JPH01144698A - Method and apparatus for manufacturing hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To prevent surfaced electronic parts from coming off in soldering without fixing the surfaced electronic parts with an adhesive or the like, by equipping a shielding plate having openings opposed to the parts to be soldered of a circuit board to cause molten solder to pass therethrough when soldering lead wires projecting from the circuit board with jetted solder. CONSTITUTION:A shielding plate 16 of stainless steel or the like is equipped with openings 17 according to the position and shape of the portions projecting from the lower surface of a circuit board 11, for example the tip 113 of the lead wire of electronic parts 112 with lead wire surfaced on the upper surface of the board 11. Therefore, molten solder 131 jetted from a solder jet tank 13 may lash only to the tip 113 of the lead wire for soldering without lashing to chip-shaped electronic parts 111 when the board 11 passes above the solder tank 13. This prevents the molten solder 131 from sticking to the parts 111. With a narrow gap between the shielding plate 16 and the board 11, the shielding plate 16 and the circuit board 111 oppose each other, so that the the soldered portion of the electronic parts 111 does not melt because of the insulation effect of the air in the gap.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method and apparatus for manufacturing a hybrid integrated circuit device, and in particular, to a circuit board with surface-mounted electronic components on one side and leads on the other side. The present invention relates to a method and apparatus for manufacturing a hybrid integrated circuit device in which wired electronic components are individually soldered.

′ [Prior Art] Hybrid integrated circuit devices generally have i! ! Necessary active and passive electronic components are soldered onto the circuit board on which the 1ili line pattern is formed to form an electric circuit. The electronic components to be soldered onto the circuit board are, as shown in FIG. The circuit board is roughly divided into so-called electronic components with lead wires 3, which are passed through the through-holes provided here and soldered from the opposite side of the circuit board. Ru.

Conventionally, when these electrical components are soldered onto a circuit board made of glass epoxy resin or ceramic, the surface-mounted electronic components are soldered using the solder reflow method using paste solder, or the inserted components are soldered together. For some electronic components with lead wires, a solder flow method using jet soldering is generally used. Specifically, after a chip-type electronic component, which is a square-mounted electronic component, is soldered to the back of the circuit board using the solder reflow method, the lead wire of the electronic component with a lead wire, which is an inserted component, is connected to the circuit board. Insert it into the through-hole of the board and solder using a jet solder flow.

[Problems to be Solved by the Invention] However, in the conventional method, jet soldering
When soldering the lead wires of electronic components with lead wires, fix the surface-mounted electronic components to the surface of the circuit board! There is a problem in that the solder flowing thereon melts due to the heat of the jet solder hitting the solder, and as a result, the surface-mounted electronic component falls off.

On the other hand, in order to prevent such falling off, as shown in FIG.
It has been proposed to fix and then solder the inserts by a solder flow method. However, such a method has the following problems. That is, 1) The number of man-hours increases because all surface-mounted electronic components on the circuit board are bonded, and production costs increase because thermosetting or ultraviolet curing adhesives are expensive. 2) Thermal expansion of the resin adhesive causes stress on the soldered parts of electrical components!
, the reliability of the circuit board decreases due to occurrence of cracks, etc.

3) Due to variations in the amount and position of the resin applied, electrical components are fixed in a floating state, resulting in soldering defects, and the soldering surface is coated with resin, making visual inspection impossible. 4) It becomes extremely difficult to replace or modify surface-mounted electronic components once fixed with a thermosetting or ultraviolet curable adhesive. 5) - Since the surface-mounted electronic component once attached comes into contact with the molten solder again, the reliability of the soldering part decreases.

Therefore, in view of the problems in the prior art described above, the present invention prevents the surface-mounted electronic component from falling off when the surface-mounted electronic component is soldered by the solder flow of the inserted component without fixing the surface-mounted electronic component with resin or the like. An object of the present invention is to provide a method for manufacturing a hybrid integrated circuit device and an apparatus therefor.

[Means for Solving the Problem] The object of the present invention is to provide a hybrid integrated circuit device in which a surface-mounted electronic component is soldered to one side of a circuit board, and an electronic component with lead wires is soldered to the other side. In the manufacturing method, an electronic component with a bottom surface is soldered on the one surface of the circuit board,
A lead wire is inserted into a through hole provided in the circuit board, an electronic component with a lead wire is mounted on the other side of the circuit board, and the one side of the circuit board is directed downward, and the By arranging a shielding plate with an opening corresponding to the part to be soldered on one side and passing it through a jet soldering tank in the working state, the lead wires of electronic components with lead wires can be passed through the opening of the shielding plate. This is achieved by the method for manufacturing a hybrid integrated circuit device according to the first invention, characterized in that the tip is soldered to a circuit board.

