JPH01162387U - - Google Patents
Info
- Publication number
- JPH01162387U JPH01162387U JP5797088U JP5797088U JPH01162387U JP H01162387 U JPH01162387 U JP H01162387U JP 5797088 U JP5797088 U JP 5797088U JP 5797088 U JP5797088 U JP 5797088U JP H01162387 U JPH01162387 U JP H01162387U
- Authority
- JP
- Japan
- Prior art keywords
- light
- peripheral wall
- emitting element
- emitting
- transmitting member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims description 9
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
Description
第１図は本考案の一実施例の表示装置１１の断
面図、第２図は第１図の切断面線―から見た
断面図、第３図は典型的な第１の従来例の断面図
、第４図は第３図の切断面線―から見た断面
図、第５図は第２の従来例の断面図、第６図は第
５図の切断面線―から見た断面図である。
１１……表示装置、１２……ＬＥＤ、１３……
配線基板、１５……周壁、１７……透光部材、１
８……光放射領域。
FIG. 1 is a sectional view of a display device 11 according to an embodiment of the present invention, FIG. 2 is a sectional view taken along the cutting plane line in FIG. 1, and FIG. 3 is a sectional view of a typical first conventional example. Figure 4 is a cross-sectional view taken from the cutting line in Figure 3, Figure 5 is a cross-sectional view of the second conventional example, and Figure 6 is a cross-sectional view taken from the cutting line in Figure 5. It is. 11... Display device, 12... LED, 13...
Wiring board, 15... Peripheral wall, 17... Transparent member, 1
8...Light emission area.
補正 昭６３．６．７
実用新案登録請求の範囲を次のように補正する
。Amendment June 7, 1986 The scope of claims for utility model registration is amended as follows.
【実用新案登録請求の範囲】
発光素子と、発光素子を収納し発生された光を
特定方向に放射する筐体とを含む発光表示装置に
おいて、
前記筐体は、
前記発光素子が装着される発光駆動用の配線基
板と、
該配線基板の周縁部全周に一体形成された遮光
性材料から成る周壁と、
該周壁の前記配線基板と反対側に配置され、前
記周壁と一体的に形成された透光性部材とを含む
ことを特徴とする発光表示装置。[Claims for Utility Model Registration] A light-emitting display device including a light-emitting element and a housing that houses the light-emitting element and emits generated light in a specific direction, the housing comprising: a light-emitting device to which the light-emitting element is attached; a driving wiring board; a peripheral wall made of a light-shielding material integrally formed around the entire periphery of the wiring board; and a peripheral wall disposed on the opposite side of the peripheral wall from the wiring board and integrally formed with the peripheral wall. A light emitting display device comprising: a light-transmitting member.
Claims (1)
特定方向に放射する筐体とを含む発光表示装置に
おいて、 前記筐体は、 発光素子が装着される発光駆動用の配線基板と
、 配線基板の周縁部に一体的に全周に亘つて形成
された遮光性材料から成る周壁と、 周壁の配線基板と反対側に配置され透光性材料
から成り、前記周壁と一体的に形成された透光部
材とを含んで構成されるようにしたことを特徴と
する発光表示装置。[Claims for Utility Model Registration] A light-emitting display device including a light-emitting element and a housing that houses the light-emitting element and emits the generated light in a specific direction, the housing comprising: a light-emitting drive to which the light-emitting element is attached; a peripheral wall made of a light-shielding material and formed integrally around the entire circumference of the peripheral edge of the wiring board; a peripheral wall made of a light-transmitting material and disposed on the opposite side of the peripheral wall from the wiring board; What is claimed is: 1. A light emitting display device comprising: a light transmitting member; and a light transmitting member formed integrally with the light transmitting member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5797088U JPH01162387U (en) | 1988-04-28 | 1988-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5797088U JPH01162387U (en) | 1988-04-28 | 1988-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01162387U true JPH01162387U (en) | 1989-11-13 |
Family
ID=31283808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5797088U Pending JPH01162387U (en) | 1988-04-28 | 1988-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01162387U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019059047A1 (en) * | 2017-09-20 | 2019-03-28 | 岩崎電気株式会社 | Light-emitting device, illumination device, and method for manufacturing light-emitting device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55113387A (en) * | 1979-02-22 | 1980-09-01 | Sanyo Electric Co Ltd | Light emitting diode indicator |
-
1988
- 1988-04-28 JP JP5797088U patent/JPH01162387U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55113387A (en) * | 1979-02-22 | 1980-09-01 | Sanyo Electric Co Ltd | Light emitting diode indicator |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019059047A1 (en) * | 2017-09-20 | 2019-03-28 | 岩崎電気株式会社 | Light-emitting device, illumination device, and method for manufacturing light-emitting device |
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