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JPH01146740A - Manufacture of copper-plated laminated sheet - Google Patents

Manufacture of copper-plated laminated sheet

Info

Publication number
JPH01146740A
JPH01146740A JP62303284A JP30328487A JPH01146740A JP H01146740 A JPH01146740 A JP H01146740A JP 62303284 A JP62303284 A JP 62303284A JP 30328487 A JP30328487 A JP 30328487A JP H01146740 A JPH01146740 A JP H01146740A
Authority
JP
Japan
Prior art keywords
copper
resin
reduced pressure
copper foil
under reduced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62303284A
Other languages
Japanese (ja)
Inventor
Kazuo Noguchi
野口 一夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP62303284A priority Critical patent/JPH01146740A/en
Priority to DE3840704A priority patent/DE3840704A1/en
Priority to US07/279,003 priority patent/US4909886A/en
Publication of JPH01146740A publication Critical patent/JPH01146740A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)

Abstract

PURPOSE:To reduce remarkably the pressurizing condition of a double belt press and to improve the dimension stability of the laminated sheet backed with copper by using the laminate in which the base material impregnated with resin and a copper foil are preliminarily heat-welded continuously under reduced pressure. CONSTITUTION:For example light long base materials 1 impregnated with resin and wound into a roll, and e.g. two copper foils 2 are introduced into the chamber 4 kept under reduced pressure by a vacuum pump 7, and between a pair of vacuum sealing rolls 41, and then after they have been heated under reduced pressure from this both surfaces by a far infrared ray heater 43, and made into one body by two pairs of heating and pressurizing rolls 42, it exits from the reduced pressure-chamber through a pair of vacuum sealing rolls 41, and is introduced into a double belt press 5. The resin is cured by heating and pressurizing, and after it has been made into one body with the copper foil, it is discharged, and is cut by a cutting tool 6. Thus the laminated sheet 3 backed with copper is obtained. In this manufacture, by using the laminated material preliminarily heat bonded under reduced pressure, a high pressure is not required in the double belt press, and the copper-plated laminated sheet having no bubbles and no defects is obtained. When the laminated sheet is worked into a printed wiring board, the rate of dimension change is small, and its warp is remarkably improved.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、電気、電子機器等のプリント配線板に使用す
る銅張積層板の連続的製造法の改良に関するものである
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an improvement in a continuous manufacturing method for copper-clad laminates used for printed wiring boards for electrical and electronic equipment.

〔従来の技術およびその問題点〕[Conventional technology and its problems]

銅張積層板の製造法の一つとして、長尺の樹脂含浸基材
を所望枚数とその最外の片面又は両面に長尺の銅箔を重
ね合わせた構成の積層材を一対のベルト間で加熱加圧す
るダブルベルトプレス法による連続的銅張積層板の製造
法は知られている(特開昭61−10456他)。
As one of the manufacturing methods for copper-clad laminates, a laminate consisting of a desired number of long resin-impregnated base materials and a long copper foil layered on one or both of the outermost surfaces is placed between a pair of belts. A method for producing a continuous copper-clad laminate using a double belt press method using heat and pressure is known (Japanese Patent Application Laid-open No. 10456/1983, etc.).

この方法で積層板中に気泡等の欠陥のないものを製造す
るには、ダブルベルトプレスの圧力を50kg/co?
以上と高圧力とすることが必須となっている。
In order to produce a laminate with no defects such as air bubbles in the laminate using this method, the pressure of the double belt press must be 50 kg/co?
It is essential to use a high pressure.

ところが、ダブルベルトプレスにおいて高圧力を使用す
るためには加圧法に種々の問題点があった。例えば、空
気、油等の流体を加圧媒体として用いる場合には、これ
らの媒体の洩れを防止するためのシールに工夫が必要で
あり、大掛かりな装置となったり、又は、洩れを完全に
防止することは困難であった。また、加圧にロール(コ
ロ)を使用する方法では、プレスの平滑度の点から小径
のものを多数使用することが必要であるが、高圧力を発
生させようとするとコロへの負荷荷重がその強度に比較
して過大となりコロの破損等が生じやすい等の問題が生
じ、バッファ・ツブ機構等の工夫が必須となる。
However, there are various problems with the pressurization method due to the use of high pressure in the double belt press. For example, when fluids such as air or oil are used as pressurizing media, it is necessary to devise seals to prevent leakage of these media, resulting in large-scale equipment, or it is impossible to completely prevent leakage. It was difficult to do so. In addition, in the method of using rolls (rollers) for pressurizing, it is necessary to use many small diameter ones from the point of view of press smoothness, but when trying to generate high pressure, the load on the rollers becomes large. It becomes too strong compared to its strength, causing problems such as easy damage to the rollers, so it is essential to devise a buffer/tube mechanism.

