JPH01152634A - Assembly device for semiconductor pellet - Google Patents

Abstract

PURPOSE:To miniaturize an XY table and make light weight the same by shortening the distance of a movement of the table in the Y direction by providing means positioned at its attracting position within a quadrant near a lead frame for rotating a wafer tray by 90 deg. at a time and providing means for rotating a pickup collet by a proper angle with the pellet kept attracted. CONSTITUTION:A pickup collet 10 may simply attract semiconductor pellets 9a located in the first quadrant 9I near a lead frame 2 of a wafer 9 on a wafer tray 4. Hereby, an XY table can be shortened in the distance of its movement in the Y direction by a dimension half the diameter of the wafer 9. When the pickup collet 10 attracts the respective semiconductor pellets 9a located in the second quadrant 9II of the wafer 9, the pickup collet 10 is rotated by 90 deg. in the direction of an arrow C by a rotating mechanism 13, whereby it can keep the semiconductor pellets 9a within the first quadrant 9I in the same direction where those pellets are mounted on the lead frame 2.

Description

Detailed Description of the Invention [Industrial Application Field] The present invention is an assembly for transferring semiconductor pellets, which are divided into smaller pieces than a wafer on the upper surface of a wafer tray, to predetermined locations on a lead frame or a substrate one by one. It is related to the device.

[Conventional technology]

Conventionally, this type of device moves a wafer tray with wafers attached in the X direction perpendicular to the conveying direction of the lead frame.
An XY child table is mounted that moves in two directions: the conveying direction of the lead frame and the Y direction parallel to the lead frame, while a pickup collet that moves back and forth between the semiconductor pellet suction position on the wafer tray and a predetermined position on the lead frame is mounted. When the pickup collet picks up the semiconductor pellet on the top surface of the wafer tray, the pickup collet moves onto the lead frame and releases the pick-up of the semiconductor pellet.
Semiconductor pellets were supplied and placed on the lead frame.
Since the moving distance in both the direction and the Y direction must be greater than the diameter of the wafer so that all the semiconductor pellets can be attracted to the pickup collet, the XY child table becomes large, and the wafer tray and lead In order to make the above possible, a space corresponding to the diameter of the wafer must be provided between the frame and the frame, and as a result, the reciprocating stroke of the pickup collet becomes longer. The speed at which semiconductor pellets are fed to the lead frame is slow, resulting in low assembly efficiency.

Therefore, Japanese Patent Application Laid-open No. 61-247039 as a prior art discloses that after removing semiconductor pellets from the inner half of the wafer on the lead frame side of the wafer on the upper surface of the wafer tray attached to the XY table, the wafer tray is removed from the wafer tray. It is proposed to rotate the wafer by 180 degrees so that the remaining inner half of the upper wafer is on the lead frame side, and to take the semiconductor pellets in this remaining inner half.

[Problem that the invention seeks to solve]

In this way, if the wafer tray mounted on the XY child table is configured to rotate 180 degrees, the reciprocating movement stroke of the pickup collet can be shortened by half the diameter of the wafer, and the The travel distance in the X direction also has the advantage of being able to be reduced by half the diameter of the wafer.

However, on the other hand, rotating the wafer tray mounted on the XY child table by 180 degrees means that when the semiconductor pellets are supplied and placed on the lead frame, the mounting direction is correct before the wafer tray is rotated 180 degrees. Since the direction will be reversed later, LE is a suitable semiconductor pellet.
It is limited to those that do not have a certain direction when attached to a lead frame, such as semiconductor pellets for D, and cannot be used for those that require a certain direction when attached to a lead frame, such as semiconductor pellets for IC. It is. Moreover, the prior art can shorten the moving distance of the XY child table in the X direction, and
Since it is not possible to shorten the moving distance in the direction, it has not been possible to reduce the size and weight of the XY child table sufficiently.

The present invention aims to solve the problems of this prior art.

[Means to solve the problem]

To achieve this object, the present invention provides a semiconductor pellet assembly apparatus in which a wafer tray is attached, an XY child table, and a pickup collet that attracts semiconductor pellets on the wafers of the wafer tray and conveys them to a lead frame or a substrate. The pickup position of the semiconductor pellet by the pink-up collet is located in one of the four quadrants of the wafer that is closer to the lead frame or substrate, while the wafer tray is positioned at 90°.
A means for rotating the pickup collet by an appropriate angle in a direction opposite to the direction of rotation of the wafer tray is provided in a state in which the pickup collet attracts a semiconductor pellet by the pickup collet.

