JPH01186700A - Printed wiring board structure - Google Patents
Printed wiring board structureInfo
- Publication number
- JPH01186700A JPH01186700A JP491088A JP491088A JPH01186700A JP H01186700 A JPH01186700 A JP H01186700A JP 491088 A JP491088 A JP 491088A JP 491088 A JP491088 A JP 491088A JP H01186700 A JPH01186700 A JP H01186700A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- semiconductor integrated
- metal plate
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 15
- 239000004519 grease Substances 0.000 claims abstract description 9
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 230000000191 radiation effect Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 241000190020 Zelkova serrata Species 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、各種電子機器に利用されるプリント配線板構
造体に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a printed wiring board structure used in various electronic devices.
（従来の技術）
近年、プリント配線板構造体は、電子機器の小形化や高
機能化に伴って、これら電子機器の回路をいかに高密度
化していくかが重要な課題となってきている。(Prior Art) In recent years, as electronic devices become smaller and more functional, it has become an important issue to increase the density of circuits in printed wiring board structures.
このような中で、対象とする電子回路をいくつかの機能
回路に分割し、それぞれの機能回路を構成する回路素子
を集積化することによって回路ブロック体を形成し１．
この回路ブロック体をマザープリント配線板に実装して
電子回路を構成する方法が、多くの電子機器に採用され
ている。Under these circumstances, a circuit block body is formed by dividing the target electronic circuit into several functional circuits and integrating the circuit elements that constitute each functional circuit.1.
This method of mounting this circuit block body on a mother printed wiring board to configure an electronic circuit is adopted in many electronic devices.
また、ディジタル回路を回路ブロック体の対象とした場
合のように、半導体集積回路より発生する熱が、素子自
体で発散しきれない場合は、放熱板を設ける必要がある
。Further, when the heat generated by the semiconductor integrated circuit cannot be completely dissipated by the element itself, such as when a digital circuit is used as a circuit block, a heat sink needs to be provided.
従来のこの種のプリント配線板構造体について、第３図
に′より説明する。同図は、従来のプリント配線板構造
体の側面断面図で、プリント配線板１の表面に電子部品
２および半導体集積回路３が実装されている。上記の半
導体集積回路３は、発生する熱を発散するため、その上
面に放熱板４が密着して取り付けられている。A conventional printed wiring board structure of this type will be explained with reference to '' in FIG. This figure is a side sectional view of a conventional printed wiring board structure, in which electronic components 2 and semiconductor integrated circuits 3 are mounted on the surface of a printed wiring board 1. In order to dissipate the heat generated, the semiconductor integrated circuit 3 described above has a heat dissipation plate 4 closely attached to its upper surface.
（発明が解決しようとする問題点）
しかしながら、上記の構成では、放熱板４により放熱効
果は得られるが、厚さが増加し、マザープリント配線板
に実装したとき、広いスペースを必要とし、小形化が難
しいという問題があった。(Problems to be Solved by the Invention) However, in the above configuration, although the heat dissipation effect can be obtained by the heat dissipation plate 4, the thickness increases, and when mounted on a mother printed wiring board, a large space is required, and the size is small. The problem was that it was difficult to convert.
本発明は上記の問題点を解決するもので、放熱効果が高
く、しかも小形化できるプリント配線板構造体を提供す
るものである。The present invention solves the above problems and provides a printed wiring board structure that has a high heat dissipation effect and can be made smaller.
（問題点を解決するための手段）
上記の問題点を解決するため１本発明のプリント配線板
構造体は、半導体集積回路の外形に見合う寸法の貫通孔
を所定の位置に設け、さらにその裏面に、金属板を密着
接合したプリント配線板の上記貫通孔の中に半導体集積
回路を配置し、そのパッケージ部を熱伝導体グリースを
介して金属板に接触させたものである。(Means for Solving the Problems) In order to solve the above-mentioned problems, the printed wiring board structure of the present invention has a through hole at a predetermined position having a size that matches the external shape of a semiconductor integrated circuit, and A semiconductor integrated circuit is disposed in the through hole of a printed wiring board to which a metal plate is closely bonded, and its package portion is brought into contact with the metal plate via thermal conductive grease.
