JPH01192196A - Potting method - Google Patents
Potting methodInfo
- Publication number
- JPH01192196A JPH01192196A JP1663788A JP1663788A JPH01192196A JP H01192196 A JPH01192196 A JP H01192196A JP 1663788 A JP1663788 A JP 1663788A JP 1663788 A JP1663788 A JP 1663788A JP H01192196 A JPH01192196 A JP H01192196A
- Authority
- JP
- Japan
- Prior art keywords
- board
- container
- insulating material
- holes
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 10
- 238000004382 potting Methods 0.000 title claims description 6
- 239000011810 insulating material Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims description 25
- 239000007788 liquid Substances 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 abstract description 9
- 229920000647 polyepoxide Polymers 0.000 abstract description 9
- 238000002347 injection Methods 0.000 abstract description 3
- 239000007924 injection Substances 0.000 abstract description 3
- 230000002411 adverse Effects 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 239000003570 air Substances 0.000 description 9
- 230000002542 deteriorative effect Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000012080 ambient air Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B28/00—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements
- C04B28/02—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing hydraulic cements other than calcium sulfates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2103/00—Function or property of ingredients for mortars, concrete or artificial stone
- C04B2103/0045—Polymers chosen for their physico-chemical characteristics
- C04B2103/0059—Graft (co-)polymers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2103/00—Function or property of ingredients for mortars, concrete or artificial stone
- C04B2103/0045—Polymers chosen for their physico-chemical characteristics
- C04B2103/0061—Block (co-)polymers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2103/00—Function or property of ingredients for mortars, concrete or artificial stone
- C04B2103/10—Accelerators; Activators
- C04B2103/14—Hardening accelerators
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
Abstract
Description
【発明の詳細な説明】 〔発明の目的〕 ′ （産業上の利用分野） 本発明は、ポツティング方法に関するものである。[Detailed description of the invention] [Object of the invention] (Industrial application field) The present invention relates to a potting method.
（従来の技術）
”電子部品が装着された基板を湿気による劣化を防ぐた
めに、この電子部品および基板をプラスチック材料で包
むという方策（ボッティング方法）が従来から採用され
ている。しかして、従来のポ・ ツテイング方法におい
ては、まず、電子部品が装着された基板を容器に収納し
、次いで、基板の外周部と容器の内周部との間に画成さ
れた開口部を介して、液状の絶縁材を容器内に注入して
いた。(Prior Art) ``In order to prevent the board on which electronic parts are mounted from deteriorating due to moisture, a method (botting method) has been adopted in which the electronic parts and the board are wrapped in plastic material. In the potting method, first, a board on which electronic components are mounted is placed in a container, and then a liquid is poured into the container through an opening defined between the outer periphery of the board and the inner periphery of the container. Insulating material was injected into the container.
そして、絶縁材が硬化した後、基板を容器から取り出し
ていた。After the insulating material has hardened, the substrate is removed from the container.
（発明が解決しようとする課題）
ところが、２かような方法においては、液状の絶縁材は
、基板の下面と容器の底面との間の空間に存在する空気
を包囲するような格好で容器内に注入されるので、この
空気は逃げ場がなかった。その結果、液状の絶縁材が容
器全体に行き渡るのに時間を要し、更に、絶縁材が硬化
した後、その空気は気泡として硬化した絶縁材内に残存
するという不具合があった。(Problem to be Solved by the Invention) However, in these two methods, the liquid insulating material is poured into the container in such a way as to surround the air existing in the space between the bottom surface of the substrate and the bottom surface of the container. This air had no escape. As a result, it takes time for the liquid insulating material to spread throughout the container, and furthermore, after the insulating material has hardened, the air remains in the hardened insulating material as bubbles.
ギれ故に、本発明は、基板の下面と容器の底面との間の
空間に存在する空気を、液状の絶縁材の容器内への注入
時に、排出することが出来るようにすることを；その技
術的課題とする。Therefore, the present invention aims to make it possible to exhaust the air existing in the space between the lower surface of the substrate and the bottom surface of the container when the liquid insulating material is injected into the container; Consider it a technical issue.
（課題を解決するための手段）
上記した技術的課題を解決するために本発明において講
じた技術的手段は、
（ａ）電子部品が装着され且つ穴が前記電子部品が占有
しない箇所に適宜穿設された基板を、上面開放の容器に
収納する第１工程：
（ｂ）前記基板の外周部と前記容器の内周部との間に画
成された開口部を介して、液状の絶縁材を前記容器内に
注入する第２工程：
および
（ｃ）前記絶縁材が硬化した後、前記基板を前記容器か
ら取り出す第３工程：
からなるポツティング方法
を構成したことである。(Means for Solving the Problems) The technical means taken in the present invention to solve the above-mentioned technical problems are as follows: (a) An electronic component is mounted and a hole is appropriately drilled in a location not occupied by the electronic component. A first step of storing the installed substrate in a container with an open top: (b) A liquid insulating material is placed through an opening defined between the outer circumference of the substrate and the inner circumference of the container. and (c) a third step of taking out the substrate from the container after the insulating material is cured.