[For production]

In this way, by positioning the pickup collet to pick up the semiconductor pellet within one of the four quadrants of the wafer that is closer to the lead frame or substrate, and rotating the wafer tray by 90 degrees, The pickup collet only needs to pick up semiconductor pellets in one of the four quadrants of the wafer on the wafer tray, which is close to the lead frame or substrate, so this is different from the case of the prior art. Similarly, in addition to being able to reduce the reciprocating toss flow in the pickup collet and the moving distance in the X direction of the XY child table by half the diameter of the wafer, the moving distance in the Y direction of the XY child table can be reduced by half the diameter of the wafer. can also be reduced by half the wafer diameter.

However, if the wafer tray is rotated by 90 degrees in this manner, the semiconductor pellets on the wafer are attracted to each quadrant of the wafer.
The direction of attachment of the semiconductor pellet to the lead frame or substrate is shifted by 90 degrees as the wafer tray rotates by 90 degrees.

In contrast, in the present invention, as described above, the pickup collet is configured to rotate by an appropriate angle in a direction opposite to the rotation direction of the wafer tray in a state in which the semiconductor pellet is adsorbed by the pickup collet. When the wafer tray is rotated 90 degrees, the pickup collet is rotated 90 degrees in the opposite direction while the semiconductor pellet is being attracted by the pickup collet, so that the semiconductor pellet can be attached to the lead frame or substrate in the same direction. The attachment of the semiconductor pellet to the lead frame is such that even after the wafer tray is rotated 90 degrees, the original orientation, that is, the attachment before the wafer tray is rotated 90 degrees, can be maintained in the same direction. By rotating the pickup collet in the opposite direction, it is possible to prevent the direction from shifting due to the rotation of the wafer tray, so that all the semiconductor pellets on the wafer can be kept in a constant orientation with respect to the lead frame or substrate. It can also be supplied and placed.

〔Effect of the invention〕

As described above, according to the present invention, since the moving distance of the XY child table in the Y direction can be shortened, the Since it is possible to supply and place semiconductor pellets while maintaining a constant orientation with respect to the frame or substrate, it has the effect of expanding the range of usable semiconductor pellets compared to the case of the prior art.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings. In the drawings, reference numeral 1 denotes a lead frame in which semiconductor pellets are mounted and conveyed in six directions of arrows at intervals of portions 2a with a lead frame 2 in a horizontal state. In the conveyance line, reference numeral 3 indicates XY child tables arranged on the sides of the lead frame conveyance line 1, respectively.

A horizontal wafer tray 4 is mounted on the XY child table via a rotation mechanism 5, and the wafer tray 4 with the rotation mechanism 5 is mounted on the XY child table in a direction parallel to the transport direction A of the lead frame 2. It includes an X-direction moving mechanism 6 that moves in the perpendicular X direction, and an X-direction moving mechanism 7 that moves in the Y direction parallel to the conveying direction A of the lead frame 2. Further, the rotation mechanism 5 for the wafer tray 4 rotates the wafer tray 4 along a vertical axis 8.
It rotates around 90 degrees in the direction of arrow B,
On the upper surface of this wafer tray 4, a wafer 9 on which a large number of semiconductor pellets 9a are formed is placed.

Reference numeral 10 indicates a pickup collet arranged to reciprocate between the wafer tray 4 and the lead frame 2 by means of an arm 11, and the pink-up collet 10 is attached to the pickup collet 10 so as to be reciprocated between the wafer tray 4 and the lead frame 2. The pickup collet 10 is provided with a mechanism 12 for moving up and down at both ends of the pickup collet 10, and the pickup collet 10 is moved around the vertical axis 10a in a direction opposite to the rotational direction B of the wafer tray 4, as shown by an arrow C. It is provided with a rotation mechanism 13 configured to rotate by an angle.

Further, the position of the pickup collet 10 relative to the top of the wafer tray 4, that is, the pickup position of the semiconductor pellet 9a by the pickup collet 10, is set to the four quadrants 91.9I of the wafer 9.
[, 9111, 91V, it is set in one quadrant close to the lead frame 2, for example, within the first quadrant 9■.

In this configuration, when the pickup collet 10 is in the suction position above the wafer tray 4, it is lowered to pick up each quadrant 91, 911 . 9
111. When one semiconductor pellet (9a) in the first quadrant 9 of 9IV is adsorbed, the pink-up collet 1O rises, and then the lead frame 2
By moving upward and descending to release the suction, the semiconductor pellet (9a) is supplied and placed on the lead frame 2, while the XY child table moves so that the next semiconductor pellet (9a) comes to the suction position. By repeating the action,
The semiconductor pellets 9a in the first quadrant 9 of the wafer 9 are supplied and placed on the lead frame 2 one by one.