Furthermore, the above-mentioned object is to provide an apparatus for manufacturing a hybrid integrated circuit device in which a surface-mounted electronic component is soldered to one side of a circuit board and an electronic component with a lead wire is soldered to the other surface, in which molten solder is directed upward. A surface-mounted electronic component is soldered on the one surface of the circuit board, and a lead wire is inserted into the through hole of the circuit board, and a lump on the other surface is connected to the solder flow means. means for holding the circuit board with electronic components mounted thereon with the one surface facing downward and passing it through so as to come into contact with a jet surface of molten solder of the molten solder jet device;
Said soldering of a circuit board includes means for running a shielding plate having a partial opening corresponding to said portion at least directly above said molten solder jet device and directly below said circuit board. This is achieved by a manufacturing apparatus for a hybrid integrated circuit device according to the second aspect of the invention.

[Function] According to the above invention, first, a surface-mounted electronic component is soldered onto one surface of a circuit board, and then when the lead wires protruding from that surface are soldered from here using jet solder, the circuit board is soldered. During soldering, the molten solder comes into contact with the board surface of the circuit board through the openings made in the shield plate corresponding to the parts, and the other parts are prevented from coming into contact with the molten solder by the shield plate. .

Therefore, only predetermined portions are soldered. The molten solder adheres to the surface-mounted electronic components that are shielded by the shielding plate, and the solder joints are melted due to the insulation and heat dissipation effect of the shielding plate and the air above it. Never. Therefore, it is possible to prevent the surface-mounted electronic component from falling off by simply soldering it in advance, without having to fix the surface-mounted electronic component with a resin adhesive or the like.

[Examples] Hereinafter, examples of the present invention will be described with reference to the attached drawings.
I will explain.

In the manufacturing apparatus shown in FIG. 1, a conveyor device 10 is provided as means for conveying the circuit board 11. This conveyor device 10 horizontally supports the circuit board 11 through its hook 12'G, and gradually moves in the direction of the arrow in the figure. Chip-type electronic components 111 such as surface-mounted electronic components such as semiconductor chips, tantalum solid electrolytic capacitors, and chemical capacitors are soldered on one surface (lower surface in the figure) of the circuit board 11 of B, and the other surface On the surface (upper side in the figure), insert the lead wire into the through hole provided in advance on the board 11, and insert the electronic component 1 with the lead wire.
12 is installed.

A jet solder tank 1:3 is provided in the middle of the conveyor device 10 as a means for jetting molten solder, and the circuit boards 11 that are sequentially conveyed by the conveyor device 10 are
When passing over the jet solder tank 13, the molten solder gushes out from below and comes into contact with the lower surface of the circuit board 11.

Furthermore, the population of the conveyor device 10 and the jet solder tank 1
3, an electric heater 14 for preheating the substrate 11
is provided.

Generally speaking, a second conveyor device 15 is provided between the conveyor device 10 and the jet solder tank 13 as means for supplying the shielding plate 16. It runs in parallel under the first conveyor device 10 in a part of the travel route, and in this parallel travel section, the attached shielding plate 16 is passed through the board 11 conveyed by the second conveyor device 10. Synchronize with and send directly below it in the same direction at the same speed.

The shielding plate 16 is made of a heat resistant material such as a stainless steel plate or the like.
It is made of a plate that is resistant to corrosion and has poor solder wettability. This shielding plate 16 has a t
Here, the soldering set on the upper surface of the circuit board 11 in the figure is a portion, for example, a portion where the tip portion 113 of the lead wire of the electronic component 112 with a lead wire protrudes from the lower surface of the board 11. An opening 17 is formed in accordance with the position and shape of. Therefore, as shown in the figure, the circuit board 11
When passing over the jet solder tank 13, the stainless steel shielding plate 16 prevents the molten solder 131 jetted from the jet solder tank 13 from being applied to the chip-type electronics mounted on the lower surface of the substrate 11 with solder. The tip portion 113 of the lead wire of the electronic component 112 with lead wire does not contact the component 111.
Contact is made only here and soldering is performed at that part. Therefore, the molten solder 131 is applied to the chip type electronic component 111.
Do not come into contact with. Further, the shielding plate 16 faces the circuit board 11 with a slight gap between the shielding plate 16 and the chip-type electronic component 111, which is a surface-mounted electronic component. The solder joints of the electronic component 111 are not melted. Therefore, there is no need to roughly fix the surface-mounted electronic component with a resin adhesive or the like, and the flow soldering does not sometimes fall off.

In the embodiment described above, the opening 17 formed in the shielding plate 16
includes a tapered peripheral portion 161 extending downward.
This prevents the molten solder from flowing to the upper surface side of the shielding plate 16 when passing over the solder jet 131, and at the same time prevents the molten solder from flowing to the peripheral area. This is done to prevent the liquid from flowing out and remaining on the shielding plate 16. In general, in the embodiment described above, the conveyor device 10 is used to enable continuous flow soldering bonding, and this method is suitable for mass production of relatively large boards. In addition, in the case of changing the circuit board to be produced, the shielding plate attached to the second conveyor device 15 can be easily changed by replacing the shielding plate attached to the second conveyor device 15 with another shielding plate that matches the circuit board to be produced. is clear.

