JPH01208626A - Air conditioner - Google Patents
Air conditionerInfo
- Publication number
- JPH01208626A JPH01208626A JP63033175A JP3317588A JPH01208626A JP H01208626 A JPH01208626 A JP H01208626A JP 63033175 A JP63033175 A JP 63033175A JP 3317588 A JP3317588 A JP 3317588A JP H01208626 A JPH01208626 A JP H01208626A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat pipe
- power transistor
- equipment part
- electrical equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Air Filters, Heat-Exchange Apparatuses, And Housings Of Air-Conditioning Units (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は空気調和機に使用されるパワートランジスタの
冷却装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a cooling device for power transistors used in air conditioners.
従来の技術
従来、分離形空気調和機の室外機に備えた電装部のパワ
ートランジスタの冷却装置、すなわちインバータ式空気
調和機のパワートランジスタの冷却装置は、第3図に示
すような構成であった。電装部1の箱体2の側壁3を備
え、この側壁3の一部を開口した開口部4を設け、この
開口部4にヒートシンク6を固着している。このヒート
シンク6には、放熱面積を大とするためのフィンeを送
風機側A(図示せず)に突出して設け、その反対側の平
面部7には、発熱量の大きいパワートランジスタ8を固
着している。こうして従来は、送風機側Aの送風機を運
転することによって、フィン6の近辺に空気流を起生さ
せ、パワートランジスタ8から発熱する熱をヒートシン
ク5に伝熱せしめ、かつ、フィン6に伝達した熱を前記
空気流によって放熱させ、パワートランジスタ8を冷却
していた。Conventional technology Conventionally, a cooling device for a power transistor in an electrical component of an outdoor unit of a separate air conditioner, that is, a cooling device for a power transistor in an inverter type air conditioner, had a configuration as shown in Fig. 3. . A side wall 3 of a box 2 of an electrical equipment section 1 is provided, an opening 4 is provided by opening a part of this side wall 3, and a heat sink 6 is fixed to this opening 4. This heat sink 6 is provided with fins e that protrude toward the blower side A (not shown) to increase the heat dissipation area, and a power transistor 8 that generates a large amount of heat is fixed to the flat part 7 on the opposite side. ing. In this way, conventionally, by operating the blower on the blower side A, an air flow is generated near the fins 6, the heat generated from the power transistor 8 is transferred to the heat sink 5, and the heat transferred to the fins 6 is transferred to the heat sink 5. The power transistor 8 was cooled by dissipating heat through the air flow.
発明が解決しようとする課題
このような従来の構成では、ヒートシンク6の外形に応
じて、側壁ミの開口部を大きく開口させていただめ、開
口部4の内側とヒートシンク5の外周との隙間のシール
が困難で、どうしても電装部外部、すなわち、送風機側
Aからの水滴や塵埃が電装部内部に侵入してしまうとい
う課題があった。また、ヒートシンク5の平面部7の寸
法が比較的大なるため電装部1の設計に際し、ヒートシ
ンク6の装9着のスペース確保のため、平面部7の外周
を形成する開口部4を含めて設計上の大きな制約となっ
てしまうという課題があった。Problems to be Solved by the Invention In such a conventional configuration, the opening in the side wall is made large according to the external shape of the heat sink 6, and the gap between the inside of the opening 4 and the outer periphery of the heat sink 5 is reduced. There was a problem in that sealing was difficult and water droplets and dust from the outside of the electrical component, that is, from the blower side A, inevitably entered the interior of the electrical component. In addition, since the dimensions of the flat part 7 of the heat sink 5 are relatively large, when designing the electrical component part 1, an opening 4 forming the outer periphery of the flat part 7 is included in the design in order to secure space for mounting the heat sink 6. The problem was that it became a major constraint on the above.
本発明はこのような課題を解決するもので、開口部を小
さくして電装部外部からの水や塵埃の侵入を防止すると
ともに、ヒートシンクのスペースを電装部に考慮する必
要を無くし、よりコンパクトな電装部の箱体を提供する
ことを目的法するものである。The present invention solves these problems by making the opening smaller to prevent water and dust from entering from outside the electrical component, and also eliminates the need to consider the space for the heat sink in the electrical component, making it more compact. The purpose is to provide a box for the electrical equipment section.
