JPH01136791A - Ic module and ic card - Google Patents

Abstract

PURPOSE: To prevent an adhesive for bonding and IC module from flowing toward the external terminal side by conducting the external terminal with a pattern layer through conductive plating formed on the inner surface of a through hole penetrating a substrate and then enclosing the end part of the through hole on the side of basic material of card. CONSTITUTION: A copper toil for an external terminal 13 is applied to one side of a substrate 12 to produce a laminate and then through holes 14 are drilled therein. An adhesive sheet 12a having an opening slightly larger than the through hole 14 is then applied to the other side of the substrate 12 at same position as the through hole 14 and laminated with a copper foil for pattern layer 15. Subsequently, the inner surface of the through hole 14 is subjected to conductive plating 14a in order to conduct the external terminal 13 with the pattern layer 15. Since one end of the through hole 14 is enclosed by the pattern layer 15, an adhesive 24 does not flow into the through hole 14 and to flow out toward the external terminal 13 side when a thermal adhesion sheet 24 is set on the bottom face in the recess 25b of the basic material of card 20 and an IC module 11 is fitted in the recess 25.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to an IC module and an IC card equipped with the IC module.

(Prior Art) In recent years, cards called chip cards, memory cards, microcomputer cards, or electronic cards (hereinafter simply referred to as I/O cards) equipped with IC chips such as microcomputers and memory
A variety of research is underway regarding the C-card.

Compared to conventional magnetic cards, such IC cards have
Because of its large storage capacity, banks are considering using it to store the history of deposits and savings in place of passbooks, and credit cards can store transaction history such as shopping.

This kind of IC card is an IC equipped with an IC chip.
It consists of a module and a card base material having four parts for mounting the IC module.

Further, the IC module is formed by providing external terminals on one surface of a substrate, providing a pattern layer and an IC chip on the other surface of the substrate, and molding the periphery of the IC chip and wiring portion with resin. Since the resin molding is performed to cover approximately the center portion of the substrate, the IC module as a whole has a convex cross section.

Furthermore, a plurality of through holes are formed in the parts of the board that are not resin molded, and conductive plating (for example, Cu plating + Ni plating + Au) is formed on the inner surface of the through holes.
conduction between the external terminal and the pattern layer.

Next, a method of mounting the IC module onto the card base material will be explained.

First, an adhesive is applied or a heat-adhesive sheet is placed in the recess of the card base, and then the IC module is inserted into the recess with the pattern layer facing the card base. Subsequently, the IC module is pressed against the card base material, and the IC module is attached and fixed to the card base material.

(Problems to be Solved by the Invention) As described above, a plurality of through holes are formed in a conventional board, and the external terminal and the pattern layer are electrically connected by conductive plating formed on the inner surface of the through holes. .

This through hole is formed as follows.

That is, an external terminal is provided on one side of the board, a pattern layer is provided on the other side, a laminate of the external terminal, the board, and the pattern layer is formed, and a through hole is provided through this laminate. .

However, if a through hole is provided through the laminate of the external terminal, substrate, and pattern layer in this way, when the IC module is attached and fixed to the card base material, the adhesive in the recessed part of the card base material may pass through the pattern layer. It may leak out to the external terminal side through the hole.

If the adhesive flows out to the external terminal side in this way, there is not only a problem with the appearance, but also a problem of poor contact between the external terminal and the terminal on the machine used when the IC card is used.

The present invention has been made in consideration of these points,
To provide an IC card in which adhesive for mounting an IC module does not leak out to an external terminal side.

[Structure of the invention]

(Means for Solving the Problems) The present invention provides an external terminal on one side of a substrate, a pattern layer and an IC chip on the other side of the substrate,
In an IC module in which the periphery of a C chip and a wiring part is molded with resin, conduction is established between the external terminal and the pattern layer via a conductive plating formed on the inner surface of a through hole penetrating the substrate, An IC module characterized in that one end of the through hole is sealed by the pattern layer, and an IC module, wherein an external terminal is provided on one surface of the substrate, a pattern layer and an IC chip are provided on the other surface of the substrate, An IC module formed by resin-molding the periphery of a chip and a wiring part, a card base material provided with a recess into which the IC module is mounted, and an adhesive layer provided in the recess for adhesively fixing the IC module. The external terminal and the pattern layer are electrically connected through conductive plating formed on the inner surface of the through hole penetrating the substrate, and the end of the through hole on the card base material side is sealed. This is an IC card with special features.