Next, FIG. 3 shows another embodiment of the present invention. In this embodiment, conventional flow soldering can be used as is without requiring any major modification of the equipment, and soldering can be performed using a jig 24 equipped with a shield plate 20 made of stainless steel prepared in advance. It is an object. That is, as shown in FIG. 3, this jig 24 has lead wires placed on the upper surface of the circuit board 11 in the same way as the shielding plate 16 of the embodiment shown in FIG. A portion of the electronic component 112 in which the tip of the lead wire protrudes from the lower surface of the substrate 11;
That is, an opening 22 is formed to match the shape of the part that requires soldering.

A method of soldering using such a jig 24 will be described below. First, in the same way as above, the circuit board 1
A chip-type electronic component 111, which is a surface-mounted electronic component, is soldered on one surface (lower surface when looking at the centroid) of 1, and its lead wire is inserted into the through hole, and soldered on the other surface ( An electronic component 112 with a lead wire is attached to the upper side in the figure. Next, this circuit board 11 is mounted on the jig 24 with the surface from which the tips of the lead wires of the electronic component 112 with lead wires protruding facing downward.

Thereafter, the jig 24 is attached to the holder 23 of the conveyor of the soldering device, moved, and passed directly above the jet solder tank to perform soldering.

As mentioned above, this method of special effects requires no modification of the conventional soldering equipment, and since it is a jig method, it can be performed at low cost, and it is easy to convert the type of circuit board. It is particularly suitable for high-mix, low-volume production.

[Effects of the Invention] As is clear from the above description, the present invention prevents the surface-mounted electronic component from falling off during soldering without fixing the surface-mounted electronic component with a resin adhesive or the like. This makes it possible to provide a method and apparatus for manufacturing a hybrid integrated circuit device that can achieve high productivity.

[Brief explanation of the drawing]

FIG. 1 shows an embodiment of the invention? 2 is an explanatory diagram for explaining the shielding-like function in the jet solder bath shown in FIG. 3; FIG. 3 is a schematic diagram of a manufacturing apparatus for manufacturing an integrated circuit device; FIG. 3 is an illustration of another embodiment of the present invention; FIG. FIG. 4 is a schematic diagram of a manufacturing apparatus for a hybrid integrated circuit device for explaining the prior art, and FIG. 4 is a perspective view of the hybrid integrated circuit device for explaining the prior art. 10... Conveyor device 11... Circuit board 111
...Electronic component with surface 112...Electronic component with lead wire 13...-Jet solder bath 16.20...-Stainless steel shielding plate 17.22...Opening 24...Jig patent publication order Person: Taiyo Yuden Co., Ltd. Agent Person: Patent attorney Kazuyoshi Hojo Procedural amendment form) June 7, 1985 1. Indication of the case 1988 Patent Application No. 304025 2) Name of the invention Hybrid integrated circuit device The manufacturing method and its device 3, and its relationship to the case of the person making the amendment Patent applicant address: Mr. 6-16-20 Ueno, Taito-ku, Tokyo
Taiyo Yuden Co., Ltd.
Company 4, Agent Address: 3-3-40 Gokenmachi, Mito City, Tanjo Prefecture 6, Application subject to amendment (title of invention) and drawings (Figure 4 added) 7, Contents of amendment Figure 4

Claims (5)

[Claims] (1) In a method for manufacturing a hybrid integrated circuit device in which surface-mounted electronic components are soldered to one surface of a circuit board and electronic components with lead wires are soldered to the other surface, Solder the surface-mounted electronic components, insert the lead wires into the through holes provided on the circuit board, and place them on the other side of the circuit board.
Mount the electronic components with lead wires, turn the one side of the circuit board downward, place a shielding plate directly below this with an opening corresponding to the part to be soldered on the one side, and in this state. 1. A method of manufacturing a hybrid integrated circuit device, which comprises soldering the tip of a lead wire of an electronic component with a lead wire to a circuit board through an opening in the shielding plate by passing through a jet solder tank. (2) The method of manufacturing a hybrid integrated circuit device according to claim 1, wherein the opening of the shielding plate has a tapered peripheral portion extending downward. (3) In a manufacturing device for a hybrid integrated circuit device in which surface-mounted electronic components are soldered to one side of a circuit board and electronic components with lead wires are soldered to the other side, molten solder is spouted upward. A surface-mounted electronic component is soldered onto the solder flow means and the one surface of the circuit board, and a lead wire is inserted into the through hole of the circuit board, and the electronic component with the lead wire is mounted on the other surface. means for holding said circuit board with said one surface facing downward and passing it through so as to come into contact with a jet surface of molten solder of said molten solder jet device; and a portion of said circuit board corresponding to said soldered portion. 1. An apparatus for manufacturing a hybrid integrated circuit device, comprising means for causing a shielding plate having an opening to run in a state where it is positioned at least directly above the molten solder jet device and directly below the circuit board. (4) The apparatus for manufacturing a hybrid integrated circuit device according to claim 3, wherein the opening of the shielding plate has a tapered peripheral portion extending downward. (5) The apparatus for manufacturing a hybrid integrated circuit device according to claim 3, wherein the means for holding the circuit board and soldering it in contact with the molten jet solder is a conveyor device.