JPH01184906A - Chip type network resistor - Google Patents

Abstract

PURPOSE:To contrive improvement both in moisture-resisting property and acidproof property by a method wherein a region in which the relative pattern interval of a film resistor will be widened and another region in which said pattern interval will be narrowed are alternately arranged on a sheetlike insulated substrate, a trimming work is conducted in phase direction toward the film resistors located on both sides with the widened region as a starting point. CONSTITUTION:A region in which the mutual pattern interval of a film resistor is relatively widened and another region in which said pattern interval is relatively narrowed are arranged alternately on a sheetlike insulated substrate 1. Trimming grooves 32 are formed by conducting a trimming work in phase direction toward the film resistor 31 located on both sides with the inside of the relatively widened region as a starting point. Also, the slit 33 to be used to divide the substrate is provided so that the region where the pattern interval will be relatively widened becomes a substrate dividing part, and also the element of the film resistor 4 will be formed in one set on the sheetlike insulated substrate 1 on which the film resistor 31 is formed. As a result, the unsatisfactory state in the increase of resistance value due to excessive adjustment of the film resistor can be eliminated, and the reliability in moisture- resisting property and acidityproof property can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention mainly relates to a chip-type network resistor, which is a chip-type electronic component intended to be mounted on a printed circuit board or the like by an automatic mounting machine.

BACKGROUND OF THE INVENTION Conventionally, this type of chip-type network resistor, as shown in FIG. 4
After attaching, an insulating glass or resin 6 for overcoat is formed to cover the film resistor 3, and a slit 6 for dividing the film resistor pattern and a slit 7 for dividing the electrode part are formed as shown in FIG. , it was configured to be divided into individual pieces.

As shown in FIGS. 9 and 10, the chip-type network resistor configured as described above has film resistors 3 arranged at equal pattern intervals, and film resistors 3 to adjust the resistance value. Trimming grooves were provided at the same end of body 3 in the same direction. FIG. 10 is a diagram showing the chip type network resistor 8 of FIG. 9 divided into individual pieces by dividing slits. In FIG. 9 and FIG. 10, 2 is an electrode,
It is used to function as an external terminal. Reference numeral 3 denotes a film resistor, which is formed between the electrodes 2 so as to partially overlap with each other. 4 is a trimming groove, which is a trace of adjusting the resistance value of the film resistor 3 to the positive side. Reference numeral 6 denotes insulating glass or resin for overcoating, which serves to improve the moisture resistance of the film resistor 3 and the acid resistance of the meso-oxidizing process.

6 is a slit for dividing between film resistor patterns. 7
is a slit for dividing the electrode part.

Problems to be Solved by the Invention In such a conventional configuration, as shown in FIGS. 11, 12, and 13, trimming grooves 4 are sequentially attached to a film resistor 9 whose resistance value is not adjusted. When making the film resistor 10, the mutual pattern spacing 11 of the film resistors 9 is as follows:
As chip-type electronic components become lighter, thinner, shorter and smaller, o,
However, due to dimensional errors in the insulating substrate 1, misalignment when forming the film resistor, blurring of the trimming start point due to laser beams, etc., the trimming start point may be located near the neighboring film resistor whose resistance value has already been adjusted. A phenomenon that appears to be coming to the top occurs. Figures 11, 12 and 13
The resistance value of the film resistor 13 that has been excessively adjusted by the re-trimming groove 12 shown in the figure becomes a value much higher than the target resistance value, and there is a problem that the resistance value adjustment failure rate becomes high.

Furthermore, if the trimming start point is moved closer to the film resistor in order to prevent readjustment of the film resistor, there is a risk that the trimming start point will come over the film resistor, as shown in FIG. Unstable film resistor part 14 with little remaining width
There is a problem in that the film resistor 15 is formed with very low reliability due to the large process variations involved.

In addition, in such a conventional configuration, apart from the above-mentioned problem, the film resistor 16 at the left end of the individual chip type network resistor 8 in FIG. 18 could not be secured at a distance of 0.2ffJIl, and the slit 6 for dividing between film resistor patterns shown in FIG. Easy to connect. Further, the distance between the film resistor effective conduction portion 17 of the film resistor 16 and the left end 2o of the overcoat insulating glass or resin 5 is 0.
Since only 15 mm can be secured, the film resistor 16 is.