In this way, when the semiconductor pellets 9a in the first quadrant 9I of the wafer 9 disappear (FIG. 3), the wafer tray 4 is moved so that the second quadrant 9I of the wafer 9 comes to the suction position. After rotating the semiconductor pellet 9a by 90 degrees in the direction of arrow B by the rotation mechanism 5 (FIG. 4), the above operation is performed to rotate the semiconductor pellet 9a within the second quadrant 9.
The wafer tray 4 is further rotated 90 degrees so that the third quadrant 9■ of the wafer 9 comes to the suction position. 5), the above operation is repeated until the semiconductor pellets 9a in the third quadrant 9■ are exhausted, and when the semiconductor pellets 9a in the third quadrant 9■ are exhausted, the fourth semiconductor pellet 9a in the wafer 9 is After the wafer tray 4 is further rotated 90 degrees (FIG. 6) so that the quadrant 92 is at the suction position, the above operation is repeated until there are no more semiconductor pellets 9a in the fourth quadrant 92.

As a result, the big amplifier collet 10 is attached to each quadrant 91,911 of the wafer 9 of the wafer tray 4.
．． 91 [[, 91V, semiconductor peresone in one quadrant near lead frame 2] 9a is only required to be adsorbed, so between wafer tray 4 of pink-up collet 10 and lead frame 2 In addition to being able to shorten the moving distance in the X direction of the reciprocating toss flow L1 and the XY child table by half the diameter of the wafer 9, the moving distance of the XY child table in the Y direction can also be reduced by 9 can be shortened by half the diameter.

On the other hand, in the big amplifier collet 10, the wafer 9
When picking up each semiconductor pellet 9a within the second quadrant 9■, the pink-up collet 10
is rotated by 90 degrees in the direction of arrow C by the rotating mechanism 13 during the period from when it is suctioned up until it is moved to the loaded frame 2.
Rotate by degrees. Then, when attaching the semiconductor pellet 9a to the lead frame 2 in the second quadrant 9, the attachment direction is changed to the first quadrant of the wafer 9 even after rotating the wafer tray 4 by 90 degrees. 9
The semiconductor pellet 9a in I can be maintained in the same orientation as when attached to the lead frame 2. Also, with big amplifier collet 10, wafer 9
When picking up each semiconductor pellet 9a in the third quadrant 9■, the pink-up collet 10
is rotated by 180 degrees from the first quadrant 9I in the direction of arrow C by the rotation mechanism 13 during the period from when it is suctioned up until it is moved to the lead frame 2, or when the rotation mechanism 13 rotates the By further rotating by 90 degrees from the case of circle 9■, the attachment of the semiconductor pellet 9a to the lead frame 2 in the third quadrant 9■ can maintain the same direction as described above, and furthermore, the pickup When picking up each semiconductor pellet (9a) in the fourth quadrant 9 of the wafer 9 with the collet 10, the pickup collet 10 is , by rotating the rotation mechanism 13 by 270 degrees from the first quadrant 9I in the direction of the arrow C, or by further rotating 90 degrees from the third quadrant 9m. The attachment of the semiconductor pellet 9a to the lead frame 2 within the circle 9 can maintain the same orientation as described above.

In addition, in the pickup collet 10, the wafer 9
When adsorbing each semiconductor pellet 9a in the second quadrant 9■, the third quadrant 9■, and the fourth quadrant 9■, the big amplifier collet 10 is moved in the opposite direction to the rotation direction of the wafer tray 4. Needless to say, it must be returned to the state before rotation.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention; FIG. 1 is a side view, FIG. 2 is a plan view, and FIGS. 3, 4, 5, and 6 are views showing the operating state. 1... Lead frame conveyance line, 2... Lead frame, 3... XY child table 4... Wafer tray, 5... Wafer tray rotation mechanism, 6
...X direction movement mechanism, 7...Y direction movement mechanism,
9...Wafer, 9a...Semiconductor pellet, 9
1゜9■, 9I[I, 91V...quadrant, 10...
...Pickup collet, 11...Arm, 13
...The rotation mechanism of the pickup collet.

Claims (1)

[Claims] (1) In a semiconductor pellet assembly device comprising an XY table to which a wafer tray is attached, and a pickup collet that adsorbs semiconductor pellets on the wafers of the wafer tray and conveys them to a lead frame or a substrate, the semiconductor pellets are removed by the pickup collet. The pick-up collet is located in one of the four quadrants of the wafer near the lead frame or substrate, while means for rotating the wafer tray by 90 degrees is provided; An apparatus for assembling semiconductor pellets, comprising means for rotating the pickup collet by an appropriate angle in a direction opposite to the direction of rotation of the wafer tray in a state in which the pickup collet has attracted the semiconductor pellet.