JPH01190458A - Ink-jet head - Google Patents
Ink-jet headInfo
- Publication number
- JPH01190458A JPH01190458A JP1510988A JP1510988A JPH01190458A JP H01190458 A JPH01190458 A JP H01190458A JP 1510988 A JP1510988 A JP 1510988A JP 1510988 A JP1510988 A JP 1510988A JP H01190458 A JPH01190458 A JP H01190458A
- Authority
- JP
- Japan
- Prior art keywords
- slit nozzle
- ink
- substrate
- nozzle plate
- heat generating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims description 15
- 239000010410 layer Substances 0.000 abstract description 18
- 239000011521 glass Substances 0.000 abstract description 5
- 239000012141 concentrate Substances 0.000 abstract description 3
- 239000011241 protective layer Substances 0.000 abstract description 3
- 239000012530 fluid Substances 0.000 abstract description 2
- 238000007639 printing Methods 0.000 abstract description 2
- 230000002093 peripheral effect Effects 0.000 abstract 2
- 239000007788 liquid Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- -1 borides Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000006089 photosensitive glass Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
【発明の詳細な説明】 (産業上の利用分野) 本発明は、インクジェットヘッドに関するものである。[Detailed description of the invention] (Industrial application field) The present invention relates to an inkjet head.
(従来の技術)
従来インクジェット記録の一方式として、スリット状の
吐出口を形成した吐出口基板を用いたインクジェット記
録装置(特開昭62−50150号公報)がある。この
インクジェットヘッドの上面図および断面図を第2図(
a)、(b)に示す。(Prior Art) As one of the conventional inkjet recording methods, there is an inkjet recording apparatus (Japanese Patent Application Laid-Open No. 62-50150) that uses an ejection port substrate in which slit-shaped ejection ports are formed. A top view and a cross-sectional view of this inkjet head are shown in Figure 2 (
Shown in a) and (b).
第2図(a)、(b)に示すインクジェットヘッドでは
、発熱体307を選択通電する事により発熱体に近接す
る記録液311が加熱され気化し蒸気316となり、こ
の状態変化により生じた圧力の上昇により吐出口より記
録液が柱状に伸び始める。蒸気316は、体積膨張およ
び熱伝導により冷却され収縮、消滅し、記録液は吐出口
から切り離され、記録液小滴となって噴出する。In the inkjet head shown in FIGS. 2(a) and 2(b), by selectively energizing the heating element 307, the recording liquid 311 in the vicinity of the heating element is heated and vaporized into vapor 316, and the pressure generated by this state change is reduced. Due to the rise, the recording liquid starts to extend from the ejection port into a columnar shape. The vapor 316 is cooled, contracts, and disappears due to volumetric expansion and thermal conduction, and the recording liquid is separated from the ejection port and ejected as recording liquid droplets.
(発明が解決しようとする問題点)
しかしながら従来技術におけるスリット状の吐出口を備
えたインクジェットヘッドでは、蒸気によって発生した
圧力がほぼ等方向に伝達するため、記録液の流動は分散
し吐出口方向に集中しない。本発明の目的は、上記の問
題点を解決し、インク滴噴出のための圧力エネルギーを
吐出口方向に集中させ、効率良くインク噴出を行うイン
クジェットヘッドを提供することにある。(Problem to be Solved by the Invention) However, in the conventional inkjet head equipped with a slit-shaped ejection port, the pressure generated by steam is transmitted in almost the same direction, so the flow of recording liquid is dispersed in the direction of the ejection port. don't concentrate on SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and provide an inkjet head that concentrates pressure energy for ejecting ink droplets in the direction of the ejection port and ejects ink efficiently.
