle of the present invention has a flat discharge surface and a shape in which a large number of holes are bored at a fine pitch. Furthermore, it is characterized by providing a perforation around the nozzle.

Moreover, a die bonder is constructed by attaching such a dispenser nozzle.

〔Example〕

Embodiments of the present invention will be described below based on the drawings. In FIG. 1, 101 is a nozzle main body, and the upper part is a connection part to a cylinder containing an adhesive or a hose. 102
is the tip of the nozzle, the discharge surface is flat, and 104 is adhesive discharge holes drilled at a fine pitch on the flat surface. 105 is an integrally formed hole around the discharge hole that has a slightly higher perforation than the discharge surface. When discharging adhesive, the tip of the nozzle is completely pressed against the surface to be discharged such as the lead frame, so that the discharge surface of the nozzle and the surface to be discharged such as the lead frame always have a constant gap and are parallel to each other. Therefore, the discharge condition is very stable.

Figure 2 is based on the same concept as Figure 1, and the degree part 1 in Figure 1 is
The difference is that instead of 05, in FIG. 2, a 205 per degree is formed by driving a bottle.

In addition, by simply attaching a dispenser nozzle as shown in FIGS. 1 and 2, a goo bonder can be constructed that can provide a bonding condition equivalent to that of screen printing, even though it is a single dispenser type.

[Effects of the Invention] As described above, the dispenser nozzle of the present invention has a structure in which the discharge surface is made flat and holes are drilled, so it is possible to make fine pitches, and the dispenser nozzle can be made with a single dispenser and an adhesive equivalent to screen printing. The discharge state can be obtained. Also, unlike a hypodermic needle, the hole is short, so there is less chance of adhesive clogging, and the nozzle is easier to clean. In addition, it does not bend or deform like a hypodermic needle, and it is extremely easy to handle as there is no need to use nerves.

Furthermore, by providing a perforation around the nozzle and completely pressing it against the lead frame etc. during discharge, the discharge surface of the nozzle and the discharge target surface such as the lead frame are always kept at a constant distance and parallelism, so that the discharge condition is maintained. is very stable.

Furthermore, a gouy bonder is constructed by attaching such a nozzle for a dispenser, and without any modification of the gouy bonder, it is possible to obtain a fine, uniform, and stable adhesive discharge state equivalent to that of a screen printing method using a single dispenser type.

The stable improvement in die bonding quality obtained in this way is 2
It also contributes to improving the reliability of finished semiconductor devices.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional view showing an embodiment of the dispenser nozzle of the present invention. FIG. 2 shows another embodiment of the dispenser nozzle of the present invention. FIG. 3 is a longitudinal sectional view of a conventional dispenser nozzle. 101... Nozzle body 102... Nozzle tip 104... Discharge hole 105... Degree per degree part 201... Nozzle body 202... Nozzle tip 204... Discharge hole 205... Degree per degree 301 ... Nozzle body 302 ... Nozzle tip 303 ... Syringe needle and above Fig. 3 301 =) Total softness 302 and squirrel 305 ... - Five fetal movements

Claims (2)

[Claims] (1) In a nozzle that discharges adhesive etc. using a dispenser, the discharge surface is flat and has a shape with many holes, and in the same nozzle, it is necessary to have a certain gap between the discharge surface and the surface to be discharged. A dispenser nozzle that is characterized by its ability to hit. (2) A die bonder comprising the nozzle according to claim 1.