（作 用）
上記の構成により、半導体集積回路より発生する熱は、
熱伝導グリースを介して金属板に伝達され、効率よく発
散される。また、放熱板がなく。(Function) With the above configuration, the heat generated by the semiconductor integrated circuit is
The heat is transferred to the metal plate via the thermal conductive grease and dissipated efficiently. Also, there is no heat sink.
プリント配線板構造体全体の厚さが薄くなるので。Because the thickness of the entire printed wiring board structure becomes thinner.
マザープリント配線板に実装するスペースが少なくてす
み、高密度実装が可能となる。It requires less mounting space on the mother printed wiring board, allowing high-density mounting.
（実施例）
本発明の一実施例を第１図および第２図により説明する
。(Example) An example of the present invention will be described with reference to FIGS. 1 and 2.
第１図および第２図は、本発明によるプリント配線板構
造体の断面図および平面図である。1 and 2 are a sectional view and a plan view of a printed wiring board structure according to the present invention.
第１図において、所定の位置に半導体集積回路３の外形
寸法に見合った貫通孔１ａが設けられたプリント配線板
１は、その裏面に、接着剤５により金属板６が密着接合
されている。In FIG. 1, a printed wiring board 1 has a through hole 1a provided at a predetermined position corresponding to the external dimensions of a semiconductor integrated circuit 3, and a metal plate 6 is closely bonded to the back surface of the printed wiring board 1 with an adhesive 5.
半導体集積■路３は、プリント配線板１の貫通孔１ａの
中に落とす格好で実装され、そのパッケージ部が、熱伝
導体グリース７を介して金属・板６に接触している。The semiconductor integrated path 3 is mounted by being dropped into the through hole 1a of the printed wiring board 1, and its package portion is in contact with the metal plate 6 via the thermal conductive grease 7.
また、上記のプリント配線板１の表面には、複数個の電
子部品２が装着されている。Furthermore, a plurality of electronic components 2 are mounted on the surface of the printed wiring board 1 described above.
（発明の効果）
以上説明したように１本発明によれば、半導体集積回路
の熱は熱伝導グリースにより金属板に伝達放散されるた
め、効率の良い放熱効果が得られ、しかも厚さが薄く抑
えられるため、高密度実装が可能となる。また、金属板
はプリント配線板上に形成された機能回路の接地端子と
接続することによりシールド効果が得られるため、これ
らのプリント配線板構造体を相互に近接して総置できる
ので、さらに高密度実装が可能となる。(Effects of the Invention) As explained above, according to the present invention, the heat of the semiconductor integrated circuit is transferred and radiated to the metal plate by the thermally conductive grease, so an efficient heat radiation effect can be obtained, and the thickness is thin. This enables high-density packaging. In addition, since the metal plate provides a shielding effect by connecting it to the ground terminal of the functional circuit formed on the printed wiring board, these printed wiring board structures can be placed close to each other, resulting in even higher performance. Density mounting becomes possible.
第１図および第２図はそれぞれ本発明によるプリント配
線板構造体の断面図および平面図、第３薗は従来のプリ
ント配線板構造体の断面図である。
１・・・プリント配線板、 １ａ・・・貫通孔、２・・
・電子部品、 ３・・・半導体集積回路、４・・・放熱
板、 ５・・・接着剤、 ６・・・金属板。
７・・・熱伝導グリース。
特許出願人 松下電器産業株式会社
第１図
第２図
１ プ、１ルトｆＬ嶽檄 ｌａ ・貫通孔
２−・電２Ｉ仲山 ３千県（キ象慣Ｕ路５・路廟ｔ］
６＆為檄
７ たべａ欅り゛リース1 and 2 are a sectional view and a plan view, respectively, of a printed wiring board structure according to the present invention, and the third column is a sectional view of a conventional printed wiring board structure. 1... Printed wiring board, 1a... Through hole, 2...