(問題点を解決するための手段)
本発明におけるインクジェットヘッドは、表面に細長い
凸部をもった基板と、前記凸部上面に設けた発熱体アレ
イと、この発熱体アレイと対向した位置にスリットノズ
ル孔を備え、前記基板との間に記録インクを保持すべく
設けられたスリットノズル板とからなるインクジェット
ヘッドにおいて、前記凸部の高さhlが前記基板の凸部
以外の上面からスリットノズル板下端までの距離h3以
上としたことを特徴とするインクジェットヘッドである
。(Means for Solving the Problems) The inkjet head of the present invention includes a substrate having an elongated convex portion on its surface, a heating element array provided on the upper surface of the convex portion, and a slit at a position facing the heating element array. In an inkjet head comprising a slit nozzle plate provided with nozzle holes and provided to hold recording ink between the substrate and the substrate, the height hl of the convex portion is greater than the height hl of the slit nozzle plate from the upper surface other than the convex portion of the substrate. The inkjet head is characterized in that the distance to the lower end is h3 or more.
(作用)
本発明において、基板上には凸部が設けられて、おり、
凸部上面には発熱体アレイが形成されている。凸部の高
さは、凸部周辺部からスリットノズル板下端までのギャ
ップ以上である。すると発熱体アレイはスリットノズル
孔の内部に位置するようになる。(Function) In the present invention, a convex portion is provided on the substrate, and
A heating element array is formed on the upper surface of the convex portion. The height of the convex portion is greater than or equal to the gap from the periphery of the convex portion to the lower end of the slit nozzle plate. The heating element array is then positioned inside the slit nozzle hole.
この状態で、蒸気バブルを前記抵抗体アレイ上に発生さ
せた場合、圧力波の大半は、直接あるいは、さらにスリ
ットノズル孔側面における反射等によりインク噴出方向
に向かうため、記録インクの流動を前記スリットノズル
孔方向に集中させることができる。そのため、蒸気バブ
ルの体積変動による圧力エネルギーを効率的にインク噴
出に用いることができる。In this state, when vapor bubbles are generated on the resistor array, most of the pressure waves are directed toward the ink ejection direction either directly or by reflection on the side surface of the slit nozzle hole, so that the flow of recording ink is directed toward the ink jetting direction. It can be concentrated in the direction of the nozzle hole. Therefore, the pressure energy caused by the volume change of the vapor bubble can be efficiently used for ejecting ink.
(実施例)
次に本発明の実施例について、図面を参照して詳細に説
明する。(Example) Next, an example of the present invention will be described in detail with reference to the drawings.
第1図は本発明の一実施例の構造及び動作を示す断面図
である。本実施例は、ガラス層126上にグレーズ層1
27を凸状に設け、該グレーズ層の表面上に並べた発熱
体アレイ114と、該発熱体アレイ及び電極112を保
護するための保護層110とからなる基板130と、上
記発熱体アレイ114と対向する位置にスリットノズル
孔120が形成されたスリットノズル板106よりなる
。記録インク108は、スリットノズル板106と基板
130との間に保持されており、スリットノズル孔12
0にはメニスカスが形成されている。スリットノズル孔
の切り角θ、と、グレーズ層127の底角θ2とは、お
おむね等しくすることが望ましい。すると、基板130
の凸部の一部は、スリットノズル板の中にインク流路幅
をほぼ一定として入り込んだ形にすることができ、イン
ク流路の液体抵抗が局部的に大きくならないため、イン
ク滴噴出後のインクの供給を高速かつスムーズに行える
。FIG. 1 is a sectional view showing the structure and operation of an embodiment of the present invention. In this embodiment, a glaze layer 1 is placed on the glass layer 126.
a substrate 130 comprising a heating element array 114 arranged in a convex manner on the surface of the glaze layer; a protective layer 110 for protecting the heating element array and the electrodes 112; It consists of a slit nozzle plate 106 with slit nozzle holes 120 formed at opposing positions. The recording ink 108 is held between the slit nozzle plate 106 and the substrate 130, and the recording ink 108 is held between the slit nozzle plate 106 and the substrate 130.