（作用）
この構成においては、容器の底面と基板の下面との間に
存在する空気は、基板の外周部と容器の内周部との間に
画成された開口部を介して容器内に注入され続ける絶縁
材により、基板に穿設された穴を介して大気に押し出さ
れる。従って、この空気は、絶縁材の容器内への注入を
阻害したり、硬化した絶縁材内に残留したりするような
不具合はない。(Function) In this configuration, air existing between the bottom surface of the container and the lower surface of the substrate flows into the container through the opening defined between the outer periphery of the substrate and the inner periphery of the container. The insulating material continues to be injected and is forced out to the atmosphere through holes drilled in the substrate. Therefore, this air does not interfere with the injection of the insulating material into the container or remain in the cured insulating material.
（実施例）
以下、本発明の一実施例を添付図面により説明する。第
１図および第２図において、基板１０の上にはＩＣＩＩ
、セメント抵抗器１２、ＲＹリレー１３、ダイオード・
ブリッジ１４、ヒユーズ１５その他の電子部品が装着さ
れている。この基板１０の上に構成された回路１６は、
人体局部洗浄装置の制御回路として使用されるものであ
る。基板１０の上の回路１６は、湿気や外気により劣化
したり衝撃により損傷しないように、プラスチック材料
で包まれるようになっている。この手法がポツティング
である。(Example) Hereinafter, an example of the present invention will be described with reference to the accompanying drawings. In FIGS. 1 and 2, ICII is placed on the substrate 10.
, cement resistor 12, RY relay 13, diode
A bridge 14, a fuse 15 and other electronic parts are installed. The circuit 16 configured on this substrate 10 is
This is used as a control circuit for a human body private parts cleaning device. The circuitry 16 on the substrate 10 is encased in a plastic material to prevent it from deteriorating due to moisture or ambient air or being damaged by shock. This method is potting.
この基板１０の上の回路１６へのボッティングは、次の
ようにして行われる。即ち、まず、基板１０の上に電子
部品を装着して回路１６を構成する前（場合によっては
、回路１６の構成後）に、基板１０に、適数個の穴１７
が穿設される。この穴１７は、ＩＣ１１ｔｉどの電子部
品が占有していない箇所に穿設される。基板１０の強度
に影響が生じない限り、穴１７の個数や形状は任意に設
定出来る。Botting to the circuit 16 on the board 10 is performed as follows. That is, first, before configuring the circuit 16 by mounting electronic components on the board 10 (in some cases, after configuring the circuit 16), an appropriate number of holes 17 are formed in the board 10.
is drilled. This hole 17 is bored in a location not occupied by any electronic component of the IC 11ti. The number and shape of the holes 17 can be set arbitrarily as long as the strength of the substrate 10 is not affected.
かように形成された基板１０は、容器２０内に収容され
る。容器２０は、上面開放となっており、容器２０内に
基板ｌＯが収容されたとき、基板ｌＯの外周部１０ａと
容器２０の内周部２０ａとの間には、矩形のループ状の
開口部２１が形成されるようになっている。また、基板
１０は、容器２０内にて、容器２０の底面２０ｂに突設
された４本の支柱（図示路）に支持されており、基板１
０の下面１０ｃと容器２０の底面２０ｂとの間には、開
口部２１を介して大気に開放される内部空間２３が画成
される。The substrate 10 thus formed is housed in a container 20. The container 20 has an open top surface, and when the substrate 1O is housed in the container 20, a rectangular loop-shaped opening is formed between the outer circumferential portion 10a of the substrate 10 and the inner circumferential portion 20a of the container 20. 21 is formed. Further, the substrate 10 is supported within the container 20 by four pillars (shown in the figure) protruding from the bottom surface 20b of the container 20.
An internal space 23 that is open to the atmosphere through an opening 21 is defined between the lower surface 10c of the container 20 and the bottom surface 20b of the container 20.
いま、絶縁材としてエポキシ樹脂３０が、開口部２１を
介して内部空間２３に供給され続けると、絶縁材たるエ
ポキシ樹脂３０は、内部空間２３内に滞留していた空気
を、穴１７を介して、大気へ押し出す。かくして、基板
１０はエポキシ樹脂３０に浸される。エポキシ樹脂３０
の供給停止後、この状態を保ちながら、所定時間経過す
ると、硬化したエポキシ樹脂３０に包まれた基板ｌＯを
得ることが出来る。Now, if the epoxy resin 30 as an insulating material continues to be supplied to the internal space 23 through the opening 21, the epoxy resin 30 as an insulating material will remove the air stagnant in the internal space 23 through the hole 17. , pushing it out into the atmosphere. Thus, the substrate 10 is immersed in the epoxy resin 30. epoxy resin 30
After the supply of the epoxy resin 30 is stopped and a predetermined period of time has elapsed while maintaining this state, the substrate 1O wrapped in the hardened epoxy resin 30 can be obtained.