また、上記の方法の欠点を改良する方法として加圧媒体
として溶融金属を使用して、融点以下に冷却した固体と
して加圧する方法の提案もあるが溶融金属、固体化した
金属の取り扱い等の新たな′問題点を生じる。
In addition, as a method to improve the shortcomings of the above methods, there is a proposal to use molten metal as a pressurizing medium and pressurize it as a solid cooled below the melting point. This will cause some problems.

〔発明が解決しようとする問題点] 本発明は、ダブルベルトプレス法において作用させる圧
力を従来に比較して大幅に低下させ、かつ気泡の発生等
のない方法について鋭意検討した結果、減圧下に予め加
熱融着した積層材を使用する方法を見出し、本発明を完
成した。
[Problems to be Solved by the Invention] The present invention has been developed as a result of intensive studies on a method that significantly reduces the pressure applied in the double belt press method compared to the conventional method and does not generate bubbles. The present invention was completed by discovering a method of using a laminated material that has been heat-fused in advance.

すなわち、本発明は、長尺の樹脂含浸基材を1枚又は複
数枚とその最外の片面又は両面に長尺の銅箔を重ね合わ
せた構成の積層材を一対のベルト間で加熱加圧するダブ
ルベルトプレス法による連続的銅張積層板の製造法にお
いて、予め樹脂含浸基材と銅箔とを減圧下で連続的に加
熱融着させた積層材を用いることを特徴とする銅張積層
板の製造法であり、好ましい実施態様においては、連続
的に加熱融着させる時の圧力が500mmHg以下、特
に200mmHg以下とすること、連続的に加熱融着さ
せる装置へ樹脂含浸基材と銅箔とを導入及び搬出する部
分の清浄度がクラス100.000以下、特にクラス1
0.000以下とすることにある。
That is, the present invention heats and presses between a pair of belts a laminated material composed of one or more long resin-impregnated base materials and a long copper foil layered on one or both of the outermost surfaces thereof. A method for manufacturing a continuous copper-clad laminate using a double belt press method, characterized in that a laminate is used in which a resin-impregnated base material and a copper foil are continuously heat-fused under reduced pressure in advance. In a preferred embodiment, the pressure during continuous heat-sealing is 500 mmHg or less, particularly 200 mmHg or less, and the resin-impregnated base material and the copper foil are placed in a continuous heat-sealing device. The cleanliness of the parts where the product is introduced and taken out is below class 100.000, especially class 1.
The purpose is to keep it below 0.000.

本発明の製造法によれば、ダブルベルトプレスの加圧条
件をlθ〜30kg/cJと大幅に低下でき、更に、製
造した銅張積層板の寸法安定性(寸法変化率、反り)に
おいても優れたものである。
According to the manufacturing method of the present invention, the pressure conditions of the double belt press can be significantly reduced to lθ ~ 30 kg/cJ, and the dimensional stability (dimensional change rate, warpage) of the manufactured copper clad laminate is also excellent. It is something that

以下、本発明の構成について説明する。The configuration of the present invention will be explained below.

本発明の樹脂含浸基材とは、通常、フェノール樹脂、エ
ポキシ樹脂、不飽和ポリエステル樹脂等のワニス又は無
溶剤液状である熱硬化性樹脂組成物を、クラフト紙、リ
ンター紙、ガラス織布、ガラス不織布等の長尺の補強基
材に連続的に含浸し、適宜乾繰して溶剤を除去してなる
ものである。
The resin-impregnated base material of the present invention usually refers to a varnish such as a phenol resin, an epoxy resin, an unsaturated polyester resin, or a thermosetting resin composition in a solvent-free liquid state, such as kraft paper, linter paper, glass woven fabric, or glass. It is obtained by continuously impregnating a long reinforcing base material such as a nonwoven fabric, and drying it appropriately to remove the solvent.

