JPH01205593A - Automatic adjustment of soldering jet height - Google Patents

Abstract

PURPOSE:To enable accurate detection by converting the small change in height of a solder jet into the change in width of a solder coating applied to a transparent heat resistant plate. CONSTITUTION:Two transparent heat resistant plates 8 of glass material are fixed to a fixing section 4 of a carrier 4. A camera 5 observes the shape of a coating applied to the plate 8 by a soldering jet 1. A controlling section 6 receives signals from the camera 5, makes a variety of judgements from the shape, and carries out controlling and adjustment of a motor 32, oil pressure of a hydraulic cylinder 34, and a heater 33. Soldering jet 1 hits the heat resistant plate 8 at both edges of the carrier 4, the actual width of the solder coating is optically detected and measured, and is fed back to the controlling section 6. Rates of rotation of the motor 32 of a jet pump 31 and the oil pressure of the cylinder 34 attached to a base are always controlled as below to meet the preset conditions. Accurate detection can be thereby realized.

Description

[Detailed Description of the Invention] [(Already Required)] Regarding the method of automatically adjusting the height of solder jet G (J-DJ), regarding the method of automatically adjusting the height of solder jet G,
Accurately detect and measure the actual state of ITJ jet height and automatically adjust fluctuations!1! 〉1'-■1
When soldering to a printed wiring board using a jet, a transparent heat-resistant plate is used as a support for the printed wiring board, and the shape and size of the contact width are used to determine the jet height of the solder jet and the relationship between the solder jet and the printed wiring board. This is an automatic adjustment method that detects parallelism by replacement and adjusts the height and inclination of the solder jet.

(Industrial Field of Application) The present invention relates to the attachment of solder to a printed wiring board using a solder jet, and relates to a method for automatically adjusting the height of 1i (=j () jet), !L.

There are various methods for soldering to printed wiring boards, which minimize thermal shock to printed wiring boards and mounted components, and also have good removal of gaseous fluxes, reducing reliability. It is required that 1'-field exploration be performed, and the solder jet method is widely used.

In this solder jet method, the most important thing is to adjust the height of the jet in order to further reduce defects such as ``1''-field bridges (short circuits between wires) and solder clumps (unsoldered spots). It is a matter of concern.

[Conventional technology]

'L' - FIT jet b (L method was at the same height as the start of work, but the height was very low or unstable when working on a printed wiring board. The phenomenon of becoming

The causes of this are: (1) Prevention of oxidation in i' tank? 1) When combined with 1 and the printed wiring board Sora 2x or 7Y, it is attached to the 1' field jet nozzle and the jet height changes 2).

+2] i' 田 い=I し J and jI, in the tank ゛I ■A decreases and decreases by 7.

It is thought that this is the case when it is sent to the station. For this reason, the flat-rib is completed irregularly at -4, without G or I.

Therefore, it was a problem to constantly measure and adjust the actual jet height.

FIG. 3 shows an example of a conventional jet height fluctuation detection method. −
From the jet nozzle 21 installed in ゛1' tank one] I It is supported on one surface of the wiring board, and the height l-1 of the jet in the open submerged plate is set in the direction of the eldest of the jet nozzle 2, and the printed image jl'
A light emitter 71 that emits light and a light receiver 72 are installed on the surface of #Ji, 9, and its receiver 72, and measurements are taken. Maximum 0 (value -1,7 set "6 pieces, normal +1"l' 1.1
．． 'When the light is blocked, the [li, c omitted' sword] 1 (＼ Detected by 7 do, 14, the jet is strengthened and the U control is performed.
-C color.

[Invention or solution, 1. Problem 2] However, (■), in method 2, the rough height of the rf ITI jet is T-1.
The most important thing is that I can only judge the value.

(2) 21-fIl eruption b (ε height H or light - J, in the direction of 7 (ti revision, completion 1 partial fluctuation by 1, C1 minimum value l'l'j 4) I don't know.

(3) It is also necessary to manage the iJ highest value to a high degree, - for example, 0. It is necessary to keep it within the width of ε(~i, 51)m7
For this purpose, two kinds of light detection devices were installed (J), but accurate management was difficult.

There were some problems.

In view of this problem, the present invention accurately detects the actual state of the height of the '-1' field jet and automatically adjusts the fluctuation.
``1 = ζ/: ζ = 1.72.

[Means to solve the problem]

The above problem is caused by the fact that, as shown in the principle diagram of FIG. The height Hl of the solder jet 1 and the degree of descent with respect to the printed wiring board 9 are detected by substitution using the shape of the width W of the solder jet 1. The above problems are solved by the method of adjusting the jet height according to the present invention, which adjusts the height and inclination of the jet.

[For production]

First, by replacing minute changes in the height direction of the jet flow with differences in the width in the horizontal direction of the contact width made on the transparent heat-resistant plate, it will be possible to detect it more accurately, and the objective will be achieved.

In general, the solder jet 1 in a free state is at a height +( from the jet nostle 2 as shown in FIG. 1 fa), but when the printed wiring board 9 is soldered, the height is ( 1)) As in
It is crushed and hits flat along the 90th surface of the printed wiring board, width W
It spreads out in a band-like shape, and its edges are wavy.

