JPH01146394A - Method and device for manufacturing multilayer interconnection substrate - Google Patents
Method and device for manufacturing multilayer interconnection substrateInfo
- Publication number
- JPH01146394A JPH01146394A JP62306206A JP30620687A JPH01146394A JP H01146394 A JPH01146394 A JP H01146394A JP 62306206 A JP62306206 A JP 62306206A JP 30620687 A JP30620687 A JP 30620687A JP H01146394 A JPH01146394 A JP H01146394A
- Authority
- JP
- Japan
- Prior art keywords
- superconductor
- ceramic
- superconductor thin
- ceramics
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 title claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000002887 superconductor Substances 0.000 claims abstract description 30
- 239000000919 ceramic Substances 0.000 claims abstract description 21
- 239000010409 thin film Substances 0.000 claims abstract description 19
- 239000011888 foil Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 238000005245 sintering Methods 0.000 claims abstract description 5
- 229910002480 Cu-O Inorganic materials 0.000 claims abstract 3
- 239000004593 Epoxy Substances 0.000 claims abstract 2
- 239000004809 Teflon Substances 0.000 claims abstract 2
- 229920006362 Teflon® Polymers 0.000 claims abstract 2
- 239000011521 glass Substances 0.000 claims abstract 2
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 229910000838 Al alloy Inorganic materials 0.000 claims 1
- 239000004859 Copal Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- 241000782205 Guibourtia conjugata Species 0.000 claims 1
- 229910000990 Ni alloy Inorganic materials 0.000 claims 1
- 229910001069 Ti alloy Inorganic materials 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000005238 degreasing Methods 0.000 claims 1
- 238000002156 mixing Methods 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 238000001259 photo etching Methods 0.000 claims 1
- 239000010935 stainless steel Substances 0.000 claims 1
- 229910001220 stainless steel Inorganic materials 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 238000010030 laminating Methods 0.000 abstract description 2
- 239000005416 organic matter Substances 0.000 abstract description 2
- 229910009203 Y-Ba-Cu-O Inorganic materials 0.000 abstract 1
- 238000007493 shaping process Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Landscapes
- Superconductors And Manufacturing Methods Therefor (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は多層配線基板の製造方法とその装置に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method and apparatus for manufacturing a multilayer wiring board.
周知のように、半導体デバイスの開発・製造の進歩に伴
って、今日家電製品から産業機器に至るまで小型化、軽
量化、高速化、高密度化、高信頼化。As is well known, with advances in the development and manufacturing of semiconductor devices, everything from home appliances to industrial equipment has become smaller, lighter, faster, more dense, and more reliable.
低価格の要請Ｖｉますます強くなり、技術革新が展開さ
れている。The demand for low prices is becoming increasingly strong and technological innovations are being developed.
これらの動向の中で最近注目されているのが超電導体で
ある。超電導体とに電気抵抗がゼロになる現象で大別す
ると金属系（例：水銀、鉛、ニオブ等）、セラミックス
系（例： Ｌａ−Ｓｒ −Ｃｕ−０系、 Ｙ −Ｂａ
−Ｃｕ−０系等）、有機物系（例： ’１’ＭＴＳＦ、
ＢＩＴ−ＴＴＦ塩等〕等が挙げられる。Among these trends, superconductors have recently attracted attention. Superconductors can be roughly divided into metal-based (e.g. mercury, lead, niobium, etc.) and ceramic-based (e.g. La-Sr-Cu-0, Y-Ba) based on the phenomenon in which electrical resistance becomes zero.
-Cu-0 system, etc.), organic matter system (e.g. '1'MTSF,
BIT-TTF salt, etc.].
主な利用分野として１強力な電磁石の応用、エレクトロ
ニクス、エネルギー関係が挙げられ、製造装置の小型化
、素子の高密度化、高速化、電気電導性向上、エネルギ
ー、蓄積、電磁し中へいに効果があり、巾広い用途が期
待されている。The main fields of application include the application of powerful electromagnets, electronics, and energy-related areas, such as miniaturization of manufacturing equipment, higher density and higher speed of elements, improved electrical conductivity, and effects on energy, storage, and electromagnetism. It is expected to have a wide range of applications.
従って、上記の超電導体物質を応用した製品又は装置が
切望されているのである。Therefore, there is a strong need for products or devices that utilize the above-mentioned superconductor materials.
この発明は上記した超電導体物質を応用した製品の技術
的諸問題の一つ、多層配線基板の製造方法とその装置を
提供するにある。The present invention aims to solve one of the technical problems of products using the above-mentioned superconductor materials, and to provide a method and apparatus for manufacturing a multilayer wiring board.