また、銅箔としては、長尺の電解銅箔、圧延銅箔等、並
びにこれらの裏面(接着面側)を接着用に処理したもの
更に裏面に接着剤層を形成したもの等であり、いずれも
使用可能であり、適宜上記に説明した樹脂含浸基材の樹
脂の種類に応じて選択するものである。
In addition, copper foils include long electrolytic copper foils, rolled copper foils, etc., as well as those whose back surfaces (adhesive side) have been treated for adhesion, and those with adhesive layers formed on the back surfaces. It is also possible to use the resin, and it is selected depending on the type of resin of the resin-impregnated base material described above.

また、本発明のダブルベルトプレスとしては、加圧媒体
として空気、油等を用いる方法、小径のコロを用いる方
法、加圧媒体と小径コロとを併用する方法、その他いず
れの方法でもよく、圧力は10〜30kg/cfflで
十分であり、温度及び滞留時間は、使用する樹脂含浸基
材の種類により適宜選択するものであるが、生産性の点
から、温度は通常の積層成形に比較して高めに設定して
滞留時間を短くとるのが好ましい。
Further, the double belt press of the present invention may be manufactured by using air, oil, etc. as a pressurizing medium, using small diameter rollers, using a pressurizing medium and small diameter rollers together, or any other method. 10 to 30 kg/cffl is sufficient, and the temperature and residence time should be selected appropriately depending on the type of resin-impregnated base material used, but from the viewpoint of productivity, the temperature is It is preferable to set the temperature high to shorten the residence time.

上記の樹脂含浸基材と銅箔とを減圧下に加熱融着する方
法は、加熱手段を内部に持った減圧チャンバー内に所望
の樹脂含浸基材と銅箔とを導入し、減圧下に加熱して含
浸樹脂を溶融させると共に含浸樹脂基材内、並びに樹脂
含浸基材間、樹脂含浸基材と銅箔間の空気及び残余の揮
発分を除いた後、プレス融着することによる。
The above method of heat-sealing the resin-impregnated base material and copper foil under reduced pressure involves introducing the desired resin-impregnated base material and copper foil into a reduced-pressure chamber that has a heating means inside, and heating the resin-impregnated base material and copper foil under reduced pressure. After melting the impregnated resin and removing air and residual volatile matter within the impregnated resin base material, between the resin-impregnated base materials, and between the resin-impregnated base material and the copper foil, press fusion is performed.

ここに、減圧チャンバー内を減圧に保持するために、樹
脂含浸基材及び銅箔の減圧チャンノXJ−内への導入部
及び搬出部は一対または複数対のロールを使用してシー
ルする。しかしながら、シール部分から減圧チャンバー
内に空気が流入することを完全に防止することは困難で
あり、入出口付近の空気中にダストがある場合には空気
の流入に伴って空気中のダストがシール部分にあたる樹
脂含浸基材表面、銅箔表面等に付着し、特に銅箔表面に
付着したダストは加圧プレスにより銅箔表面に凹凸を生
じさせる問題が生じやすい。従って、この問題を回避す
るためには、清浄化した部屋内に装置を設置することや
清浄化した空気を減圧チャンバーの入出口付近より吹き
出す等の手段を追加して清浄度クラス100.000以
下、特にクラス10゜000以下に保持するのが好まし
い。
Here, in order to maintain the inside of the reduced pressure chamber at reduced pressure, the introduction and removal parts of the resin-impregnated base material and copper foil into the reduced pressure channel XJ- are sealed using one or more pairs of rolls. However, it is difficult to completely prevent air from flowing into the decompression chamber from the seal, and if there is dust in the air near the inlet/outlet, the dust in the air will seal as the air flows in. Dust that adheres to the resin-impregnated base material surface, copper foil surface, etc., which corresponds to the part, and in particular, dust that adheres to the copper foil surface tends to cause unevenness on the copper foil surface by pressure pressing. Therefore, in order to avoid this problem, it is necessary to add measures such as installing the device in a clean room or blowing clean air out from near the entrance and exit of the decompression chamber so that the cleanliness class is 100.000 or less. In particular, it is preferable to maintain the temperature at class 10°000 or less.

