JPH01232734A - Surface mounting component and mounting method therefor - Google Patents
Surface mounting component and mounting method thereforInfo
- Publication number
- JPH01232734A JPH01232734A JP63058426A JP5842688A JPH01232734A JP H01232734 A JPH01232734 A JP H01232734A JP 63058426 A JP63058426 A JP 63058426A JP 5842688 A JP5842688 A JP 5842688A JP H01232734 A JPH01232734 A JP H01232734A
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- components
- point solder
- component
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔概 要〕
表面実装部品を基板上に実装する実装方法に関し、
実装部品の仮留め作業の効率化を図ると共に正確な位置
に実装することを目的とし、
半田を付着させた表面実装部品を複数個基板上に実装す
る実装方法であって、前記部品に低融点半田と高融点半
田とを付着させておき、恒温槽内で前記低融点半田の付
着した部品を前記基板上の所定位置に載置して、前記低
融点半田の融点を幾分上回る温度にてフラックスのアル
コール成分を抜くキュア工程を施し、次に上記工程によ
り部品の仮留めされた基板を高温蒸気槽内で所定温度に
保持することにより前記高融点半田を溶融して部品の最
終半田付けを施すよう構成する。[Detailed Description of the Invention] [Summary] Regarding a mounting method for mounting surface-mounted components on a board, the present invention aims to improve the efficiency of the temporary fixing work of mounted components and to mount them in accurate positions. A mounting method for mounting a plurality of surface mount components on a board, in which a low melting point solder and a high melting point solder are attached to the components, and the components to which the low melting point solder is attached are mounted in a thermostatic oven. It is placed in a predetermined position on the board, and a curing process is performed to remove the alcohol component of the flux at a temperature slightly higher than the melting point of the low melting point solder, and then the board with the parts temporarily attached in the above process is heated with high temperature steam. The high melting point solder is melted by maintaining it at a predetermined temperature in the tank to perform final soldering of the components.
本発明は表面実装部品を基板上に実装する実装方法とそ
の実装部品に関する。The present invention relates to a mounting method for mounting surface-mounted components on a substrate and the mounted components.
−ｍに表面実装部品を基板上に実装するには、基板並び
に実装部品の全体を早く、均一に所定温度に加熱するこ
との可能な蒸気（例えばフロリナート蒸気）が使用され
る。即ち、蒸気の温度によって実装部品の裏面に付着さ
せである半田を溶融させ、これにより基板上に部品を実
装する。In order to mount surface mount components on a substrate, steam (for example, Fluorinert steam) is used that can quickly and uniformly heat the entire substrate and the mounted components to a predetermined temperature. That is, the temperature of the steam melts the solder attached to the back surface of the mounted component, thereby mounting the component on the board.
然しなからこの場合において、温度の低い実装部品や基
板によって蒸気が凝縮し、この凝縮液のため各実装部品
が所定位置から移動するという不具合が生ずる。そこで
従来から半田を付着させた部品を基板に仮留めする作業
が行なわれている。However, in this case, a problem arises in that the steam condenses on the low-temperature mounted components and the board, and the condensed liquid causes the mounted components to move from their predetermined positions. Therefore, work has traditionally been carried out to temporarily fasten parts to which solder has been applied to a board.
この仮留め方法として赤外線、又はホットエアを用いて
各部品毎に暖め、各部品に付着させている半田の一部を
溶融させて基板に仮留めする。As a temporary fixing method, each component is heated using infrared rays or hot air, and a portion of the solder attached to each component is melted and temporarily fixed to the board.
然しなから、上記仮留め方法では実装部品の数に応じた
仮留め作業時間を要し、必ずしも効率的ではない。However, the temporary fixing method described above requires a temporary fixing operation time corresponding to the number of mounted components, and is not necessarily efficient.
依って本発明は実装部品の仮留め作業の効率化を図ると
共に正確な位置に実装することを目的とする。SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to improve the efficiency of the temporary fixing work of mounted components and to mount them in accurate positions.
