[go: up one dir, main page]

JPH01196858A - Transistor - Google Patents

Transistor

Info

Publication number
JPH01196858A
JPH01196858A JP2224388A JP2224388A JPH01196858A JP H01196858 A JPH01196858 A JP H01196858A JP 2224388 A JP2224388 A JP 2224388A JP 2224388 A JP2224388 A JP 2224388A JP H01196858 A JPH01196858 A JP H01196858A
Authority
JP
Japan
Prior art keywords
transistor
temperature
chip
junction
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2224388A
Other languages
Japanese (ja)
Inventor
Hiroto Suyama
巣山 廣登
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP2224388A priority Critical patent/JPH01196858A/en
Publication of JPH01196858A publication Critical patent/JPH01196858A/en
Pending legal-status Critical Current

Links

Landscapes

  • Semiconductor Integrated Circuits (AREA)

Abstract

PURPOSE:To detect the temperature of the junction section of a transistor accurately including transient thermal fluctuation by incorporating a diode for detecting a temperature into the same chip as the transistor. CONSTITUTION:A P-type base layer 2 into an N-type silicon substrate 1 and an N-type emitter layer 3 into the layer 2 are formed. A collector electrode 4 onto the underside of a chip, a base electrode 6 brought into contact with the base layer 2 into all opening section in an oxide film 5 on the top face of the chip and an emitter electrode 7 brought into contact with the emitter layer 3 are shaped. A P-type anode region 8 is formed adjacent to the base layer 2 in the chip, and a P-N junction is shaped between the anode region 8 and the substrate 1. Currents are made to flow between a terminal A and a terminal C, and the forward voltage of a diode 13 for detecting a temperature positioned between the terminals A and C is measured. Accordingly, the temperature of the junction section of a transistor is detected precisely including the case of transient thermal fluctuation.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、接合部温度の検出の容易なトランジスタに関
する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a transistor whose junction temperature can be easily detected.

〔従来の技術〕[Conventional technology]

半導体素子の電流定格は、通常接合部とケースとの間の
熱抵抗を知り、通電時の発生損失によって接合部が最高
許容温度に達しないようにすることにより決定される。
The current rating of a semiconductor device is usually determined by knowing the thermal resistance between the junction and the case, and by ensuring that the junction does not reach the maximum allowable temperature due to the loss that occurs during energization.

そのためには、接合部温度を検出する必要がある。ダイ
オード、サイリスク等においては接合部温度は順電圧の
温度特性を利用して検出することができる。トランジス
タにおいてはダイオードの順電圧に対応する特性とじて
ベース、エミッタ間電圧があるが、その温度特性はベー
ス回路の条件に影響されるため、接合部温度の検出に利
用されていない、そこで第2図、第3図に等価回路で示
すように、トランジスタ11のチップの近傍にサーミス
タ12を配置するか、ダイオード13を配置してトラン
ジスタ11の接合部温度を推定するのが一般的である。
For this purpose, it is necessary to detect the junction temperature. In diodes, silices, etc., the junction temperature can be detected using the temperature characteristics of forward voltage. In a transistor, there is a voltage between the base and emitter as a characteristic corresponding to the forward voltage of the diode, but since its temperature characteristic is affected by the conditions of the base circuit, it is not used to detect the junction temperature. As shown in the equivalent circuits of FIGS. 3 and 3, it is common to place a thermistor 12 or a diode 13 near the chip of the transistor 11 to estimate the junction temperature of the transistor 11.

〔発明が解決しようとする!I!題〕[Invention tries to solve! I! Title]

しかし、サーミスタ12あるいはダイオード13のよう
な温度検出センサの温度とトランジスタ11の接合部温
度との間には温度差があり、特に熱時定数の関係から過
渡的熱変動に対しては推定接合部温度に誤差が大きいと
いう欠点があった。
However, there is a temperature difference between the temperature of a temperature detection sensor such as the thermistor 12 or diode 13 and the junction temperature of the transistor 11, and in particular, due to the relationship between thermal time constants, the estimated junction temperature The drawback was that there was a large error in temperature.

本発明の課題は、接合部温度が過渡的熱変動の場合も含
めて正確に検出できるトランジスタを提供することにあ
る。
An object of the present invention is to provide a transistor that can accurately detect junction temperature even in the case of transient thermal fluctuations.

