JPH0123934B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides at least a coil L and a capacitor C.
The present invention relates to a composite circuit component having the following features and a method for manufacturing the same.

An example of a conventional composite circuit component is the one shown in FIG. That is, this circuit component has two recesses 21a, 21a formed on the sides of a substrate 21 made of a dielectric material, and coil devices 22, 22 each having a drum-shaped core equipped with a flange portion having a diameter larger than the recesses. A part of the coil groove is inserted into the recess, and the four coil terminals 22a drawn out from the coil are connected to the four coil terminals 22a formed on the bottom of the substrate 21.
The coil device is fixed by wrapping and tensioning the coil terminals 22a and each electrode 23 and the lead wire 24 disposed on each electrode portion at the same time. It is what it is. Note that 25 is an electrode formed on the back surface of the substrate 21, and the portion sandwiched between the front and back electrodes functions as a capacitor. Such circuit components have the effect of making the device thinner, easier to manufacture, and further improving electrical characteristics.

However, in the above-mentioned circuit component, in order to fix the coil device 22, the coil end 22a is tied around the convex portion 21b of the board, which takes a lot of man-hours, and also, as the board 21 itself tends to become thinner, There is a problem in that substrate cracking occurs during the above-mentioned binding. In addition, as the electrical characteristics become more sophisticated, the number of coil devices 22 that can be attached to one circuit board has increased, and accordingly, the number of coil devices 22 that can be attached to a single circuit board has increased.
Since the number of lead wires 24 also increases, it is necessary to take precautions to prevent short-circuit accidents between the lead wires 24.
For this reason, there is a problem in that the mounting position of the lead wire 24 is inevitably restricted. Furthermore, in order to adjust the electrical characteristics after assembly, it is often necessary to scrape off the electrode 23 attached to the substrate 21 to adjust the capacitance value of the capacitor. Since the coil terminal 22a runs, there is a risk of it being disconnected, so there is a problem in that special consideration must be taken in selecting electrodes for characteristic adjustment.

The present invention has been made in view of the above circumstances, and provides a composite circuit component that can improve reliability and facilitate manufacturing by solving the aforementioned problems at once, and its manufacture. The purpose is to provide a method.

The present invention will be specifically explained below using Examples.

FIG. 2 is a perspective view of an embodiment showing the structure of a coil device and a substrate used in the present invention. In the figure, 1 is a substrate made of a ceramic substrate, etc., and 3
is a coil device. In the coil device 3, the coiled body 3a has a substantially cylindrical shape with a flat surface 3b on a part of the circumferential side, and a coil 4 is wound around the center thereof. Moreover, the winding body 3a of this coil device 3
A cut groove 3c, which passes through the center of each end face and extends in a direction perpendicular to the flat surface 3b, is formed on both end faces of the
3c is formed. Further, each of the kerfs 3c, 3c is provided with a thin film-like conductive layer 5 formed on its inner surface by, for example, baking a conductive paste or adhering a metal foil. Coil terminals 4a, 4a each drawn out from the coil 4 in the same direction are placed in the coils 3c, 3c so as to extend over the conductive layer 5 from the flat surface 3b side of the winding body 3a. In this case, preliminary solder is applied to the coil terminals 4a, 4a. The heating during preliminary soldering causes the insulating coating applied to the end of the coil to peel off, exposing the conductive portion. Similarly, if necessary, the winding body 3a may be
Heat-resistant adhesives 6, 6 are applied to the drawn-out portions of the coil terminals 4a, 4b on the flat surface 3b by an appropriate means. On the other hand, a recess 2 is formed in a side portion of the substrate 1, and has a pair of opposing sides 2a, 2a with an interval that allows each of the kerfs 3c, 3c of the coil device 3 to be inserted therein. Electrode layers 1a, 1a are formed on each of the electrode layers 1a, 1a extending to the ends thereof by printing, vapor deposition, or the like. The groove width of each groove 3c formed in the coil device 3 is approximately equal to the thickness of the substrate 1 (the thickness of the electrode layer 1a is negligible with respect to the thickness of the substrate 1). Alternatively, the coil device 3 is set to be slightly wider than that, thereby ensuring that the coil device 3 is fixed to the substrate 1.