There is a problem in that it is easily affected by moisture infiltration from the interface between the insulating substrate and the overcoat insulating glass or resin, and by infiltration of plating liquid (acidic liquid) during the plating process.

The present invention solves these problems, and eliminates the occurrence of resistance value increase defects due to excessive adjustment of the film resistor and unreliable defective products with a very small remaining width of the film resistor, and provides moisture resistance. The present invention provides a high-quality chip-type network resistor with improved acid resistance.

Means for Solving the Problems In order to solve the problems, the present invention provides a sheet-like insulating substrate with pattern spacing of film resistors at least two different spacings, and a relative pattern spacing. The resistors are arranged so that relatively wide regions and narrow regions are arranged alternately, and trimming is performed in the phase direction toward the film resistors on both sides, starting from within the relatively wide regions.

Furthermore, a slit for substrate division was provided on the film resistor forming surface, on the back surface, or on both surfaces so that the region where the mutual pattern spacing of the Iff resistors became relatively wide became the substrate division part. It is something.

Function: With this configuration, the mutual pattern spacing of the film resistors can be reduced to 2.
By arranging film resistors at different intervals, a wider area can be obtained than by arranging film resistors at equal pattern intervals. Substantially, the pattern interval can be increased by 1.5 times, and the risk that the trimming starting point will be on a film resistor adjacent to the film resistor to be adjusted can be greatly reduced. However, in order to obtain a wide area, a narrow area must be created in another location, so it is necessary to adjust the resistance values of all film resistors by trimming without bringing the trimming start point to that area. There is.

Therefore, if the mutual pattern spacing of the film resistors is arranged so that relatively wide areas and narrow areas are arranged alternately, the film resistors on both sides can be trimmed using the relatively wide area as the starting point for trimming. By trimming in the phase direction toward , it becomes possible to adjust the resistance values of all film resistors.

Embodiment FIG. 1 is a diagram showing the formation of a film resistor on a sheet-shaped insulating substrate of a chip-type network resistor according to an embodiment of the present invention. In FIG. 1, 1 is a sheet-shaped insulating substrate. 3o is an electrode, which functions as an external terminal. Reference numeral 31 denotes a film resistor, which is arranged on the sheet-like insulating substrate 1 so that regions where the pattern spacing between the film resistors is relatively wide and regions where it is relatively narrow are arranged alternately. Reference numeral 32 denotes a trimming groove, in which the film resistor 3 on both sides starts from a relatively wide area.
It is trimmed in the phase direction toward 1. Reference numeral 33 denotes a dividing slit between the film resistor patterns, and the film resistor 31 is formed on the sheet-like insulating substrate 1 so that the area where the pattern interval becomes relatively wide becomes the substrate dividing part. Slits are provided so that four film resistor elements form one set. Reference numeral 34 denotes a slit for dividing electrode portions, which is provided on the same sheet-like insulating substrate 1 as the slit 33 for dividing between coated resistor patterns. Reference numeral 35 is an insulating resin for overcoating, which serves to improve the moisture resistance of the film resistor 31 and the acid resistance of the plating solution in the plating process.

FIG. 2 shows that the sheet-like insulating substrate 1 of FIG. 1 is divided by slits 33 for dividing film resistor patterns and slits 34 for dividing electrode parts, and four film resistors are divided into one set of individual pieces. 3 is a diagram showing a chip type network resistor 36. FIG.

As described above, according to this embodiment, regions where the mutual pattern spacing of film resistors is relatively wide and regions where the pattern spacing is relatively narrow are arranged alternately on a sheet-like insulating substrate, Starting from the relatively wide area, trim in the phase direction toward the film resistors on both sides, and further, trim so that the area where the mutual pattern spacing of the film resistors becomes relatively wide becomes the substrate dividing part. By providing slits on the sheet-like insulating substrate on which the film resistor is formed so that four film resistor elements form one set, the pattern spacing of the conventional product is changed from 0.4 mm to that of the present example. The interval can be extended to o, emttt, and the trimming direction is in the phase direction, so the yield rate when adjusting the resistance value of conventional chip-type network resistors was about 80%, whereas The yield when adjusting the resistance value of the chip type network device of this embodiment can be improved to 99%. Furthermore, the rate of defects in processes such as board division and plating can be significantly improved.