上記目的に鑑みて本発明は、実装部品に通常の高融点半
田の他、低融点の半田をも付着させておき、恒温槽内で
前記低融点半田の付着した部品を前記基板上の所定位置
に載置して、前記低融点半田の融点を幾分上回る温度に
てフラックスのアルコール成分を抜くキュア工程を施し
、次に上記工程により部品の仮留めされた基板を高温蒸
気槽内で所定温度に保持することにより前記高融点半田
を溶融して部品の最終半田付けを施す実装方法と、上記
の高融点半田と低融点半田との二種類の半田を付着させ
た実装部品とを提供する。In view of the above-mentioned object, the present invention includes attaching low melting point solder as well as normal high melting point solder to mounted components, and placing the components with the low melting point solder attached at a predetermined position on the board in a constant temperature oven. A curing process is performed to remove the alcohol component of the flux at a temperature slightly higher than the melting point of the low melting point solder, and then the board with the components temporarily attached in the above process is heated to a predetermined temperature in a high temperature steam bath. The present invention provides a mounting method for final soldering of components by melting the high melting point solder by holding the component at a temperature of 50.degree.
（作 用〕
低融点半田を有した部品は、フラックスのアルコール成
分を蒸発させるキュア工程中において溶融し、特別に仮
留め用の別工程を設けなくとも仮留めが実施され得る。(Function) Components having low melting point solder are melted during the curing process in which the alcohol component of the flux is evaporated, and temporary fixing can be performed without a special separate process for temporary fixing.
この基板に仮留めされた部品の高融点半田は、最終の高
温蒸気槽内において溶融し、これにより部品が基板上に
最終半田付けされることとなる。The high melting point solder of the component temporarily fastened to the board is melted in the final high temperature steam bath, thereby final soldering of the component onto the board.
（実施例〕
以下本発明を添付図面に示す実施例に基づいて更に詳細
に説明する。第１図は本発明に係る表面実装部品１０の
裏面の模式図であり、例えば融点が２１５°Ｃ程度の高
融点半田１２を接続バンプとして有し、更に適宜な箇所
（本実施例では２箇所）に、例えば融点が１１５°Ｃ程
度の低融点半田１４を付着させている。(Example) The present invention will be described in more detail below based on an example shown in the accompanying drawings. Fig. 1 is a schematic diagram of the back side of a surface mount component 10 according to the present invention, and the melting point is about 215°C. It has high melting point solder 12 as a connection bump, and low melting point solder 14 having a melting point of about 115° C., for example, is attached to appropriate locations (two locations in this embodiment).
上記の半田を有した実装部品と基＋＆Ｉ６（第２図）の
プリントパッド（図示せず）との半田接合を十分に行な
うために、予め該基板Ｉ Ｅｉ上面にフラックスを塗布
する。このフラックス中にはアルコール成分を有してお
り、もし高融点半田１２を溶融させる場合にこのアルコ
ール成分が残留しておれば、激しく沸騰するため実装部
品が所定位置からずれるという不具合を生ずる。従って
予めキュア工程を設けてこのアルコール成分を蒸発させ
ておく必要がある。本発明は恒温槽内においてこのキュ
ア工程を利用して前記低融点半田１４を溶融させて実装
部品ｌＯを基板１６上の所定位置に仮留めするものであ
る。即ちキュア工程の温度は１１５”Ｃを僅かに上回る
温度で行なう。この程度の温度であればアルコール成分
の沸騰は上述した程激しくはないため実装部品が移動す
るごとはない。Flux is applied in advance to the upper surface of the board IEi in order to sufficiently solder bond the mounted components with the above solder to the print pad (not shown) of the board I6 (FIG. 2). This flux contains an alcohol component, and if this alcohol component remains when the high melting point solder 12 is melted, it will boil violently, causing problems such as displacement of the mounted components from their predetermined positions. Therefore, it is necessary to provide a curing step in advance to evaporate this alcohol component. The present invention utilizes this curing process in a constant temperature bath to melt the low melting point solder 14 and temporarily fix the mounted component 10 at a predetermined position on the board 16. That is, the temperature of the curing step is slightly higher than 115''C. At this temperature, the boiling of the alcohol component will not be as violent as described above, and the mounted components will not move.
このキュア工程の後で、各実装部品１０ａ、１０ｂ。After this curing process, each mounted component 10a, 10b.
１０ｃ 、 ｌＯｄ （第２図）が低融点半田１４によ
って仮留めされた基板１６を他の恒温槽２０に移し、温
度が２１５°Ｃを少し上回った値のフロリナート蒸気雰
囲気とする。この場合に初期の間はフロリナート蒸気が
基板１６上に凝縮するが各部品１０ａ。10c, lOd (FIG. 2), the substrate 16 temporarily fixed by the low melting point solder 14 is transferred to another thermostatic chamber 20, and a Fluorinert vapor atmosphere is created at a temperature slightly above 215°C. In this case, during the initial period, Fluorinert vapor condenses on the substrate 16, but not on each component 10a.