A meniscus is formed at 0. It is desirable that the cutting angle θ of the slit nozzle hole and the base angle θ2 of the glaze layer 127 be approximately equal. Then, the substrate 130
A part of the convex part can be made to fit into the slit nozzle plate with an approximately constant width of the ink flow path, so that the liquid resistance of the ink flow path does not increase locally, so that the ink droplet is Ink can be supplied quickly and smoothly.
また、基板130上の凸部周辺部とスリットノズル板1
06下端とのギャップh3は、グレーズ層127の厚さ
hlにより任意に大きく設定することができる。In addition, the periphery of the convex portion on the substrate 130 and the slit nozzle plate 1
The gap h3 with the lower end of the glaze layer 127 can be set arbitrarily large depending on the thickness hl of the glaze layer 127.
h3を大きくすると記録インク108のスリットノズル
孔方向への流体抵抗が小さくなり、インク滴噴出後に発
熱体アレイ114表面上へ記録インク108を供給する
速度を大きくすることができ、より高い繰り返し周期で
ヘッドを駆動することが可能となり、印字速度が向上す
る。本実施例ではh3を数10pm〜1100p程度と
した。When h3 is increased, the fluid resistance of the recording ink 108 toward the slit nozzle hole becomes smaller, and the speed at which the recording ink 108 is supplied onto the surface of the heating element array 114 after ejecting the ink droplets can be increased, and the repetition rate can be increased. It becomes possible to drive the head, improving printing speed. In this example, h3 was set to about several tens of pm to about 1100 p.
発熱体アレイ114からスリットノズル板先端までの距
離は、インク噴出に適する値h4(例えば50pm〜1
0100pに設定することが望ましく本実施例では、数
10pmとした。スリットノズル板の厚さh2は、h4
以上の任意の値とすることができる。h2を大きくする
程、スリットノズル板は、外力や蒸気バブルによる圧力
に対して抵抗力のあるものになるが、グレーズ層127
とスリットノズル板との重なりh2−h4は、あまり大
きくしない方が、インク滴噴出後のインクの供給速度が
大きくなり繰り返し周期を向上させることができる。従
って、本実施例では−をh4+数10pmとした。The distance from the heating element array 114 to the tip of the slit nozzle plate is set to a value h4 suitable for ejecting ink (for example, 50 pm to 1
It is desirable to set it to 0100p, and in this example, it is set to several tens of pm. The thickness h2 of the slit nozzle plate is h4
It can be any value above. As h2 increases, the slit nozzle plate becomes more resistant to external forces and pressure caused by steam bubbles, but the glaze layer 127
If the overlap h2-h4 between the ink droplet and the slit nozzle plate is not too large, the ink supply speed after ejecting ink droplets will increase, and the repetition cycle can be improved. Therefore, in this embodiment, - is set to h4+several tens of pm.
また、スリットノズル孔120の上端の幅W□は数10
pmとした。以上のように、h2、h3、h4、Wl等
を設定した結果、〜10kHzの高い繰り返し周期で良
好なインク滴噴出を行うことができた。Further, the width W□ of the upper end of the slit nozzle hole 120 is several tens of
It was set as pm. As described above, as a result of setting h2, h3, h4, Wl, etc., it was possible to eject good ink droplets at a high repetition rate of ~10 kHz.