課題を解決するための手段
この課題を解決するために本発明は、仕切板によって熱
交換器室と圧縮機室とを区画形成し、前記仕切板上に電
装部をもつ箱体を設け、前記箱体、の側壁にヒートパイ
プを前記熱交換器室と、前記電装部の箱体とにわたって
貫通した貫通穴を備え、前記ヒートパイプの一方の箱体
側に金具を介してパワートランジスタ等を装着し、他方
を熱交換器室側にヒートシンクを形成する放熱板を装着
した冷却装置を備えた構成としたものである。Means for Solving the Problem In order to solve this problem, the present invention divides a heat exchanger room and a compressor room by a partition plate, provides a box body having an electrical component on the partition plate, and A heat pipe is provided in a side wall of the box body with a through hole passing through the heat exchanger chamber and the box body of the electrical equipment section, and a power transistor or the like is attached to one side of the box body of the heat pipe via a metal fitting. However, the other side is equipped with a cooling device equipped with a heat sink that forms a heat sink on the side of the heat exchanger chamber.
作 用
この構成によシ、ヒートパイプの箱体側に固着されたパ
ワートランジスタの発熱は、金具を介してヒートパイプ
の他端に固着された放熱板に熱搬送され、かつ、放熱板
により送風機の運転による空気に放熱されて、パワート
ランジスタは冷却されることとなる。Effect With this configuration, the heat generated by the power transistor fixed to the box side of the heat pipe is transferred via the metal fittings to the heat sink fixed to the other end of the heat pipe, and the heat sink is transferred to the blower by the heat sink. The power transistor is cooled by heat dissipated into the air due to the operation.
実施例
以下本発明による一実施例を第1図および第2図にもと
づき説明する。第2図において分離形でインバータ搭載
のヒートポンプ式空気調和機の室外機の本体11内には
主要部品として熱交換器12と、送風機13と、圧縮機
14および電装部16で構成されている。そして、図示
のごとく仕切板3oによって熱交換器室12′と圧縮機
14を有した圧縮機室14′が区画形成されている。電
装部16は圧縮機14の上方に形成した箱体16に覆れ
て前記圧縮機14の上部の空間に設けられている。EXAMPLE An example of the present invention will be described below with reference to FIGS. 1 and 2. In FIG. 2, a heat exchanger 12, a blower 13, a compressor 14, and an electrical unit 16 are included as main parts in the main body 11 of the outdoor unit of the heat pump air conditioner equipped with a separate inverter. As shown in the figure, a heat exchanger chamber 12' and a compressor chamber 14' having a compressor 14 are defined by the partition plate 3o. The electrical equipment section 16 is covered by a box 16 formed above the compressor 14 and is provided in a space above the compressor 14.
また電装部16には、プリント基板18、発熱の大なる
パワートランジスタ19と、このパワートランジスタ1
9の冷却装置20等を有している。The electrical equipment section 16 also includes a printed circuit board 18, a power transistor 19 that generates a lot of heat, and a power transistor 19 that generates a lot of heat.
It has 9 cooling devices 20, etc.
つぎに第1図によシ冷却装置2oの詳細を説明する。パ
ワートランジスタ19は熱伝導性の良好な金具23に固
着され、この金具23はヒートパイプ26の一方に設け
られた穴に固着されている。Next, the details of the cooling device 2o will be explained with reference to FIG. The power transistor 19 is fixed to a metal fitting 23 having good thermal conductivity, and this metal fitting 23 is fixed to a hole provided in one side of the heat pipe 26.
前記ヒートパイプ26は箱体16の側壁26の中央部を
貫通する貫通穴22を設けるとともに、前記箱体16の
貫通穴22をシリコン系のシール材27等によシ周囲の
内側を密封している。そしてヒートパイプ26の他端を
電装部15の外に臨ませるとともに、ヒートシンクを形
成する放熱板28を前記ヒートパイプ26に固着しであ
る。すなわち、放熱板28は、ヒートパイプ26と中央
部において固着嵌合し、凹凸状に形成したフィン部20
aと嵌合部2obとよシなる。The heat pipe 26 is provided with a through hole 22 that passes through the center of the side wall 26 of the box body 16, and the inside of the periphery of the through hole 22 of the box body 16 is sealed with a silicon-based sealant 27 or the like. There is. The other end of the heat pipe 26 is made to face the outside of the electrical equipment section 15, and a heat sink 28 forming a heat sink is fixed to the heat pipe 26. That is, the heat dissipation plate 28 is firmly fitted to the heat pipe 26 at the center, and has a fin portion 20 formed in an uneven shape.
a and the fitting part 2ob are different.