１０ｂ 、 １０ｃ 、 １０ｄは低融点半田１４によ
って仮留めされているため動くことはない。更に時間が
経過すると低融点半田１４は溶融する。然しなからその
溶融半田の表面張力は大きく、フロリナートの凝縮液に
よって各部品が移動することはない。10b, 10c, and 10d are temporarily fixed with low melting point solder 14, so they do not move. As time passes further, the low melting point solder 14 melts. However, the surface tension of the molten solder is high, and the parts will not move due to Fluorinert condensate.
やがて高融点半田１２が溶融する。以上に要する時間は
数分である。Eventually, the high melting point solder 12 melts. The time required for the above is several minutes.
以上に述べた表面実装部品はいわゆるバンプ部品と呼ば
れるものに限らず、例えばチップコンデンサー等のチッ
プ部品であってもよい。この場合は基板上の所定位置に
半田ペースト（半田とフラックスの混合物）を付着させ
ておくことのみがバンプ部品の場合と異なるが、他の実
装方法は同じである。The surface mount components described above are not limited to so-called bump components, but may also be chip components such as chip capacitors. In this case, the only difference from the bump component is that solder paste (a mixture of solder and flux) is attached to a predetermined position on the board, but the other mounting methods are the same.
以上の説明から明らかな様に本発明によれば、表面実装
部品の基板への仮留め作業時間の短縮が達成されると共
に、正確な位置に実装可能となる。As is clear from the above description, according to the present invention, it is possible to shorten the work time for temporarily fixing a surface mount component to a substrate, and it is also possible to mount the surface mount component in an accurate position.
第１図は本発明に係る表面実装部品の裏面の略示図、
第２図は実装方法説明用模式側面図である。
ｌＯ・・・表面実装部品、 １２・・・高融点半田、
１４・・・低融点半田、 １６・・・基板。FIG. 1 is a schematic diagram of the back side of a surface mount component according to the present invention, and FIG. 2 is a schematic side view for explaining the mounting method. IO...Surface mount component, 12...High melting point solder,
14...Low melting point solder, 16...Substrate.
Claims (1)
０ｂ、１０ｃ、１０ｄ）を複数個基板（１６）上に実装
する実装方法であって、 前記部品に低融点半田（１４）と高融点半田（１２）と
を付着させておき、 恒温槽内で前記低融点半田の付着した部品を前記基板上
の所定位置に載置して、前記低融点半田の融点を幾分上
回る温度にてフラックスのアルコール成分を抜くキュア
工程を施し、 次に上記工程により部品の仮留めされた基板を高温蒸気
槽内で所定温度に保持することにより前記高融点半田を
溶融して部品の最終半田付けを施す ことを特徴とする表面実装部品の実装方法。 ２、底面に低融点半田（１４）と高融点半田（１２）と
を付着させたことを特徴とする表面実装部品。[Claims] 1. Surface mount components with solder attached (10, 10a, 1
0b, 10c, 10d) on a board (16), in which a low melting point solder (14) and a high melting point solder (12) are attached to the components, and the components are heated in a constant temperature oven. The component to which the low melting point solder is attached is placed on a predetermined position on the board, and a curing step is performed to remove the alcohol component of the flux at a temperature slightly higher than the melting point of the low melting point solder, and then the above step is performed. A method for mounting surface mount components, comprising: holding a board to which components are temporarily attached at a predetermined temperature in a high-temperature steam bath to melt the high melting point solder and final soldering of the components. 2. A surface mount component characterized in that a low melting point solder (14) and a high melting point solder (12) are attached to the bottom surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63058426A JPH01232734A (en) | 1988-03-14 | 1988-03-14 | Surface mounting component and mounting method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63058426A JPH01232734A (en) | 1988-03-14 | 1988-03-14 | Surface mounting component and mounting method therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01232734A true JPH01232734A (en) | 1989-09-18 |
Family
ID=13084056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63058426A Pending JPH01232734A (en) | 1988-03-14 | 1988-03-14 | Surface mounting component and mounting method therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01232734A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5348214A (en) * | 1990-11-20 | 1994-09-20 | Sumitomo Electric Industries, Ltd. | Method of mounting semiconductor elements |
-
1988
- 1988-03-14 JP JP63058426A patent/JPH01232734A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5348214A (en) * | 1990-11-20 | 1994-09-20 | Sumitomo Electric Industries, Ltd. | Method of mounting semiconductor elements |
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