この発明に係る多層配線基板の製造方法とその装置は鋭
意検討を重ねた結果、セラミックス基材から成る物品を
常法により脱脂後、所要のパターンを形成した金属系の
箔を張り付け、引掛は具に固定し、引掛は具を回転させ
ながら上記セラミックス基材から成る物品の両面に超電
導体薄膜を形成させ、上記超電導体薄膜の焼結最適温度
で焼き付けて超電導体薄膜の配線を形成し、ついで基板
を上記セラミックスの両面に接着剤を用いて加熱・圧着
することにより多層化したことを特徴とする。As a result of extensive research, the method and device for manufacturing a multilayer wiring board according to the present invention was developed by degreasing an article made of a ceramic base material by a conventional method, pasting a metal foil with a desired pattern on it, and removing the hook from the device. The hook is rotated to form a superconductor thin film on both sides of the article made of the ceramic base material, and is baked at the optimal temperature for sintering the superconductor thin film to form wiring of the superconductor thin film. The present invention is characterized in that the substrate is made into a multi-layered structure by heating and press-bonding both sides of the ceramic with an adhesive.
この発明においてに、配線に超電導体薄膜を活用してい
るので、電気的な損失がなく、又ジュール熱によるパタ
ーンの断線がない。In this invention, since a superconductor thin film is utilized for the wiring, there is no electrical loss and there is no disconnection of the pattern due to Joule heat.
以下において実施例を掲げ、この発明を更に詳しく説明
する。The present invention will be described in more detail below with reference to Examples.
第１図はこの発明による多層配線基板の一実施例の断面
を示す図である。図において、 ｔｌｌＨセラミックス
素材、（２）は超電導体薄膜の配線、（３）は接着剤、
（４）は基板である。FIG. 1 is a cross-sectional view of an embodiment of a multilayer wiring board according to the present invention. In the figure, tllH ceramic material, (2) superconductor thin film wiring, (3) adhesive,
(4) is a substrate.
なお、超電導体薄膜とは酸化物系（例えばＬａ −Ｓｒ
Ｃｕ−０系又はＹ−Ｂａ−Ｃｕ−０系）や有機物系が
知られている。Note that the superconductor thin film is an oxide-based film (for example, La-Sr
Cu-0 type or Y-Ba-Cu-0 type) and organic type are known.
第２図はこの発明による多層配線基板の製造工程の一例
を示したものでおり、以下にこの工程を概説する。FIG. 2 shows an example of a process for manufacturing a multilayer wiring board according to the present invention, and this process will be outlined below.
セラミックス素材（１）は洗浄（ロ）され、所要パター
ン（６）全形成した金属箔（５）ヲ張り付け、ついで超
電導体薄膜を第４図に示す装置で形成するのである。The ceramic material (1) is cleaned (b), a metal foil (5) completely formed with the required pattern (6) is pasted on it, and then a superconductor thin film is formed using the apparatus shown in FIG.
次いで超電導体薄膜の焼結最適温度で焼き付けて超電導
体薄膜の配線が形成される。Next, the superconductor thin film is baked at the optimal sintering temperature to form superconductor thin film wiring.
ついで、基板（４）を上記セラミックスの両面に接着剤
（３）を用いて加熱・圧着して接着するのである。Next, the substrate (4) is bonded to both surfaces of the ceramic by heating and pressing the adhesive (3).
第３図は所要パターンを形成した金属系の箔の一実施例
であり、（６）はパターン配線、 ＋７１１ｄ金属箔で
ある。FIG. 3 shows an example of a metal foil on which a required pattern is formed, and (6) is a pattern wiring and +711d metal foil.
第４図は多層配線基板の製造装置の一例を示すものでら
り２図において、（８）は引掛は具、（９）は駆動モー
ター、 ＱＯＩは溶液状の超電導体α４１ヲセラミツク
ス素材（１）表面に塗布するスプレーガン、α１１は容
器、α３は攪拌装置、αＪは流路、圓は溶液状の超電導
体、α９はエアーである。Figure 4 shows an example of a multilayer wiring board manufacturing equipment. ) A spray gun for coating the surface, α11 is a container, α3 is a stirring device, αJ is a flow path, circle is a superconductor in solution form, and α9 is air.
ついで基板（４）全上記セラミックス（１）の両面に接
着剤（３）をはさんで加熱・圧着により積層すれば多層
配線基板となるのである。Then, a multilayer wiring board is obtained by laminating the substrate (4) with adhesive (3) on both sides of the ceramic (1) by heating and pressing.
以上説明したように、この発明によればセラミックス表
面に導電性が良好で、しかも均一性の良好な薄膜が得ら
れる。As explained above, according to the present invention, a thin film with good conductivity and good uniformity can be obtained on the ceramic surface.
従って、コンピューター関係の配線に広く応用されると
確信する。Therefore, we are confident that it will be widely applied to computer-related wiring.