上記構成において、パワートランジスタ19で発熱した
熱は金具23を介して、ヒートパイプ26に伝熱され、
その熱はヒートパイプ26内の熱対流によりヒートパイ
プ28の他端に固着されたヒートシンクの放熱板28に
熱搬送される。そして放熱板28の熱は、放熱板28に
設けられたフィン部20 aにより、送風機13の運転
による周囲の空気に放熱され、パワートランジスタ19
は冷却されるのである。In the above configuration, the heat generated by the power transistor 19 is transferred to the heat pipe 26 via the metal fitting 23,
The heat is transferred by thermal convection within the heat pipe 26 to a heat sink plate 28 of a heat sink fixed to the other end of the heat pipe 28. The heat of the heat sink 28 is radiated to the surrounding air by the operation of the blower 13 by the fin portion 20a provided on the heat sink 28, and the heat is radiated to the surrounding air by the operation of the blower 13.
is cooled.
発明の効果
前記実施例の説明よシ明らかなように本発明によれば、
ヒートパイプを用いて、電装部内に位置するヒートパイ
プの端部K パワートランジスタを固着させ、他端を電
装部の側壁を貫通して電装部外に位置させて、放熱板に
よる冷却装置を設けたから、箱体の貫通穴を小さくでき
て、電装部の水密性を向上させることができ、電装部外
からの水滴や、塵埃が侵入することもなく、またヒート
シンクとなる放熱板を電装部内でなく、電装部外に設け
ることができるので、箱体をよシ小さくコンパクトに設
計でき、その実用的効果は大きい。Effects of the Invention As is clear from the description of the above embodiments, according to the present invention,
Using a heat pipe, the power transistor is fixed to the end K of the heat pipe located inside the electrical equipment section, and the other end is placed outside the electrical equipment part by penetrating the side wall of the electrical equipment part, and a cooling device using a heat sink is provided. By making the through holes in the box smaller, the watertightness of the electrical component can be improved, preventing water droplets and dust from entering from outside the electrical component, and eliminating the need for the heat sink, which serves as a heat sink, inside the electrical component. Since it can be installed outside the electrical equipment section, the box body can be designed to be smaller and more compact, which has great practical effects.
第1図は本発明による一実施例の空気調和様の冷却装置
を示す詳細断面図、第2図は同本発明の空気調和機の構
成断面図、第3図は従来のパワートランジスタ冷却装置
の部分構成を示す断面図である。
12′・・・・・・熱交換器室、14′・・・・・・圧
縮機室、16・・・・・・電装部、16・・・・・・箱
体、19・・・・・・パワートランジスタ、20・・・
・・・冷却装置、20 a・・・・・・放熱板、22・
・・・・・貫通穴、23・・・・・・金具、26・・・
・・・側壁、26・・・・・・ヒートパイプ、30・・
・・・・仕切板。
代理人の氏名 弁理士 中 尾 敏 男 ほか1名第1
図
2σ−−−じ−トバイアFIG. 1 is a detailed cross-sectional view showing an air conditioner-like cooling device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the configuration of an air conditioner according to the present invention, and FIG. FIG. 3 is a cross-sectional view showing a partial configuration. 12'... Heat exchanger room, 14'... Compressor room, 16... Electrical equipment section, 16... Box body, 19... ...Power transistor, 20...
... Cooling device, 20 a ... Heat sink, 22.
...Through hole, 23...Metal fitting, 26...
...Side wall, 26...Heat pipe, 30...