また、加熱手段としては種々の方法を取りうるものであ
り、遠赤外線等による輻射加熱、加熱ロールによる伝導
加熱などが例示されるが、非接触形の遠赤外線ヒーター
、ランプ等による輻射加熱が好ましい。
In addition, various methods can be used as the heating means, and examples include radiant heating using far infrared rays, conduction heating using a heating roll, etc., but radiant heating using a non-contact type far infrared heater, lamp, etc. is preferable. .

更に、減圧チャンバー内においては、上記した如く樹脂
含浸基材間や樹脂含浸基材と銅箔との間の空気を除いて
融着することのみを内的とするものではなく、樹脂含浸
基材を製造する過程において必然的に生じた樹脂含浸基
材内の気泡も除去することが好ましいものであるので、
減圧チャンバー内に導入した樹脂含浸基材間や樹脂含浸
基材と銅箔との間を一旦離して減圧下に加熱して、揮発
分等を十分に除いた後、プレス融着することは特に好ま
しいものである。
Furthermore, in the decompression chamber, the internal process is not only to remove the air between the resin-impregnated base materials or between the resin-impregnated base material and the copper foil as described above, but also to fuse the resin-impregnated base materials and the copper foil. It is preferable to also remove air bubbles in the resin-impregnated base material that inevitably occur during the manufacturing process.
It is especially important to separate the resin-impregnated base materials introduced into the vacuum chamber or between the resin-impregnated base material and the copper foil and heat them under reduced pressure to sufficiently remove volatile components and then press-fuse them. This is preferable.

次に、本発明の製造法の一例を添付の図面により説明す
る。
Next, an example of the manufacturing method of the present invention will be explained with reference to the accompanying drawings.

第1図は、本発明の連続的銅張積層板の製造装置の模式
図であり、ロールに巻かれた長尺の樹脂含浸基材〔1〕
 8枚及び銅箔〔2〕 2枚が、真空ポンプ〔7〕によ
り減圧に保たれた減圧チャンバー〔4〕に一対の真空シ
ールロール〔41〕をへて導入され、ここで減圧下に両
面から遠赤外線ヒーター〔43〕により加熱され、2対
の加熱加圧ロール〔42〕により一体化された後、一対
の真空シールロール〔41〕をへて減圧チャンバーから
出て、ダブルベルトプレス〔5〕に導入され、加熱加圧
されて、樹脂が硬化し銅箔と一体化した銅張積層板とな
って排出され、切断機〔6〕により切断され銅張積層板
〔3〕となる。図面においては、減圧チャンバーへの樹
脂含浸基材lと銅箔2とを真空シールしつつ導入するシ
ールロール〔41〕の前、及び出口の後部分は、簡易な
囲いが付けられ、その内部に清浄化した空気の吹出口〔
44〕を設けて、特にこの部分のクリーン度を保つこと
により「ダスト」によって銅張積層板に欠陥が生じない
如くされるものである。
FIG. 1 is a schematic diagram of the continuous copper-clad laminate manufacturing apparatus of the present invention, in which a long resin-impregnated base material [1] is wound into a roll.
8 sheets and two sheets of copper foil [2] are introduced through a pair of vacuum seal rolls [41] into a vacuum chamber [4] maintained at a reduced pressure by a vacuum pump [7], where they are sealed from both sides under reduced pressure. After being heated by a far-infrared heater [43] and integrated by two pairs of heating pressure rolls [42], it passes through a pair of vacuum seal rolls [41], exits the vacuum chamber, and is transferred to a double belt press [5]. The resin is heated and pressurized to harden the resin and become a copper-clad laminate integrated with the copper foil, which is then discharged and cut by a cutting machine [6] to form a copper-clad laminate [3]. In the drawing, a simple enclosure is attached to the front of the seal roll [41] that introduces the resin-impregnated base material 1 and the copper foil 2 into the reduced pressure chamber while vacuum-sealing it, and the rear part of the exit. Cleaned air outlet [
44] to maintain the cleanliness of this area in particular, to prevent defects from occurring in the copper clad laminate due to "dust".

〔実施例〕〔Example〕

以下、本発明を実施例等により説明する。 The present invention will be explained below with reference to Examples.

実施例1 エポキシ樹脂ワニスを厚み0.2mmのガラス織布に含
浸し、乾燥して樹脂量40%の長尺のプリプレグを得た
Example 1 A glass woven fabric having a thickness of 0.2 mm was impregnated with an epoxy resin varnish and dried to obtain a long prepreg with a resin content of 40%.