FIG. 3 is a perspective view showing one embodiment of the overall structure of the substrate 1. As shown in FIG. This substrate 1 has two recesses 2, 2 having the above-mentioned structure formed on its sides, and three electrode layers 1 arranged at predetermined intervals on the surface.
a ₁ , 1a ₂ , 1a ₃ are formed by printing or vapor deposition, and a wide electrode layer 1a ₄ is formed on the back surface to correspond to all of the electrode layers 1a ₁ to 1a ₃ on the front surface. . Note that the electrode layers 1a ₁ to 1 formed on the surface
1a ₃ is formed so as to extend to the end of each opposing side of the recesses 2, 2. Further, 7a to 7c are lead wires that are connected to each of the electrode layers at a manufacturing stage to be described later. Note that the electrode layer formed on the back surface of this substrate may be formed to extend to the opposite sides of the recess 2.

Next, a method for manufacturing a composite circuit component by assembling each of the above-mentioned members will be explained step by step.

To obtain the coil device 3 shown in FIG. 2,
After winding a predetermined number of coils 4 around the central coil winding portion of a substantially cylindrical winding body 3a having a flat surface 3b,
The coil terminals 4a, 4b are pulled out from the direction of the flat surface 3b, bent and made to run over the conductive layer 5 formed in the grooves 3c, 3c at both ends of the winding body 3a. , 4a are coated with heat-resistant adhesives 6, 6 on the flat surfaces 3b near the bent portions.

Two coil devices 3 obtained in this way are prepared, and the flat surfaces of the coil devices 3, 3 are inserted into the two recesses 2, 2 of the substrate 1 into the locking pieces 2 of the substrate recesses.
Insert and arrange it so that it faces c and 2c. At this time, since the relative spacing and groove width of the grooves 3c, 3c of the coil device 3 are designed to fit into the recess 2 of the substrate 1, as described above, the insertion is performed smoothly. , and since the flat surface 3b and the locking edge 2c of the recess are bonded via the heat-resistant adhesive 6, both are securely fixed, and when the device is moved for the next process. However, there is no risk that the coil device will fall off from the board 1. Further, since the winding body 3a is formed with a flat surface 3b, positioning during insertion becomes extremely easy. Incidentally, during the insertion and fixation, the coil end 4a is held between the opposite side 2a of the recess 2 of the substrate 1 and the conductive layer 5 formed on the cut groove 3c of the coil device 3.

Next, the substrate 1 is held between the lead wires 7a to 7c, which are fixed to the apparatus main body (not shown) as shown in FIG. 3 and have protruding tips.
That is, the lead wires 7a and 7c on both sides are brought into contact with the electrode layers 1a ₁ and 1a ₃ at both ends on the front surface of the substrate 1, respectively, and the central lead wire 7b is brought into contact with the electrode layers 1a ₄ formed on the back surface of the substrate 1. The board 1 is held between the lead wires so as to be in contact with the lead wires.

Thereafter, the entire device thus obtained is preheated and immersed in a solder bath (not shown). In this way, the conductive layer 5 in each kerf 3C, 3C
The coil terminal 4a is soldered to the electrode layer of the substrate 1, and at the same time, the electrode layer and the lead wire are soldered.

At this time, since the coil device is fixed to the substrate by the heat-resistant adhesive, it will not fall off from the substrate even if it is turned upside down during soldering. Further, as described above, since preliminary soldering is applied to the coil terminal and the insulating coating is peeled off, the electrical connection between the coil terminal and the electrode layer is ensured.

In this way, a composite circuit component as shown in FIG. 4 is obtained. This device is, for example, a low-pass filter whose equivalent circuit is shown in FIG.

The present invention is not limited to the embodiments described above, and various modifications are possible. For example, regarding the structure of the coil device 3, as shown in FIG. 6 and FIG.
The cut grooves 3c formed at both ends of the substrate 1 are
The insertion work may be facilitated by forming the side to be inserted wide and providing the conductive layer 5 on the inner surface thereof. Furthermore, as shown in FIG. 8, only a portion of the conductive layer 5 formed in the cut groove 3c remains on the side opposite to the side perpendicular to the flat surface 3b, thereby simplifying the conductive layer forming operation and saving materials. Alternatively, a method may be considered such as providing an arcuate portion R on the drawing surface of the coil terminal 4a to prevent the coil terminal 4a from being disconnected when inserted into the recess of the board 1. Incidentally, the coil device 3 in the above embodiment
All of these are provided with a flat surface 3b that is convenient for positioning during insertion, but they are not necessarily limited to this, and may have a simple cylindrical shape, for example, as shown in FIG. 9, or may have other shapes. . Further, for the substrate 1, as shown in FIG. 10, for example, an arcuate portion R may be formed at the end of the opposite side 2a of the recess 2 to further facilitate the insertion work.

