JPH01222501A - High frequency circuit - Google Patents

Abstract

PURPOSE:To reduce the entire size and to facilitate wire connection by forming a microwave strip line for impedance matching and a laminator capacitor in one and same dielectric board and connecting then within on and same plane. CONSTITUTION:A metallized layer 5 is formed uniformly to the lower surface of a high dielectric substrate 2, and a microwave strip line 3 and an electrode 6-1 of a laminator capacitor are made to the left side of the upper surface by the same metallized layer. Electrodes 6-2-6-5 of the laminator capacitor 1 are formed in the inside of the right side of the high dielectric substrate 2 sequentially via part of the thickness of the substrate 2. The electrodes 6-2-6-5 are connected alternately to connection metallized layers 8, 9. The metallized layer 9 is connected to the metallized layer 5 and the metallized layer 8 is connected to the upper electrode 6-1 along the side of the substrate 2 to form the laminator capacitor. Thus, the entire size is reduced and the wire connection is facilitated.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a high frequency matching circuit, and particularly to a high frequency circuit using a high dielectric substrate.

[Conventional technology]

Conventionally, this type of high frequency circuit has separately used a microwave strip line using a high dielectric substrate and a single layer capacitor using a similar substrate.

3 and 4 are a plan view and a vertical cross-sectional view taken along line AA' in FIG. 3, respectively, of a conventional high frequency matching circuit.

As shown in FIG. 3, the single-layer capacitor 7 has a large area, and as shown in FIG. There will be a difference in level.

[Problem to be solved by the invention]

In the above-mentioned conventional high frequency circuit, in order to obtain the capacitance value necessary for impedance matching, it was necessary to make the capacitor thinner and increase the size of the capacitor in order to widen the facing area of the electrode portion. For this reason, it is necessary to separate the microwave stripline from the board that forms it, which increases the overall size.Also, because the heights of the microwave stripline board and the capacitor are different, it is difficult to connect the wires that connect them. It had the drawback of being difficult.

[Means to solve the problem]

In contrast to the above-mentioned conventional high-frequency matching circuit in which a single-layer capacitor and a microwave strip line are configured on separate substrates, the high-frequency circuit of the present invention has a microwave strip line and a high capacitance value obtained on the same high dielectric substrate. It has a multilayer capacitor.

〔Example〕

Next, the present invention will be explained with reference to FIGS. 1 and 2.

A metallized layer 5 is uniformly formed on the lower surface of the high dielectric substrate 2, and the microwave strip life plate 3 and the electrode 6-1 of the multilayer capacitor 1 are formed of the same metallized layer on the left side of the upper surface. There is. High dielectric substrate 2
The electrodes 6-2 of the multilayer capacitor l are inside the right side of the
6-5 are successively formed through a part of the thickness of the substrate 2. These electrodes 6-2.6-5.6-3.6-4 are alternately connected to the connection metallization 8, 9. The metallization 9 is connected to the metallization 5, and the metallization 8 is connected to the upper electrode 6-1 along the side of the substrate 2, forming a multilayer capacitor. The dielectric substrate 2 is formed by stacking and firing a large number of green sheets using a normal method for manufacturing ceramic capacitors. And each electrode 6-2~
6-5 can be formed by metallizing between these green sheets.

〔Effect of the invention〕

As explained above, in the present invention, a microwave strip line for impedance matching and a multilayer capacitor are formed in the same high dielectric substrate, and these are connected in the same plane.
ing. Compared to conventional single-layer capacitors, the laminated structure allows the area to be smaller, and it can be made to the same thickness as a microwave stripline board, which eliminates the difficult task of bonding wires to places with steps. Not only is this unnecessary, but also there is an effect that the mounting of the board becomes extremely simple by combining two boards into one.

[Brief explanation of the drawing]

FIG. 1 is a plan view of the high frequency circuit of the present invention, FIG. 2 is a vertical sectional view taken along line BB' in FIG. 1, FIG. 3 is a plan view of a conventional high frequency circuit, and FIG. It is a longitudinal cross-sectional view taken along AA'. 1... Multilayer capacitor, 2... High dielectric substrate, 3... Microwave strip line,
4... Bonding wire, End... Metallization, 6-1 to 6-5... Capacitor electrode,
7...Single layer capacitor, 8.9...Metallization for connection. Agent Patent Attorney Oto Uchihara

Claims (1)

[Claims] A microwave strip line and a multilayer capacitor are formed on a dielectric substrate having a uniform thickness, and the microwave strip line and the multilayer capacitor are connected on one surface of the dielectric substrate. High frequency circuit.