〔課題を解決するための手段〕[Means to solve the problem]

上記の01題の解決のために、本発明のトランジスタは
、一つのチップ内にトランジスタを形成する接合と別に
PN接合を有し、そのPN接合に順電流通電のための端
子を備えたものとする。
In order to solve the above problem 01, the transistor of the present invention has a PN junction separate from the junction forming the transistor in one chip, and the PN junction is provided with a terminal for passing forward current. do.

〔作用〕[Effect]

トランジスタのチップ内に別の形成されたPN接合によ
るダイオードの順電圧降下は、トランジスタの動作によ
り上昇したチップ温度により変化するため、このPN接
合に順電流を流して順電圧を測定することによりトラン
ジスタの接合部温度を検出することができる。
The forward voltage drop of the diode due to the PN junction formed separately in the transistor chip changes depending on the chip temperature that rises due to the operation of the transistor. The junction temperature can be detected.

〔実施例〕〔Example〕

第1図は本発明の一実施例のトランジスタチップを示し
、N型シリコン基板1にP型ベースN2が、さらにその
中にN型エミッタN3が形成され、基板1本来の部分が
コレクタとなる通常のパーティカルバイポーラトランジ
スタ構造である。チップの下面にコレクタ電14、上面
の酸化膜5の開口部に2層2と接触するベース電極6、
N層3と接触するエミッタ電極7が設けられ、それぞれ
コレクタ端子01ベース端子B、エミッタ端子Eが接続
されている。さらに、このトランジスタのチップには、
ベース層2に近接して同じくP型のアノード領域8が形
成され、N型基板1との間にPN接合を形成する。P暦
8は2層2と同一工程で形成できる。このPI3にはア
ノード電極9が接触しアノード端子Aに接続される。す
なわち、第4図の等価回路に示すように、ダイオード1
3がトランジスタ11と同一チップ10内に形成され、
コレクタ端子Cとアノード端子Aを有することになる。
FIG. 1 shows a transistor chip according to an embodiment of the present invention, in which a P-type base N2 is formed on an N-type silicon substrate 1, an N-type emitter N3 is formed therein, and the original part of the substrate 1 serves as a collector. This is a particle bipolar transistor structure. A collector electrode 14 on the bottom surface of the chip, a base electrode 6 in contact with the second layer 2 in the opening of the oxide film 5 on the top surface,
An emitter electrode 7 is provided in contact with the N layer 3, and is connected to a collector terminal 01, a base terminal B, and an emitter terminal E, respectively. Furthermore, this transistor chip has
A P-type anode region 8 is also formed adjacent to the base layer 2 and forms a PN junction with the N-type substrate 1. The P calendar 8 can be formed in the same process as the second layer 2. An anode electrode 9 contacts this PI3 and is connected to an anode terminal A. That is, as shown in the equivalent circuit of FIG.
3 is formed in the same chip 10 as the transistor 11,
It has a collector terminal C and an anode terminal A.

第1図のトランジスタの接合部温度は、端子Aと端子C
の間に電流を流し、その間に存在する温度検出用ダイオ
ード13の順電圧を測定することにより、アノード領域
Cとコレクタ領域1の間のPN接合の温度はトランジス
タの接合部温度にほぼ等しいことからその時点でのトラ
ンジスタの接合部温度を検出することができる。なおこ
の場合、ダイオードに流れる電流がチップの温度に影響
を与えないために、PH8の寸法が制限される。
The junction temperature of the transistor in Figure 1 is between terminal A and terminal C.
By passing a current between them and measuring the forward voltage of the temperature detection diode 13 existing between them, it is possible to determine that the temperature of the PN junction between the anode region C and the collector region 1 is approximately equal to the junction temperature of the transistor. The junction temperature of the transistor at that point can be detected. Note that in this case, the size of PH8 is limited because the current flowing through the diode does not affect the temperature of the chip.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、トランジスタと同一チップに温度検出
用ダイオードを工程を増加することなしに内蔵させるこ
とにより、トランジスタの接合部温度を過渡的熱変動の
場合を含めて正確に検出できる。またトランジスタと外
部の温度検出センサとを接続する必要がないので、装置
の小形化1部品数の減少、コストダウンを図ることがで
きる。
According to the present invention, by incorporating a temperature detection diode in the same chip as the transistor without increasing the number of steps, the junction temperature of the transistor can be accurately detected, even in the case of transient thermal fluctuations. Furthermore, since there is no need to connect the transistor to an external temperature detection sensor, it is possible to downsize the device, reduce the number of parts, and reduce costs.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例のトランジスタチップの断面
図、第2図、第3図はそれぞれ従来のトランジスタ接合
部温度検出方法の例を示す等価回路図、第4図は第1図
の実施例の等価回路図である。 1:コレクタ、2:ベース、3:エミッタ、8:第1図 第2図   第3図   第4図
FIG. 1 is a sectional view of a transistor chip according to an embodiment of the present invention, FIGS. 2 and 3 are equivalent circuit diagrams showing an example of a conventional transistor junction temperature detection method, and FIG. 4 is a cross-sectional view of a transistor chip according to an embodiment of the present invention. It is an equivalent circuit diagram of an example. 1: Collector, 2: Base, 3: Emitter, 8: Figure 1 Figure 2 Figure 3 Figure 4