以上述べたように、本発明は、
（ａ）電子部品が装着され且つ穴が前記電子部品が占有
しない箇所に適宜穿設された基板を、上面開放の容器に
収納する第１工程：
（ｂ）前記基板の外周部と前記容器の内周部との間に画
成された開口部を介して、液状の絶縁材を前記容器内に
注入する第２工程：
および
（ｃ）前記絶縁材が硬化した後、前記基板を前記容器か
ら取り出す第３工程：
からなるボッティング方法
を構成したことである。As described above, the present invention provides the following steps: (a) A first step of storing a board on which electronic components are mounted and holes are appropriately formed in locations not occupied by the electronic components in a container with an open top surface; (b) ) a second step of injecting a liquid insulating material into the container through an opening defined between an outer periphery of the substrate and an inner periphery of the container; and (c) the insulating material is A third step of taking out the substrate from the container after curing is provided.
この構成においては、容器の底面と基板の下面との間に
存在する空気は、基板の外周部と容器の内周部との間に
画成された開口部を介して容器内に注入され続ける絶縁
材により、基板に穿設された穴を介して大気に押し出さ
れる。従って、この空気は、絶縁材の容器内への注入を
阻害したり、硬化した絶縁材内に残留したりするような
ことはない。In this configuration, air present between the bottom surface of the container and the lower surface of the substrate continues to be injected into the container through the opening defined between the outer periphery of the substrate and the inner periphery of the container. The insulation material pushes it out to the atmosphere through holes drilled in the substrate. Therefore, this air does not interfere with the injection of insulation into the container or remain in the cured insulation.
第１図は本発明に係るポツティング方法を実施する装置
の平面図および第２図は第１図の縦方向の断面を模式的
に示した図である。
ｌＯ：基板、１１：夏Ｃ（電子部品）、１７：穴、２０
：容器、
３０：エポキシ樹脂（絶縁材）。
第１ ■
掌２ｒｙ−FIG. 1 is a plan view of an apparatus for carrying out the potting method according to the present invention, and FIG. 2 is a diagram schematically showing a vertical cross section of FIG. lO: Board, 11: Summer C (electronic parts), 17: Hole, 20
: Container, 30: Epoxy resin (insulating material). 1st ■ Palm 2ry-
Claims (1)
しない箇所に適宜穿設された基板を、上面開放の容器に
収納する第１工程： （ｂ）前記基板の外周部と前記容器の内周部との間に画
成された開口部を介して、液状の絶縁材を前記容器内に
注入する第２工程： および （ｃ）前記絶縁材が硬化した後、前記基板を前記容器か
ら取り出す第３工程： からなるポツテイング方法。[Claims] (a) A first step of storing a board on which electronic components are mounted and holes are appropriately formed in locations not occupied by the electronic components in a container with an open top surface; a second step of injecting a liquid insulating material into the container through an opening defined between an outer periphery and an inner periphery of the container; and (c) after the insulating material has hardened; A potting method comprising: a third step of taking out the substrate from the container.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63016637A JP2658116B2 (en) | 1988-01-27 | 1988-01-27 | Potting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63016637A JP2658116B2 (en) | 1988-01-27 | 1988-01-27 | Potting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01192196A true JPH01192196A (en) | 1989-08-02 |
| JP2658116B2 JP2658116B2 (en) | 1997-09-30 |
Family
ID=11921875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63016637A Expired - Fee Related JP2658116B2 (en) | 1988-01-27 | 1988-01-27 | Potting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2658116B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100436120B1 (en) * | 2001-12-05 | 2004-06-14 | 유성권 | High speed hardening cement composition |
| JP2006064578A (en) * | 2004-08-27 | 2006-03-09 | Favess Co Ltd | Torque detecting device |
| JP2021057396A (en) * | 2019-09-27 | 2021-04-08 | Ｎｅｃエンベデッドプロダクツ株式会社 | Electronic apparatus |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6138973U (en) * | 1984-08-09 | 1986-03-11 | ナイルス部品株式会社 | hybrid integrated circuit |
| JPS6380879U (en) * | 1986-11-14 | 1988-05-27 |
-
1988
- 1988-01-27 JP JP63016637A patent/JP2658116B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6138973U (en) * | 1984-08-09 | 1986-03-11 | ナイルス部品株式会社 | hybrid integrated circuit |
| JPS6380879U (en) * | 1986-11-14 | 1988-05-27 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100436120B1 (en) * | 2001-12-05 | 2004-06-14 | 유성권 | High speed hardening cement composition |
| JP2006064578A (en) * | 2004-08-27 | 2006-03-09 | Favess Co Ltd | Torque detecting device |
| JP2021057396A (en) * | 2019-09-27 | 2021-04-08 | Ｎｅｃエンベデッドプロダクツ株式会社 | Electronic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2658116B2 (en) | 1997-09-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |