JPH01184857A - Integrated circuit chip case - Google Patents

Abstract

PURPOSE:To improve the wiring accommodating capability, by pinching a signal wire from the outside, in the through hole of a substrate to mount integrated circuit chips, and electrically connecting the signal line and the integrated circuit chip. CONSTITUTION:The case base plate 1 of an integrated circuit chip case is provided with a through hole 2 at the position of an external input-output terminal 3, which is inserted into the through hole 2. In the through hole 2, a contact point 4 connected with an integrated circuit chip (not shown in the figure) by a connecting pattern is installed. The external input-output terminal 3 inserted in the through hole 2 is pinched by the contact point. The external input-output terminal 3 is provided with a protrusion 31, and prevented from being inserted more deeply than a specified depth by the protrusion 31.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an integrated circuit chip case, and more particularly to a supplement for a bin grid array type integrated circuit chip case.

Conventionally, in integrated circuit chip cases, as shown in FIGS. 4 and 5, external input/output terminals 10 connected to integrated circuit chips (not shown) through connection patterns 11 are connected to integrated circuit chip cases 9. was fixed.

In recent years, the mounting rate of components mounted on printed wiring boards (integrated circuit chips mounted inside the integrated circuit chip case 9) has been steadily increasing, and with this, the wiring patterns of printed circuit boards have become thinner and the signal layer has become thinner. There is a strong tendency for the number to increase.

Conventionally, when a change in wiring occurs due to a change in logic or the like, this is dealt with by cutting the pattern of the printed wiring board and wiring it to the terminals of the component.

However, due to an increase in the mounting rate of components, the patterns on printed wiring boards are becoming finer, and the spacing between adjacent patterns is becoming narrower, so there is a risk of accidentally cutting a part other than the part to be cut during cutting work. There is a drawback that there is.

In addition, when there are many signal layers, it is not possible to cut the inner layer pattern directly, and it is necessary to draw out the cutting pattern on the front and back layers and then wire that pattern and the inner layer pattern, which reduces the wiring capacity. It has the disadvantage of being inviting.

On the other hand, in the case of wiring work, wires are tied around and soldered to the terminals of parts protruding from the back side of the printed wiring board, but generally the parts protruding from the back side of the printed wiring board are short. , soldering to that part requires skill.
Another disadvantage is that there is a risk that a short circuit may occur in adjacent bottles or patterns during soldering.

Furthermore, if it becomes necessary to change the wiring, the repeated installation and removal of wires may cause damage to the printed wiring board and mounted components, which in turn may render these printed wiring boards and mounted components unusable. There are drawbacks.

1. The present invention was made to eliminate the drawbacks of the conventional products as described above, and it is possible to perform cutting work and wiring work by changing the logic, etc., without being influenced by the structure of the printed wiring board. The purpose of the present invention is to provide an integrated circuit chip case that can easily and quickly perform cutting and wiring work without damaging printed wiring boards or mounted components, and that can improve wiring accommodation. shall be.

An integrated circuit chip case according to the present invention includes a mounting member on which an integrated circuit chip is mounted, a through hole provided in the mounting member, and a through hole provided inside the through hole and inserted from the outside. It is characterized by comprising a clamping means for clamping a signal line, and a connecting member for electrically connecting the clamping means and the integrated circuit chip.

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of an embodiment of the present invention. In FIG. 0, a case substrate 1 of an integrated circuit chip case according to an embodiment of the present invention is provided with through holes 2 at external input/output terminal positions. An external input/output terminal 3 is inserted into this through hole 2.

FIG. 2 is a partial sectional view of FIG. 1, and in FIG.
The external input/output terminal 3 inserted into the through hole 2 is held between the two.

The external input/output terminal 3 is provided with a projection 31, and the projection 31 allows the external input/output terminal 3 to be inserted only to a predetermined depth of the through hole 2.

FIG. 3 is a partial sectional view showing cutting work and wiring work in one embodiment of the present invention. The cutting work and wiring work in one embodiment of the present invention will be explained using these FIGS. 1 to 3.

External input/output terminal 3-1 fixed to printed wiring board 6 with solder 7 is inserted into through hole 2-1 and contacts 4-
In the case 1 board held by the
See figure (a)], connection pattern 5- due to logic changes, etc.
Perform the cutting work and wiring work in 1, and connect pattern 5-
2, when electrically connecting to the printed wiring board 6, the external input/output terminal 3-1 is first extracted from the through hole 2-1.

After extracting the external input/output terminal 3-1 from the through hole 2-1, the external input/output terminal 3-1 is cut, and the external input/output terminal 3-2 is fixed to the printed wiring board 6 with solder 7.

When the external input/output terminal 3-2 is fixed to the printed wiring board 6, the external input/output terminal 3-2 is connected to the through hole 2 of the case board 1.
-2 and electrically connect to the connection pattern 4-2.

At this time, the through hole 2 from which the external input/output terminal 3-1 was removed
By inserting the wire rod 8 into -1 and wiring, the cutting work and wiring work of connection pattern 5-1 are completed, and the work of electrically connecting with printed wiring board 6 through connection pattern 5-2 is completed. [See Figure 3(b)].

In this way, the through hole 2 having the contact 4 connected to the integrated circuit chip by the connection pattern 5 is provided at the external input/output terminal position of the case substrate 1 of the integrated circuit chip case, and the external input/output terminal is provided in the through hole 2. By making it possible to freely attach and detach the wires 3 and 8, cutting work and wiring work due to logic changes etc. can be performed without being influenced by the structure of the printed wiring board 6.

In addition, there is no need to perform cutting work where the pattern is fine or where the distance between adjacent patterns is narrow, and there is no need for soldering even when wires are attached and removed at the same time during wiring work. Therefore, cutting work and wiring work can be performed easily and quickly without damaging the printed wiring board 6 or mounted components (not shown).

Furthermore, in cutting work for inner layer patterns when the number of signal layers is large, there is no need to draw out cutting patterns on the front and back layers, so wiring accommodation can be improved.

In one embodiment of the present invention, the through hole 2 is provided in the case substrate 1 on which an integrated circuit chip is mounted, but the present invention may also be implemented in a mounting member having an integrated circuit chip mounted therein and having a top cover. It is clear that similar effects can be obtained by providing through holes as in the example, and it is of course possible to modify this mounting member in various ways.

Further, in one embodiment of the present invention, a bin grid array type integrated circuit chip case has been described, but it is obvious that the present invention can be applied to other integrated circuit chip cases.

DETAILED DESCRIPTION OF THE INVENTION According to the present invention, a signal line from the outside is sandwiched between the through hole provided in the substrate on which the integrated circuit chip is mounted and the through hole of the hole, and the signal line from the outside is By electrically connecting wires and integrated circuit chips, cutting work and wiring work due to logic changes etc. can be performed without being affected by the structure of the printed wiring board. This has the effect that cutting work and wiring work can be performed easily and quickly without damaging components, and that wiring accommodation can be improved.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a partial sectional view of FIG. 1, FIG. 3 is a partial sectional view showing cutting work and wiring work in an embodiment of the present invention, and FIG. 4 is a perspective view of a conventional example, and FIG. 5 is a partial sectional view of FIG. 4. Explanation of symbols of main parts 1...Case board of integrated circuit chip case 3.3-1.3-2...Through hole 4.4-1.4
-2...Contact

Claims (1)

[Claims] (1) A mounting member on which an integrated circuit chip is mounted, a through hole provided in the mounting member, a clamping means provided inside the through hole and clamping a signal line inserted from the outside, and the clamping member An integrated circuit chip case comprising a connecting member for electrically connecting means and the integrated circuit chip.