Claims (1)

【特許請求の範囲】[Claims] 1)一つのチップ内にトランジスタを形成する接合と別
にPN接合を有し、該PN接合に順電流通電のための端
子を備えたことを特徴とするトランジスタ。
1) A transistor characterized in that it has a PN junction separate from the junction forming the transistor in one chip, and the PN junction is provided with a terminal for passing forward current.
JP2224388A 1988-02-02 1988-02-02 Transistor Pending JPH01196858A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2224388A JPH01196858A (en) 1988-02-02 1988-02-02 Transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2224388A JPH01196858A (en) 1988-02-02 1988-02-02 Transistor

Publications (1)

Publication Number Publication Date
JPH01196858A true JPH01196858A (en) 1989-08-08

Family

ID=12077354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2224388A Pending JPH01196858A (en) 1988-02-02 1988-02-02 Transistor

Country Status (1)

Country Link
JP (1) JPH01196858A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5869878A (en) * 1995-01-31 1999-02-09 Nec Corporation Semiconductor device with temperature detecting diode, method of forming the device and temperature detecting method using the device
US6504697B1 (en) 1997-02-10 2003-01-07 Daimlerchrysler Ag Arrangement and method for measuring a temperature
JP2009164559A (en) * 2007-12-14 2009-07-23 Sanken Electric Co Ltd Compound semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5869878A (en) * 1995-01-31 1999-02-09 Nec Corporation Semiconductor device with temperature detecting diode, method of forming the device and temperature detecting method using the device
US6504697B1 (en) 1997-02-10 2003-01-07 Daimlerchrysler Ag Arrangement and method for measuring a temperature
JP2009164559A (en) * 2007-12-14 2009-07-23 Sanken Electric Co Ltd Compound semiconductor device

Similar Documents

Publication Publication Date Title
US4903106A (en) Semiconductor power device integrated with temperature protection means
KR20010031207A (en) Power transistor device
US5736769A (en) Semiconductor apparatus
JPH10132871A (en) Semiconductor device
KR100272052B1 (en) Power transistor
JPH01196858A (en) Transistor
US7321138B2 (en) Planar diac
EP0488088B1 (en) Overheating detection circuit for detecting overheating of a power device
JP2005026279A (en) Semiconductor device
CN108109999A (en) Thermal-shutdown circuit, semiconductor devices and preparation method thereof
US5629551A (en) Semiconductor device comprising an over-temperature detection element for detecting excessive temperatures amplifiers
US8884383B2 (en) Semiconductor device and method of testing the same
JP3148781B2 (en) Semiconductor device
JP2002162303A (en) Pressure sensor
JPS60147154A (en) resistance structure
JP2550702B2 (en) Power semiconductor device
JPH0267767A (en) Semiconductor device and its circuit
JP2002289856A (en) On-chip temperature detecting device
JPH045864A (en) Semiconductor device
JP2001358344A (en) Pressure sensor
JP2973709B2 (en) Method for manufacturing semiconductor device
US5138418A (en) Transistor structure for testing emitter-base junction
JPH05299669A (en) Transistor with current detecting function
JPH0568658B2 (en)
KR19980020523A (en) Bipolar Transistors and Manufacturing Method Thereof