なお、本実施例では、スリットノズル板には、シリコン
基板等を用い、KOH等のエツチング液で異方性エツチ
ングをほどこすことにより、スリットノズル孔を形成し
た。発熱体アレイ114は、基板130上のグレーズ層
127の表面に、蒸着法もしくは、スパッタ法等により
形成している。発熱体材料としては、Ti、 Mo、W
、 Ta等の硅化物、炭化物、硼化物、窒化物等を用い
た。ガラス層126、及びグレーズ層にはセラミックス
あるいは、ガラス等を用いた。またグレーズ層127は
、一般に知られた厚膜技術や感光性樹脂または、感光性
ガラスを用いたフォトリソ技術により形成した。グレー
ズ層127の底角θ2は電極112の断線のないスパッ
タ膜及び蒸着膜が形成可能な角度とした。In this example, a silicon substrate or the like was used for the slit nozzle plate, and slit nozzle holes were formed by anisotropic etching with an etching solution such as KOH. The heating element array 114 is formed on the surface of the glaze layer 127 on the substrate 130 by a vapor deposition method, a sputtering method, or the like. As heating element materials, Ti, Mo, W
, Ta, and other silicides, carbides, borides, nitrides, etc. were used. Ceramics, glass, etc. were used for the glass layer 126 and the glaze layer. Further, the glaze layer 127 was formed by a generally known thick film technique, a photolithography technique using a photosensitive resin, or a photosensitive glass. The base angle θ2 of the glaze layer 127 was set to an angle at which a sputtered film and a vapor deposited film without disconnection of the electrode 112 could be formed.
(発明の効果)
以上詳述したように、本発明によるインクジェットヘッ
ドは、基板に凸部を設け、凸部の高さを凸部周辺部から
スリットノズル板下端までの距離以上とすることにより
蒸気バブルによる圧力エネルギーをインク滴噴出方向に
集中でき、効率良く、インク滴噴出を行うとともにイン
ク噴出後のスリットノズル部へのインクの供給を高速化
し、より高い繰返し周波数でのインク滴噴出を可能とし
た。さらに、外力や蒸気バブルによる圧力に対して抵抗
力のある厚さのスリットノズル板を備えたインクジェッ
トヘッドを可能とした。(Effects of the Invention) As described in detail above, the inkjet head according to the present invention provides a convex portion on the substrate and makes the height of the convex portion equal to or greater than the distance from the periphery of the convex portion to the bottom end of the slit nozzle plate. The pressure energy generated by the bubbles can be concentrated in the direction of ink droplet ejection, allowing for efficient ink droplet ejection, as well as speeding up the supply of ink to the slit nozzle after ink ejection, making it possible to eject ink droplets at a higher repetition rate. did. Furthermore, it has become possible to create an inkjet head equipped with a slit nozzle plate that is thick enough to resist external forces and pressure caused by steam bubbles.
第1図は本発明の第1の実施例の構成及び動作を示す断
面図、第2図は、従来例の断面図である。
なお図において、
130・・・基板 126・・・ガラス層
127・・・グレーズ層 112・・・電極11
4・・・発熱体アレイ 110・・・保護層108
・・・記録インク 104・・・蒸気バブル10
6・・・スリットノズル板FIG. 1 is a sectional view showing the structure and operation of a first embodiment of the present invention, and FIG. 2 is a sectional view of a conventional example. In the figure, 130...Substrate 126...Glass layer 127...Glaze layer 112...Electrode 11
4... Heating element array 110... Protective layer 108
... Recording ink 104 ... Steam bubble 10
6...Slit nozzle plate
Claims (1)
た発熱体アレイと、この発熱体アレイと対向した位置に
スリットノズル孔を備え、前記基板との間に記録インク
を保持すべく設けられたスリットノズル板とからなるイ
ンクジェットヘッドにおいて前記凸部の高さh_1が前
記基板の凸部以外の上面からスリットノズル板下端まで
の距離h_3以上としたことを特徴とするインクジェッ
トヘッド。A substrate having an elongated convex portion on its surface, a heating element array provided on the upper surface of the convex portion, and a slit nozzle hole at a position facing the heating element array, and in order to hold recording ink between the substrate and the substrate. An inkjet head comprising a slit nozzle plate provided therein, wherein the height h_1 of the convex portion is greater than or equal to the distance h_3 from the upper surface of the substrate other than the convex portion to the lower end of the slit nozzle plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1510988A JPH01190458A (en) | 1988-01-25 | 1988-01-25 | Ink-jet head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1510988A JPH01190458A (en) | 1988-01-25 | 1988-01-25 | Ink-jet head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01190458A true JPH01190458A (en) | 1989-07-31 |
