[go: up one dir, main page]

JPH0119082B2 - - Google Patents

Info

Publication number
JPH0119082B2
JPH0119082B2 JP56030137A JP3013781A JPH0119082B2 JP H0119082 B2 JPH0119082 B2 JP H0119082B2 JP 56030137 A JP56030137 A JP 56030137A JP 3013781 A JP3013781 A JP 3013781A JP H0119082 B2 JPH0119082 B2 JP H0119082B2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
pusher
side edge
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56030137A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57144408A (en
Inventor
Atsushi Mori
Shuji Matsuoka
Takashi Inui
Hiromitsu Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Uemera Kogyo Co Ltd
Original Assignee
Ibiden Co Ltd
Uemera Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd, Uemera Kogyo Co Ltd filed Critical Ibiden Co Ltd
Priority to JP3013781A priority Critical patent/JPS57144408A/ja
Publication of JPS57144408A publication Critical patent/JPS57144408A/ja
Publication of JPH0119082B2 publication Critical patent/JPH0119082B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • A Measuring Device Byusing Mechanical Method (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
JP3013781A 1981-03-02 1981-03-02 Size measuring system for printed substrate Granted JPS57144408A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3013781A JPS57144408A (en) 1981-03-02 1981-03-02 Size measuring system for printed substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3013781A JPS57144408A (en) 1981-03-02 1981-03-02 Size measuring system for printed substrate

Publications (2)

Publication Number Publication Date
JPS57144408A JPS57144408A (en) 1982-09-07
JPH0119082B2 true JPH0119082B2 (de) 1989-04-10

Family

ID=12295375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3013781A Granted JPS57144408A (en) 1981-03-02 1981-03-02 Size measuring system for printed substrate

Country Status (1)

Country Link
JP (1) JPS57144408A (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009057464A1 (de) 2009-12-03 2011-06-09 Hübel, Egon Verfahren und Vorrichtung zur Bestimmung der Oberfläche von plattenförmigem Gut in naßchemischen Durchlaufanlagen

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49133055A (de) * 1973-04-25 1974-12-20
JPS5121596A (en) * 1974-08-19 1976-02-20 Showa Denko Kk Ensogasuno seiseiho

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49133055A (de) * 1973-04-25 1974-12-20
JPS5121596A (en) * 1974-08-19 1976-02-20 Showa Denko Kk Ensogasuno seiseiho

Also Published As

Publication number Publication date
JPS57144408A (en) 1982-09-07

Similar Documents

Publication Publication Date Title
DK1952103T5 (en) Method of weighing with multiple weighing cells
JPH057253B2 (de)
JPH0119082B2 (de)
JP5117798B2 (ja) 傾斜反転式移送方法と装置
JP3717251B2 (ja) 板材の反り検査装置
JPS61225003A (ja) ベニヤ板を処理するための機械
JPH08165044A (ja) 方向変換搬送装置
JPH05221520A (ja) 物品供給コンベヤにおける物品位置決め方法及びその装置
CN217453141U (zh) 一种定位送料机构
KR102019694B1 (ko) 라벨 탐지 위치 조절 특성을 가진 라벨 피더
CN217764830U (zh) 一种物料厚度检测装置
CN113879810B (zh) 板件输送装置
KR100198854B1 (ko) 리드프레임의 검출장치
JP4220041B2 (ja) 基板搬送装置
RU2003611C1 (ru) Способ разгрузки штабел лесоматериалов и устройство дл его осуществлени
JP2003168891A (ja) プリント基板等の外観検査装置における基板等の搬送装置
JPH0618236Y2 (ja) タイル素地群用載置板の位置決め装置
JP2515644B2 (ja) シ―ト搬送装置
JP2673341B2 (ja) 単板切断機における厚み検知器の設定装置
CN117733929A (zh) 一种石膏板封边带高精度自动侧切系统
JPH0124047Y2 (de)
JPH11197895A (ja) プレス装置におけるキャリアプレートの管理装置および管理方法
JP2595190Y2 (ja) チップ状部品検出装置
JPH02310249A (ja) 自動積載装置
JPH04279810A (ja) 反り測定装置