JPH01179411U - - Google Patents
Info
- Publication number
- JPH01179411U JPH01179411U JP7646388U JP7646388U JPH01179411U JP H01179411 U JPH01179411 U JP H01179411U JP 7646388 U JP7646388 U JP 7646388U JP 7646388 U JP7646388 U JP 7646388U JP H01179411 U JPH01179411 U JP H01179411U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- circuit component
- support base
- clamping part
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 13
- 238000000034 method Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図ａ乃至ｃは本考案の一実施例たる回路部
品用支持基台のそれぞれ部分正面図、平面図、側
面図、第２図はリード線挾持部の拡大詳細図、第
３図ａ，ｂは回路部品を回路部品用支持基台に結
合させた状態を示す平面図、側面図、第４図はシ
ールドケースの斜視図、第５図は回路部品と回路
部品用支持基台との組み立て工程を示す分解斜視
図、第６図は組み立て後の状態を示す外観斜視図
、第７図はリード線挾持部の他の実施例を示す説
明図、第８図ａは従来の回路部品としてのインダ
クタンス素子の外観斜視図、同図ｂ及びｃは巻線
リードをリード線挾持部に押入する際の説明図で
ある。
１０……回路部品、１２……リード線、１５，
２０……リード線挾持部、１４……回路部品支持
基台、１７……リード線挾持溝、１６……開口部
、１８ａ，１８ｂ……突出部。
Figures 1a to 1c are partial front views, plan views, and side views of a support base for circuit components according to an embodiment of the present invention, Figure 2 is an enlarged detailed view of a lead wire holding part, Figures 3a, b is a plan view and a side view showing the state in which the circuit components are connected to the support base for circuit components, FIG. 4 is a perspective view of the shield case, and FIG. 5 is the assembly of the circuit components and the support base for circuit components. FIG. 6 is an exploded perspective view showing the process, FIG. 6 is an external perspective view showing the state after assembly, FIG. 7 is an explanatory view showing another embodiment of the lead wire holding part, and FIG. 8a is an illustration of a conventional circuit component. Figures b and c of the inductance element are explanatory views when pushing the winding lead into the lead wire holding part. 10...Circuit components, 12...Lead wire, 15,
20...Lead wire holding portion, 14...Circuit component support base, 17...Lead wire holding groove, 16...Opening portion, 18a, 18b...Protrusion portion.
Claims (1)
子からなる回路部品に連設された複数のリード線
を挾持支持するくし歯状に配列されたリード線挾
持部を有する回路部品用支持基台において、前記
リード線挾持部はリード線の外径寸法値よりも大
寸法値とした開口部と該リード線の断面形状と対
応させて形成したリード線挾持溝と開口部からリ
ード線挾持溝に至る中間部とからなり、該中間部
にリード線の抜けを防止する幅狭部が設けられて
いるガイド部とを備えたことを特徴とする回路部
品用支持基台。 (2) 前記幅狭部は、前記中間部と前記リード線
挾持溝との境界部に設けられている請求項１記載
の回路部品用支持基台。 (3) 前記ガイド部は開口部から中間部に向けて
狭くなるテーパ状に形成されている請求項１記載
の回路部品用支持基台。[Claims for Utility Model Registration] (1) Lead wires arranged in a comb-like shape that sandwich and support a plurality of lead wires connected to a circuit component consisting of one or more electrically connected circuit elements. In the circuit component support base having a clamping part, the lead wire clamping part has an opening having a dimension larger than the outer diameter of the lead wire, and a lead wire clamping part formed to correspond to the cross-sectional shape of the lead wire. For a circuit component, comprising a guide portion comprising a groove and an intermediate portion extending from the opening to the lead wire holding groove, and the intermediate portion is provided with a narrow portion to prevent the lead wire from coming off. Support base. (2) The circuit component support base according to claim 1, wherein the narrow width portion is provided at a boundary between the intermediate portion and the lead wire holding groove. (3) The circuit component support base according to claim 1, wherein the guide portion is formed in a tapered shape that becomes narrower from the opening toward the middle portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7646388U JPH01179411U (en) | 1988-06-08 | 1988-06-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7646388U JPH01179411U (en) | 1988-06-08 | 1988-06-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01179411U true JPH01179411U (en) | 1989-12-22 |
Family
ID=31301488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7646388U Pending JPH01179411U (en) | 1988-06-08 | 1988-06-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01179411U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6855992B2 (en) | 2001-07-24 | 2005-02-15 | Motorola Inc. | Structure and method for fabricating configurable transistor devices utilizing the formation of a compliant substrate for materials used to form the same |
| US6885065B2 (en) | 2002-11-20 | 2005-04-26 | Freescale Semiconductor, Inc. | Ferromagnetic semiconductor structure and method for forming the same |
| US6965128B2 (en) | 2003-02-03 | 2005-11-15 | Freescale Semiconductor, Inc. | Structure and method for fabricating semiconductor microresonator devices |
| US6992321B2 (en) | 2001-07-13 | 2006-01-31 | Motorola, Inc. | Structure and method for fabricating semiconductor structures and devices utilizing piezoelectric materials |
| US7045815B2 (en) | 2001-04-02 | 2006-05-16 | Freescale Semiconductor, Inc. | Semiconductor structure exhibiting reduced leakage current and method of fabricating same |
| US7342276B2 (en) | 2001-10-17 | 2008-03-11 | Freescale Semiconductor, Inc. | Method and apparatus utilizing monocrystalline insulator |
-
1988
- 1988-06-08 JP JP7646388U patent/JPH01179411U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7045815B2 (en) | 2001-04-02 | 2006-05-16 | Freescale Semiconductor, Inc. | Semiconductor structure exhibiting reduced leakage current and method of fabricating same |
| US6992321B2 (en) | 2001-07-13 | 2006-01-31 | Motorola, Inc. | Structure and method for fabricating semiconductor structures and devices utilizing piezoelectric materials |
| US6855992B2 (en) | 2001-07-24 | 2005-02-15 | Motorola Inc. | Structure and method for fabricating configurable transistor devices utilizing the formation of a compliant substrate for materials used to form the same |
| US7342276B2 (en) | 2001-10-17 | 2008-03-11 | Freescale Semiconductor, Inc. | Method and apparatus utilizing monocrystalline insulator |
| US6885065B2 (en) | 2002-11-20 | 2005-04-26 | Freescale Semiconductor, Inc. | Ferromagnetic semiconductor structure and method for forming the same |
| US6965128B2 (en) | 2003-02-03 | 2005-11-15 | Freescale Semiconductor, Inc. | Structure and method for fabricating semiconductor microresonator devices |
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