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JPH01179492U - - Google Patents

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Publication number
JPH01179492U
JPH01179492U JP7585088U JP7585088U JPH01179492U JP H01179492 U JPH01179492 U JP H01179492U JP 7585088 U JP7585088 U JP 7585088U JP 7585088 U JP7585088 U JP 7585088U JP H01179492 U JPH01179492 U JP H01179492U
Authority
JP
Japan
Prior art keywords
electronic components
wiring board
printed wiring
heat radiator
spacer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7585088U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7585088U priority Critical patent/JPH01179492U/ja
Publication of JPH01179492U publication Critical patent/JPH01179492U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す斜視図、第2
図a,bは第1図の要部を示す正面図および側面
図、第3図は第1図、第2図に示す放熱体、スペ
ーサおよび回路パターンの位置関係の一例を示す
平面図、第4図は従来の電子部品等の実装構造の
一例を示す斜視図、第5図a,bは第4図の要部
を示す正面図および側面図である。 1は被冷却電子部品、2は放熱体、3はプリン
ト配線基板、8は電子部品、11はピン、13は
スペーサ。
Fig. 1 is a perspective view showing one embodiment of the present invention;
Figures a and b are front and side views showing the main parts of Figure 1, Figure 3 is a plan view showing an example of the positional relationship of the heat sink, spacer, and circuit pattern shown in Figures 1 and 2; FIG. 4 is a perspective view showing an example of a conventional mounting structure for electronic components, etc., and FIGS. 5a and 5b are a front view and a side view showing the main parts of FIG. 4. 1 is an electronic component to be cooled, 2 is a heat sink, 3 is a printed wiring board, 8 is an electronic component, 11 is a pin, and 13 is a spacer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数の電子部品と、自己発熱により温度が上昇
する電子部品を取付けた放熱体等が搭載されたプ
リント配線基板において、前記放熱体をスペーサ
を介して前記プリント配線基板に取付けたことを
特徴とする電子部品等の実装構造。
A printed wiring board on which a plurality of electronic components and a heat radiator etc. to which electronic components whose temperature increases due to self-heating are mounted are mounted, characterized in that the heat radiator is attached to the printed wiring board via a spacer. Mounting structure for electronic components, etc.
JP7585088U 1988-06-09 1988-06-09 Pending JPH01179492U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7585088U JPH01179492U (en) 1988-06-09 1988-06-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7585088U JPH01179492U (en) 1988-06-09 1988-06-09

Publications (1)

Publication Number Publication Date
JPH01179492U true JPH01179492U (en) 1989-12-22

Family

ID=31300903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7585088U Pending JPH01179492U (en) 1988-06-09 1988-06-09

Country Status (1)

Country Link
JP (1) JPH01179492U (en)

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