Family
ID=11879666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1510988A Pending JPH01190458A (en) | 1988-01-25 | 1988-01-25 | Ink-jet head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01190458A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6000787A (en) * | 1996-02-07 | 1999-12-14 | Hewlett-Packard Company | Solid state ink jet print head |
KR20000001904A (en) * | 1998-06-15 | 2000-01-15 | 윤종용 | Integral bubble ink jet printer head and manufacturing method thereof |
US6019457A (en) * | 1991-01-30 | 2000-02-01 | Canon Information Systems Research Australia Pty Ltd. | Ink jet print device and print head or print apparatus using the same |
US6305790B1 (en) | 1996-02-07 | 2001-10-23 | Hewlett-Packard Company | Fully integrated thermal inkjet printhead having multiple ink feed holes per nozzle |
US6336714B1 (en) | 1996-02-07 | 2002-01-08 | Hewlett-Packard Company | Fully integrated thermal inkjet printhead having thin film layer shelf |
JP2002248171A (en) * | 2001-01-16 | 2002-09-03 | Hewlett Packard Co <Hp> | Thermal formation of drop of aerosole |
US6499832B2 (en) | 2000-04-26 | 2002-12-31 | Samsung Electronics Co., Ltd. | Bubble-jet type ink-jet printhead capable of preventing a backflow of ink |
US6533399B2 (en) | 2000-07-18 | 2003-03-18 | Samsung Electronics Co., Ltd. | Bubble-jet type ink-jet printhead and manufacturing method thereof |
US6543884B1 (en) | 1996-02-07 | 2003-04-08 | Hewlett-Packard Company | Fully integrated thermal inkjet printhead having etched back PSG layer |
-
1988
- 1988-01-25 JP JP1510988A patent/JPH01190458A/en active Pending
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6019457A (en) * | 1991-01-30 | 2000-02-01 | Canon Information Systems Research Australia Pty Ltd. | Ink jet print device and print head or print apparatus using the same |
US6000787A (en) * | 1996-02-07 | 1999-12-14 | Hewlett-Packard Company | Solid state ink jet print head |
US6305790B1 (en) | 1996-02-07 | 2001-10-23 | Hewlett-Packard Company | Fully integrated thermal inkjet printhead having multiple ink feed holes per nozzle |
US6336714B1 (en) | 1996-02-07 | 2002-01-08 | Hewlett-Packard Company | Fully integrated thermal inkjet printhead having thin film layer shelf |
US6402972B1 (en) | 1996-02-07 | 2002-06-11 | Hewlett-Packard Company | Solid state ink jet print head and method of manufacture |
US6543884B1 (en) | 1996-02-07 | 2003-04-08 | Hewlett-Packard Company | Fully integrated thermal inkjet printhead having etched back PSG layer |
KR20000001904A (en) * | 1998-06-15 | 2000-01-15 | 윤종용 | Integral bubble ink jet printer head and manufacturing method thereof |
US6499832B2 (en) | 2000-04-26 | 2002-12-31 | Samsung Electronics Co., Ltd. | Bubble-jet type ink-jet printhead capable of preventing a backflow of ink |
US6685846B2 (en) | 2000-04-26 | 2004-02-03 | Samsung Electronics Co., Ltd. | Bubble-jet type ink-jet printhead, manufacturing method thereof, and ink ejection method |
US6533399B2 (en) | 2000-07-18 | 2003-03-18 | Samsung Electronics Co., Ltd. | Bubble-jet type ink-jet printhead and manufacturing method thereof |
US6749762B2 (en) | 2000-07-18 | 2004-06-15 | Samsung Electronics Co., Ltd. | Bubble-jet type ink-jet printhead and manufacturing method thereof |
JP2002248171A (en) * | 2001-01-16 | 2002-09-03 | Hewlett Packard Co <Hp> | Thermal formation of drop of aerosole |
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