In this example, the dividing slits between the film resistor patterns were provided so that four film resistor elements formed one set, but any number of elements such as two or eight elements could be used.
The slits may be provided in one set. Here, if the trimming configuration of the present invention is used, even if the trimming start point comes on the film resistor 22 on the left side when the resistance value of the film resistor 21 on the right side in FIG. 3 is adjusted. Next, as shown in FIGS. 4 and 5, the resistance value of the film resistor on the left side can be adjusted using the original trimming groove 23, so that it is extremely unlikely that the resistance value will be incorrectly adjusted.

Next, contrary to FIGS. 4 and 5, when adjusting the resistance value of the film resistor 24 on the left side using the trimming groove 25 as shown in FIGS. Even if the starting point of the trimming groove 25 is on the film resistor 26 on the right side, where the value adjustment has been completed, and the film resistor 26 is trimmed excessively, in the case of FIG. Since the trimming starting point is directly above the , the resistance value will not increase.Even in the case of FIG. The resistance value will not increase. On the other hand, with this configuration, the effect of excessive trimming of the film resistor can be eliminated or minimized. Next, as shown in FIG. 8, regions 27 where the mutual pattern spacing of the film resistors is widened become substrate dividing portions.

By providing the substrate dividing slit 28 on the insulating substrate 1, it is possible to increase the distance between the effective conductive portion 26 & of the film resistor 26 and the substrate dividing slit 28.
It is less susceptible to the effects of stress when dividing the board. Furthermore, since the distance between the end 29 of the overcoat insulating glass or resin 36 and the effective conductive portion 261L of the film resistor 26 can be increased, moisture from the interface between the insulating substrate 1 and the overcoat insulating glass or resin 35 can be kept large. It is also less susceptible to the effects of infiltration and infiltration of plating liquid during the plating process.

Effects of the Invention As described above, according to the present invention, on a sheet-like insulating substrate, the mutual pattern spacing of film resistors is set to at least two different spacings, and the notch spacing is relatively wide. The regions where the film becomes relatively wide and the regions where the film becomes narrow are arranged alternately, and trimming is performed in the phase direction toward the film resistors on both sides, starting from the region where the film becomes relatively wide. The area where the pattern spacing becomes relatively wide is
By providing a slit for dividing the board so that it reaches the board dividing part, using the same process and materials as before,
In addition to eliminating the occurrence of defective products with increased resistance due to over-adjustment of the film resistor and unreliable defective products with extremely small remaining width of the film resistor, it also has excellent environmental resistance such as moisture resistance and acid resistance. It is also possible to achieve the effect of realizing a high quality chip type network resistor.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a chip-type network resistor according to an embodiment of the present invention before division, FIG. 2 is a plan view of the same chip-type network resistor after division, and FIGS. 3, 4, and 5 6 and 7 are explanatory diagrams for explaining resistance value adjustment in the present invention, and FIG. 8 is a plan view of a chip type network resistor for explaining substrate division in the present invention. Figure 9 is a plan view of a conventional chip-type network resistor before division, Figure 10 is a plane view of the same chip-type network resistor after division, and Figures 11, 12, and 13 are conventional film resistors. FIG. 14 is a plan view of a defective conventional chip-type network resistor. 1... Sheet-shaped insulating substrate, 3o...
Electrode, 31... Film resistor, 32...
Trimming groove, 33... Division slit, 36
...Chip type network resistor. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 3
Figure 6 Toga vKCv') Prisoner O Q Tsujo Figure 9 Figure 10 1'/164 Figure 11 1d

Claims (2)

[Claims] (1) On a sheet-like insulating substrate, a plurality of film resistors are arranged with at least two different pattern spacings, and regions where the pattern spacing is relatively wide and regions where the pattern spacing is relatively narrow are arranged alternately. What is claimed is: 1. A chip-type network resistor characterized in that the chip-type network resistor is arranged in such a manner that the resistor is trimmed from the relatively wide area toward the film resistors on both sides. (2) A chip shape according to claim 1, characterized in that a substrate dividing slit is provided so that a region where the mutual pattern spacing of the film resistors is relatively wide serves as a substrate dividing portion. network resistor.