第１図はこの発明による一実施例を示す図、第２図はこ
の発明による多層配線基板の製造工程の一実施例を示す
図、第３図、第４図はこの発明による多層配線基板の製
造装置の一実施例を示す図である。
図中、（１１は素材、（２）は超電導体薄膜の配線、（
３）は接着剤、（４）は基板、（５）はパターンを形成
した金属箔、（６）はパターン配線、 （７１Ｆｉ金属
箔、（８）は引掛は具、（９）は駆動モーター、αＧは
スプレーガン、 （Ｉｌｌは容器、α２は攪拌装置、０
３は流路、０滲は溶液状の超電導体、叩はエアーである
。
なお９図中同一あるいは相当部分には同一符号を付して
示しである。FIG. 1 shows an embodiment of the invention, FIG. 2 shows an embodiment of the manufacturing process of a multilayer wiring board according to the invention, and FIGS. 3 and 4 show an embodiment of the multilayer wiring board according to the invention. FIG. 1 is a diagram showing an example of a manufacturing apparatus. In the figure, (11 is the material, (2) is the wiring of the superconductor thin film, (
3) is adhesive, (4) is board, (5) is metal foil with pattern, (6) is pattern wiring, (71Fi metal foil, (8) is hook, (9) is drive motor, αG is a spray gun, (Ill is a container, α2 is a stirring device, 0
3 is a flow path, 0 is a solution-like superconductor, and blow is air. Note that the same or corresponding parts in FIG. 9 are designated by the same reference numerals.
Claims (4)
要の脱脂した後，上記セラミックスの両外周面に所要パ
ターンを形成した金属系の箔を張り付け，ついで所要の
距離を隔てて，上記セラミックス基材を設置し，溶液状
の超電導体（例えばＬａ−Ｓｒ−Ｃｕ−Ｏ系，又はＹ−
Ｂａ−Ｃｕ−Ｏ系又は有機物系）を上記セラミックス製
の物品表面に吹き付けた後，上記超電導体薄膜の焼結最
適温度で焼付けて超電導体薄膜の配線を形成し，上記超
電導体薄膜の配線を形成したセラミックスと基板（例え
ばガラスエポキシ又はテフロン）との間に接着剤をはさ
んで加熱・圧着することにより上記セラミックスの両面
に基板を接着して積層したことを特徴とする多層配線基
板の製造方法。(1) After degreasing both sides of the ceramic base material in the desired shape, apply metal foil with the required pattern to both outer circumferential surfaces of the ceramic material, and then place the metal foil on the ceramic base material at a required distance. A superconductor in solution form (e.g. La-Sr-Cu-O system or Y-
After spraying Ba-Cu-O type or organic substance type on the surface of the ceramic article, baking it at the optimum temperature for sintering the superconductor thin film to form wiring of the superconductor thin film. Manufacture of a multilayer wiring board characterized in that a substrate is bonded and laminated on both sides of the ceramic by sandwiching an adhesive between the formed ceramic and the substrate (e.g., glass epoxy or Teflon), and heating and pressurizing the substrate. Method.
被覆する間，上記セラミックス製の物品を回転させなが
ら行うことを特徴とする特許請求の範囲第（１）項記載
の多層配線基板の製造方法。(2) A method for manufacturing a multilayer wiring board according to claim (1), characterized in that coating the surface of the ceramic article with a superconductor thin film is carried out while rotating the ceramic article. .
電導体を攪拌混合する攪拌装置と，吹付け装置と，溶液
状の超電導体を吹付け装置へ供給する手段と，吹付け装
置と所要の距離を隔てて設置した引掛け具と，上記引掛
け具を回転させる駆動部とで構成したことを特徴とする
多層配線基板の製造装置。(3) A container for storing the superconductor in solution form, a stirring device for stirring and mixing the superconductor in solution form, a spraying device, a means for supplying the superconductor in solution form to the spraying device, and a spraying device. 1. An apparatus for manufacturing a multilayer wiring board, comprising: a hook installed at a required distance from a user; and a drive unit that rotates the hook.
ウム又はアルミニウム合金，ステンレス鋼，銅又は銅合
金，チタニウム又はチタニウム合金，ニッケル又はニッ
ケル合金，コパール等の金属をフォトエッチングプロセ
スにより形成したことを特徴とする特許請求の範囲第（
３）項記載の多層配線基板の製造装置。(4) The metal foil on which the required pattern has been formed is made of metal such as aluminum or aluminum alloy, stainless steel, copper or copper alloy, titanium or titanium alloy, nickel or nickel alloy, copal, etc. by photo-etching process. Characteristic Claim No. (
3) The multilayer wiring board manufacturing apparatus described in item 3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62306206A JPH01146394A (en) | 1987-12-03 | 1987-12-03 | Method and device for manufacturing multilayer interconnection substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62306206A JPH01146394A (en) | 1987-12-03 | 1987-12-03 | Method and device for manufacturing multilayer interconnection substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01146394A true JPH01146394A (en) | 1989-06-08 |
Family
ID=17954270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62306206A Pending JPH01146394A (en) | 1987-12-03 | 1987-12-03 | Method and device for manufacturing multilayer interconnection substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01146394A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5675446A (en) * | 1992-03-30 | 1997-10-07 | Fujitsu Limited | Method of controlling magnetic disk unit based on version data |
| KR100677194B1 (en) * | 2000-01-22 | 2007-02-05 | 엘지전자 주식회사 | Multi Level Video Signal Generator |
-
1987
- 1987-12-03 JP JP62306206A patent/JPH01146394A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5675446A (en) * | 1992-03-30 | 1997-10-07 | Fujitsu Limited | Method of controlling magnetic disk unit based on version data |
| KR100677194B1 (en) * | 2000-01-22 | 2007-02-05 | 엘지전자 주식회사 | Multi Level Video Signal Generator |
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