In the above embodiment, a low-pass filter was described in which three capacitors C were formed and two coil devices L were used, but it may be a single LC circuit, or even more capacitors and coil devices may be used. Needless to say, it may be any device used.

According to the present invention as described above, it is possible to insert and fix the coil terminal into the concave part of the substrate with the coil terminal set in the cut groove of the winding body, so that it is not necessary to wrap the coil terminal around the convex part of the substrate as in the conventional case. This eliminates the need for any work, significantly reducing the number of man-hours, and eliminates accidents such as cracking of the board due to binding. Since the conductive layer is provided in the cut groove, the solder adheres to the conductive layer and the electrode layer 1a during soldering, and the coil terminal on the conductive layer is reliably electrically connected to the electrode layer of the board. Ru.

In addition, in the past, the coil terminal was tied to the convex part of the bottom of the board, so there was a risk that the lead wire of the main body would come into contact with it and cause a short circuit accident, but in the present invention, the coil terminal is tied to the concave part of the board. Since it is soldered, there is no risk described above, which increases the degree of freedom in positioning the lead wires and drastically reduces short-circuit accidents during assembly.

Furthermore, in the past, the coil terminal ran on the electrode layer, and in order to eliminate variations in characteristics due to the demand for high-precision characteristics, it was necessary to remove the electrode layer on the board to make adjustments so as not to break the coil terminal. However, in the present invention, since the electrode layer can be freely processed, the electrical characteristics can be easily improved.

Therefore, according to the present invention, it is possible to provide a composite circuit component and a method for manufacturing the same, which can improve reliability, facilitate manufacturing, and are particularly effective in automating assembly.

[Brief explanation of drawings]

Fig. 1 is a front view showing an example of a conventional device, Fig. 2 is a perspective view showing an example of the structure of a coil device and a substrate used in the present invention, and Fig. 3 is an entire board used in the present invention. FIG. 4 is a perspective view showing an embodiment of the structure, FIG. 4 is a front view showing an embodiment of the assembled state of the device of the present invention, FIG. 5 is an equivalent circuit diagram thereof, and FIGS.
This figure is a perspective view showing another embodiment of the coil device used in the present invention, and FIG. 10 is a perspective view showing another embodiment of the substrate used in the present invention. 1... Board, 2... Recess, 3... Coil device,
3a... Winding body, 3c... Cut groove, 4... Coil, 4
a... Coil terminal, 5... Conductive layer, 6... Adhesive, 7a to 7c... Lead wire.

Claims (1)

[Scope of Claims] 1. A dielectric substrate in which capacitor electrode layers are formed on the front and back sides, a recess is formed in a side portion, and an electrode layer on the front and back surfaces is formed to extend on sides opposite to the recess; Cut grooves that are engaged with the recesses of the substrate are formed on both end surfaces of the winding body having a coil and a coil terminal, and a conductive layer made of conductive paste or metal foil is formed in each of the cut grooves, and The present invention is characterized by comprising a coil device in which the coil terminals drawn out in the same direction are placed on layers, and lead wires electrically connected to each electrode layer of the substrate and the coil terminals. Composite circuit components. 2. Claim 1, characterized in that the coil device is provided with a flat portion such that the circumferential surface of the collar portion and the bottom surface of the recess are in contact with each other when the coil device is inserted into the recess of the substrate. composite circuit components. 3 A coil device is constructed by providing cut grooves on both end faces of the winding body, forming a conductive layer in each cut groove, and placing coil terminals drawn out in the same direction on each conductive layer. On the other hand, a recess is formed on the side of the substrate, and capacitor electrode layers are formed on the front and back sides of the substrate, one of the capacitor electrode layers is formed to extend to the opposite side of the recess, and the coil device is placed inside the recess of the substrate. A method for manufacturing a composite circuit component, comprising: inserting and fixing the coil into a circuit board, bringing a lead wire into contact with an electrode layer of a board and sandwiching it, and simultaneously soldering the coil terminal, the electrode layer, and the lead wire. 4. The method of manufacturing a composite circuit component according to claim 3, wherein when inserting the coil device into the recess of the substrate, a heat-resistant adhesive is used to fix the coil device.