添付の第1図のように、上記で得たプリプレグを8枚、
更に両面に厚み35ρの銅箔を重ねた構成で、減圧チャ
ンバー内に導入し、加熱加圧して融着させたて一体化し
た後、ダブルベルトプレスに導入して加熱加圧して銅張
積層板を製造し、ダブルベルトプレスを出たところで所
定の寸法に切断することにより銅張積層板を製造した。
As shown in the attached Figure 1, 8 sheets of the prepreg obtained above,
Furthermore, it has a structure in which copper foil with a thickness of 35ρ is layered on both sides, which is introduced into a reduced pressure chamber, heated and pressurized to fuse and integrate, and then introduced into a double belt press and heated and pressurized to form a copper-clad laminate. A copper-clad laminate was manufactured by manufacturing a copper-clad laminate and cutting it into a predetermined size upon exiting the double belt press.

この際の本装置全体は清浄度クラス100.000以下
の室内に設置し、且つ、減圧チャンバーの入出目部分か
らは清浄度クラス10.000以下の乾燥空気を吹き出
す如くした。又、減圧チャンバー内の滞留時間は0.3
分間、圧力は100mmHg、 融着時のプリプレグの
表面温度は100℃であり、ダブルプレス内の滞留時間
1.0分間、温度200℃、圧力25kg/cITIで
あった。
The entire apparatus was installed in a room with a cleanliness class of 100,000 or less, and dry air with a cleanliness class of 10,000 or less was blown out from the entrance and exit of the vacuum chamber. Also, the residence time in the vacuum chamber is 0.3
The pressure was 100 mmHg, the surface temperature of the prepreg at the time of fusion was 100° C., the residence time in the double press was 1.0 minutes, the temperature was 200° C., and the pressure was 25 kg/cITI.

得られた銅張積層板の特性を第1表に示した。Table 1 shows the properties of the obtained copper-clad laminate.

比較例1 実施例1と同様のプリプレグ、銅箔を用い、減圧下の加
熱融着をせず、ダブルベルトプレスの条件を200℃、
50kg/cnfとする他は同様にして銅張積層板を製
造した。
Comparative Example 1 Using the same prepreg and copper foil as in Example 1, without heat fusing under reduced pressure, double belt press conditions were 200 ° C.
A copper-clad laminate was produced in the same manner except that the weight was 50 kg/cnf.

得られた銅張積層板の特性を第1表に示した。Table 1 shows the properties of the obtained copper-clad laminate.

〔発明の作用および効果〕[Operation and effects of the invention]

以上、発明の詳細な説明および実施例、比較例から明ら
かなように、本発明のダブルペルドブウスによる銅張積
層板の製造法は、予め減圧予備融着した積層材を使用す
ることによって、ダブルベルトプレスに高圧を必要とせ
ずに気泡の除去された欠陥のない銅張積層板が得られる
ものであり、ダブルベルトプレスに使用する加圧機構そ
の他が極めて容易に製造でき、経済性にも優れたもので
ある。
As is clear from the detailed description of the invention, Examples, and Comparative Examples, the method for manufacturing copper-clad laminates using double perdoube of the present invention uses laminates that have been pre-fused under reduced pressure in advance. A defect-free copper clad laminate with bubbles removed can be obtained without the need for high pressure in a double belt press, and the pressure mechanism and other parts used in the double belt press can be manufactured extremely easily, making it economical as well. It is excellent.