- Electronic components, 3... Semiconductor integrated circuit, 4... Heat sink, 5... Adhesive, 6... Metal plate. 7...Thermal conductive grease. Patent Applicant: Matsushita Electric Industrial Co., Ltd. Figure 1 Figure 2 Figure 1 Pu, 1 Ruto f L Takehiro la ・Through hole 2-・Electric 2I Zhongshan 3,000 prefectures (Ki Xiangmu U Road 5, Road Temple t)
6 & Tame 7 Tabe A Keyaki Lease
Claims (1)
体集積回路を装着してなるプリント配線板構造体におい
て、上記のプリント配線板に、上記の半導体集積回路の
外形に見合う貫通孔を設け、且つ上記のプリント配線板
の裏面に金属板を密着接合した後、上記の貫通孔の中に
、上記の半導体集積回路を落とし込むように装着し、さ
らに、上記貫通孔の底部に塗布した熱伝導グリースを介
し、上記の半導体集積回路のパッケージ部を金属板に接
触させたことを特徴とするプリント配線板構造体。In a printed wiring board structure in which a plurality of various electronic components and semiconductor integrated circuits are mounted on the surface of a printed wiring board, the printed wiring board is provided with a through hole corresponding to the external shape of the semiconductor integrated circuit, and After closely bonding the metal plate to the back side of the printed wiring board, the semiconductor integrated circuit is inserted into the through hole, and then the semiconductor integrated circuit is inserted into the through hole through thermal conductive grease applied to the bottom of the through hole. A printed wiring board structure, characterized in that the package portion of the semiconductor integrated circuit described above is brought into contact with a metal plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP491088A JPH01186700A (en) | 1988-01-14 | 1988-01-14 | Printed wiring board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP491088A JPH01186700A (en) | 1988-01-14 | 1988-01-14 | Printed wiring board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01186700A true JPH01186700A (en) | 1989-07-26 |
Family
ID=11596793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP491088A Pending JPH01186700A (en) | 1988-01-14 | 1988-01-14 | Printed wiring board structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01186700A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0804054A1 (en) * | 1996-04-16 | 1997-10-29 | Allen-Bradley Company, Inc. | Insulated surface mount circuit board construction |
| US5815173A (en) * | 1991-01-30 | 1998-09-29 | Canon Kabushiki Kaisha | Nozzle structures for bubblejet print devices |
| US5841452A (en) * | 1991-01-30 | 1998-11-24 | Canon Information Systems Research Australia Pty Ltd | Method of fabricating bubblejet print devices using semiconductor fabrication techniques |
| EP0766506A3 (en) * | 1995-09-29 | 1998-12-23 | Allen-Bradley Company, Inc. | A multilayer circuit board having a window exposing an enhanced conductive layer for use as an insulated mounting area |
| KR100458650B1 (en) * | 1995-11-10 | 2005-04-06 |
-
1988
- 1988-01-14 JP JP491088A patent/JPH01186700A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5815173A (en) * | 1991-01-30 | 1998-09-29 | Canon Kabushiki Kaisha | Nozzle structures for bubblejet print devices |
| US5841452A (en) * | 1991-01-30 | 1998-11-24 | Canon Information Systems Research Australia Pty Ltd | Method of fabricating bubblejet print devices using semiconductor fabrication techniques |
| EP0766506A3 (en) * | 1995-09-29 | 1998-12-23 | Allen-Bradley Company, Inc. | A multilayer circuit board having a window exposing an enhanced conductive layer for use as an insulated mounting area |
| KR100458650B1 (en) * | 1995-11-10 | 2005-04-06 | ||
| EP0804054A1 (en) * | 1996-04-16 | 1997-10-29 | Allen-Bradley Company, Inc. | Insulated surface mount circuit board construction |
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