The relationship between this jet height II and the impact W is shown in the same figure (()
) shows various conditions.

jII usual f ffl jet jet cylinder sa llo tl! Si
Or width W.

On the other hand, when jet stream);)S is (1(, 1, the hit width W1 is Wl > Wo, and when the jet height is high, the hit width W2ζ;lW2 >Wo.

If the solder jet 1 does not go downwards with respect to the surface of the printed wiring board 9, it will have a contact width shape or a trapezoidal shape, or if there is an abnormality in the jet height, it will have a large wavy shape. present.

Moreover, since the change field that appears in the contact width W is enlarged tq with respect to the change meter of the jet height [■], it is possible to detect fluctuations in 31 seconds.

In place of the printed wiring board 9, a transparent heat-resistant plate 8, such as a glass plate, etc. is used to maintain the relationship between the printed wiring board 9 and the printed wiring board 9.
By measuring the width and shape of the actual state of soldering, it is possible to easily detect fluctuations in the solder jet.This makes it possible to accurately adjust each part. becomes.

Calyx, half 1' [l 1) 7' effect 1. The height of J”I
1) Proposal of the horn method that automatically adjusts the solder jetting force and the height of the jet flow 2 nostle by magnifying the detection of the lower limit and slope and :'j [I 'J'J abnormality (1) Jl.

This makes it possible to improve the reliability by 1 layer.

〔Example〕

Embodiment a shown in FIG.
Explanation J-ru.

All figures/:i:ilI し し た - 涌join indicates the same object.

2nd 1 (・1) Q This is an embodiment of the present invention jet flow type half)
) (Side view of 3-position d-rigid, for the same figure) shows the same plan view.

As shown in Fig. 2, the device number of this embodiment is 1, a jet flow 2 is installed in a part, a jet flow pump 31 is driven inside the jet flow pump 32, and a heating pump 32 is installed. Adjust the height of the footrest 33 and the footrest height. It has a slight angle of elevation at speed and is conveyed once,
)・Nochen-like -l-l-aria with in force, -
1-Spear) Support the two transparent heat-resistant plates 8 made of glass by placing them on both sides of 11'.
-+- It is fixed to the fixed part of the rear 4, and furthermore, it can be made into this transparent heat-resistant plate 8. Camera 5 that observes the shape of the hit width of JL 1, and receives the signal of camera 5,
The control section 6 makes various decisions based on the shape and controls and adjusts the hydraulic pressure of the motor 32, the hydraulic cylinder 34, and the heater 33.

In order to maintain the soldering conditions of the jet solder tank 3 at an optimum state at all times, the solder jet 1 hits the transparent heat-resistant plate 8 installed on both sides of the middle rear 4, and the contact width shape is light!;
The rotation speed of the motor 32 of the jet pump 31 is adjusted to match the preset line 1 (by the control unit 6G), The oil pressure of the hydraulic cylinder 34 is always controlled as follows.

+1] fl of the solder jet 1 with the surface of the printing distribution kS board 9,
i'i control 1' Two hydraulic cylinders 34 are used as a footrest to support the entire tank 3, and the two optically detected contact widths WIJ2 are made equal. 1;), the oil pressure is controlled.

(2) Control of the height of penalty L1 of 2 do 0.1 town After the control in the above (1), the rotation speed of the motor 32 is adjusted so that the hit width (su0!-α) is set in advance. Control unit.

(By constantly controlling 2+, high quality solder is maintained at J-U'' and solder is -1L.
The number of man-hours required for reworking J was reduced by about half compared to the conventional example.

-1- Embodiment shows an example, in which transparent heat resistant (reverse 8 is set, I, and Similarly high quality can be maintained using measurement-controlled methods.

〔Effect of the invention〕

As mentioned above, the two lower limits of the height of the Toda jet and 1lr
It is possible to provide a method that magnifies and detects the i slope and local abnormalities and automatically adjusts the solder ejection force and slope to positive n'1↑, and the solder (=
It is possible to improve the quickness of J(, J) and reduce the number of man-hours required for subsequent rework, which has great effects.

[Brief explanation of the drawing]

Fig. 1 is a diagram of the principle of the present invention, and Fig. 2 is a diagram of the jet flow of the embodiment of the present invention (1j (, J
Apparatus FIG. 3 shows an example of a conventional jet height fluctuation detection method. In the figure, 1 is the solder jet, 2321 is the jet nozzle, 3 is the 1st cylinder, 4 is the middle rear, 5 is the camera, 6 is the control unit, 7 is the light beam, 8 (, I transparent surface J heat plate, 9 printed wiring board, 31 jet pump, 32 motor,
33 is a heater, 34 is a hydraulic cylinder, 7] is a light emitter, and 72 is a light receiver.

Claims (1)

[Claims] In soldering to a printed wiring board (9) using a solder jet (1), a transparent heat-resistant plate (8) is supported against the solder jet (1), and the shape and dimensions of the contact width W are used to solder the printed wiring board (9). Jet height H of solder jet (1)
, and the parallelism with the printed wiring board (9) is detected by substitution, and the height and inclination of the solder jet (1) are adjusted.