更に、連続的積層成形が低圧で行なえることから、単に
気泡の残存等の欠陥がないばかりでなく得られた銅張積
層板は、予め減圧予備融着処理を行わない従来の方法に
比較して、銅張積層板をプリント配線板に加工する場合
に最も大きな問題となる寸法変化率が小さく、かつ、反
りも大幅に改良されたものであり、性能の向上の面から
も極めて実用的に優れたプロセスで、あることが理解さ
れるものである。
Furthermore, since continuous lamination molding can be performed at low pressure, the resulting copper-clad laminates are not only free from defects such as remaining bubbles, but are also superior to conventional methods that do not undergo vacuum pre-fusing treatment in advance. The dimensional change rate, which is the biggest problem when processing copper-clad laminates into printed wiring boards, is small, and warping has been greatly improved, making it extremely practical in terms of improved performance. It's a good process and something is understood.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明のダブルベルトプレスによる銅張積層
板の製造法を示す模式図であり、図中の番号はそれぞれ
、1:樹脂含浸基材、2:銅箔、3:銅張積層板、4:
減圧チャンバー、5:ダブルベルトプレス、6:切断機
、7:真空ポンプ、41:真空シールロール、42:加
熱加圧ロール、43:遠赤外線ヒーター、44:清浄空
気吹出口を示す。
FIG. 1 is a schematic diagram showing a method for manufacturing a copper-clad laminate using a double belt press according to the present invention, and the numbers in the figure are 1: resin-impregnated base material, 2: copper foil, 3: copper-clad laminate. Board, 4:
Decompression chamber, 5: double belt press, 6: cutting machine, 7: vacuum pump, 41: vacuum seal roll, 42: heating pressure roll, 43: far infrared heater, 44: clean air outlet.

Claims (1)

【特許請求の範囲】 1 長尺の樹脂含浸基材を1枚又は複数枚とその最外の
片面又は両面に長尺の銅箔を重ね合わせた構成の積層材
を一対のベルト間で加熱加圧するダブルベルトプレス法
による連続的銅張積層板の製造法において、予め樹脂含
浸基材と銅箔とを減圧下で連続的に加熱融着させた積層
材を用いることを特徴とする銅張積層板の製造法。 2 連続的に加熱融着させる時の減圧度が500mmH
g以下の圧力である特許請求の範囲第1項記載の製造法
。 3 連続的に加熱融着させる減圧装置内に樹脂含浸基材
と銅箔とを導入及び搬出する入出口近傍の空気清浄度が
クラス100,000以下である特許請求の範囲第1項
または第2項記載の製造法。
[Claims] 1. A laminate consisting of one or more long resin-impregnated substrates and a long copper foil layered on one or both of the outermost surfaces is heated between a pair of belts. A method for producing a continuous copper-clad laminate using a double-belt pressing method, characterized in that a laminate is used in which a resin-impregnated base material and a copper foil are continuously heat-fused under reduced pressure in advance. Method of manufacturing boards. 2 The degree of vacuum during continuous heat fusion is 500mmH
The manufacturing method according to claim 1, wherein the pressure is less than g. 3. Claims 1 or 2 in which the air cleanliness near the entrance and exit where the resin-impregnated base material and copper foil are introduced into and taken out of the decompression device for continuous heat-fusion is class 100,000 or less Manufacturing method described in section.
JP62303284A 1987-12-02 1987-12-02 Manufacture of copper-plated laminated sheet Pending JPH01146740A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP62303284A JPH01146740A (en) 1987-12-02 1987-12-02 Manufacture of copper-plated laminated sheet
DE3840704A DE3840704A1 (en) 1987-12-02 1988-12-02 METHOD FOR PRODUCING A COPPER PLATED LAYER
US07/279,003 US4909886A (en) 1987-12-02 1988-12-02 Process for producing copper-clad laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62303284A JPH01146740A (en) 1987-12-02 1987-12-02 Manufacture of copper-plated laminated sheet

Publications (1)

Publication Number Publication Date
JPH01146740A true JPH01146740A (en) 1989-06-08

Family

ID=17919105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62303284A Pending JPH01146740A (en) 1987-12-02 1987-12-02 Manufacture of copper-plated laminated sheet

Country Status (1)

Country Link
JP (1) JPH01146740A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100452973B1 (en) * 2002-08-26 2004-10-14 라병철 Sheet winding machine
JP2007081127A (en) * 2005-09-14 2007-03-29 Sharp Corp Semiconductor device and method of manufacturing same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61263753A (en) * 1985-05-18 1986-11-21 松下電工株式会社 Manufacture of laminated board
JPS61263752A (en) * 1985-05-18 1986-11-21 松下電工株式会社 Manufacture of laminated board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61263753A (en) * 1985-05-18 1986-11-21 松下電工株式会社 Manufacture of laminated board
JPS61263752A (en) * 1985-05-18 1986-11-21 松下電工株式会社 Manufacture of laminated board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100452973B1 (en) * 2002-08-26 2004-10-14 라병철 Sheet winding machine
JP2007081127A (en) * 2005-09-14 2007-03-29 Sharp Corp Semiconductor device and method of manufacturing same

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