...Partition board. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 σ --- ditobaia
Claims (1)
前記仕切板上に電装部をもつ箱体を設け、前記箱体の側
壁にヒートパイプを前記熱交換器室と、前記電装部の箱
体とにわたって貫通した貫通穴を備え、前記ヒートパイ
プの一方の箱体側に金具を介してパワートランジスタ等
を装着し、他方を熱交換器室側にヒートシンクを形成す
る放熱板を装着した冷却装置を備えてなる空気調和機。A heat exchanger room and a compressor room are partitioned by a partition plate,
A box body having an electrical equipment section is provided on the partition plate, a through hole is provided in a side wall of the box body through which a heat pipe passes through the heat exchanger chamber and the box body of the electrical equipment part, and one side of the heat pipe is provided. An air conditioner comprising a cooling device in which a power transistor, etc. is mounted on the box side via metal fittings, and a heat sink forming a heat sink is mounted on the other side on the heat exchanger room side.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63033175A JPH01208626A (en) | 1988-02-16 | 1988-02-16 | Air conditioner |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63033175A JPH01208626A (en) | 1988-02-16 | 1988-02-16 | Air conditioner |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01208626A true JPH01208626A (en) | 1989-08-22 |
Family
ID=12379183
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63033175A Pending JPH01208626A (en) | 1988-02-16 | 1988-02-16 | Air conditioner |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01208626A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5412535A (en) * | 1993-08-24 | 1995-05-02 | Convex Computer Corporation | Apparatus and method for cooling electronic devices |
JP2005331141A (en) * | 2004-05-19 | 2005-12-02 | Mitsubishi Electric Corp | Cooling system, air conditioner, refrigeration air conditioning device, and cooling method |
EP2063192A1 (en) * | 2007-11-23 | 2009-05-27 | LG Electronics Inc. | Outdoor unit of air conditioner with air cooled passage in electrical equipment box and heat pipe |
WO2013121999A1 (en) * | 2012-02-14 | 2013-08-22 | 東芝キヤリア株式会社 | Electrical component cooling device and heat source machine of refrigeration cycle device provided with same |
JP2014053468A (en) * | 2012-09-07 | 2014-03-20 | Mitsubishi Heavy Ind Ltd | Insulated mounting structure of semiconductor device |
CN104712549A (en) * | 2015-01-22 | 2015-06-17 | 江苏大学 | Pump cover of hot water circulating pump cooled by heat pipes |
CN110785613A (en) * | 2017-08-09 | 2020-02-11 | 大金工业株式会社 | Outdoor unit of refrigerator |
US11493213B2 (en) | 2017-08-09 | 2022-11-08 | Daikin Industries, Ltd. | Outdoor unit for refrigeration apparatus |
-
1988
- 1988-02-16 JP JP63033175A patent/JPH01208626A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5412535A (en) * | 1993-08-24 | 1995-05-02 | Convex Computer Corporation | Apparatus and method for cooling electronic devices |
JP2005331141A (en) * | 2004-05-19 | 2005-12-02 | Mitsubishi Electric Corp | Cooling system, air conditioner, refrigeration air conditioning device, and cooling method |
EP2063192A1 (en) * | 2007-11-23 | 2009-05-27 | LG Electronics Inc. | Outdoor unit of air conditioner with air cooled passage in electrical equipment box and heat pipe |
WO2013121999A1 (en) * | 2012-02-14 | 2013-08-22 | 東芝キヤリア株式会社 | Electrical component cooling device and heat source machine of refrigeration cycle device provided with same |
EP2816591A4 (en) * | 2012-02-14 | 2016-01-20 | Toshiba Carrier Corp | ELECTRIC COOLING DEVICE AND REFRIGERATION CYCLE DEVICE HEAT SOURCE MACHINE EQUIPPED WITH SAME |
JP2014053468A (en) * | 2012-09-07 | 2014-03-20 | Mitsubishi Heavy Ind Ltd | Insulated mounting structure of semiconductor device |
CN104712549A (en) * | 2015-01-22 | 2015-06-17 | 江苏大学 | Pump cover of hot water circulating pump cooled by heat pipes |
CN110785613A (en) * | 2017-08-09 | 2020-02-11 | 大金工业株式会社 | Outdoor unit of refrigerator |
CN110785613B (en) * | 2017-08-09 | 2022-07-05 | 大金工业株式会社 | Chiller outdoor unit |
US11493213B2 (en) | 2017-08-09 | 2022-11-08 | Daikin Industries, Ltd. | Outdoor unit for refrigeration apparatus |
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