(Function) Since the end of the through hole on the card base side is sealed, when the IC module is installed in the recess, the adhesive will not enter the through hole and flow out to the external terminal side. There isn't.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

FIG. 1 shows an EC module 11 and an IC according to the present invention.
2 is a side cross-sectional view showing one embodiment of the card 10, FIG. 2 is an enlarged view of section A in FIG. 1, and FIG. 3 is a diagram showing a method of manufacturing an IC module.

In FIG. 1, an external terminal 13 is provided on one surface of a substrate 12 made of a material with excellent flexibility and strength (e.g., glass epoxy, glass BT resin, polyimide, etc.), and a pattern layer 15 is provided on the other surface. It is provided.

Both the external terminal 13 and the pattern layer 15 are formed by plating copper foil, plating nickel, and plating gold.

Further, an IC chip 17 is mounted on the other surface of the substrate 12, and after necessary wiring is performed between the pattern layer 15 and the matrix bonding wire 18, the periphery of the wiring portion including the IC chip 17 and the bonding wire 18 is A resin molded portion 19 is formed by resin molding with a molding resin.

In this case, the resin molding is preferably performed by a transfer molding method, and the dimensions and shape of the molded resin are appropriately determined according to the IC chip 17 and the card base material 20 described later. Further, the thickness of the resin molded portion 19 is smaller than the depth of the second and fourth portions described later.

Further, a protective resist layer 16 is provided around the periphery of the resin molded portion 19 on the pattern layer 15.

Furthermore, as shown in FIG.
A plurality of through holes 14 are formed through the through hole 2, and a conductive plating 14a is formed on the inner surface of the through hole 14 to make the external terminal 13 and the pattern layer 15 conductive. The through hole 14 does not penetrate the pattern layer 15, so one end of the through hole 14 is sealed by the pattern layer 15.

The IC module 11 having such a configuration has a convex cross section as a whole.

The method for manufacturing the IC card of the present invention includes: (1) embedding the IC module and forming the card base material at the same time using a press lamination method; A method of cutting the four parts with an engraving machine, etc., and burying and fixing the IC module in the formed recess. ■ A dummy module with the same shape as the IC module is buried at the same time using the press lamination method, and this is removed to form a recess for embedding. A method for embedding and fixing an IC module in a card board, and ■
There is a method in which a card substrate and a recess for embedding are simultaneously formed by an injection method, and an IC module is embedded and fixed therein.

In the present invention, any of the above methods can be employed. Hereinafter, an example of manufacturing by the method (2) above will be explained.

First, sheets 21 and 22 having openings to fit into an IC module, and sheet 23 having no openings.
Prepare. In this case, the sheet 23 becomes an oversheet on the back side of the card.

Therefore, by forming the sheet 23 with an opaque material, it is possible to prevent the IC module 11 from appearing on the back side of the card base material 20, thereby improving the design value of the IC card. It is excellent. Further, this sheet 23 can be freely printed or otherwise printed.

Next, a dummy module (not shown) having the same shape as the IC module to be buried is laminated together with the sheet.
Press laminate. Remove the dummy module and
A card base material 20 is obtained in which a first four part 25a and a second four part 25b for embedding an IC module are formed. In this case, the depth of the second recess 25b is determined depending on whether a space will be created between the resin mold part 19 of the IC module 11 and the second recess 25b when the IC module 11 is buried in a later process.
Alternatively, it is important that the depth is such that they fit together in a contact or non-contact state.

Other processing methods for obtaining such card base materials include, for example, preprinted chemical cards (
A card base material) is produced by a press lamination method, and then a hole for embedding the IC module 11 is cut in a predetermined position using an end mill, drill, engraving machine, etc.
A method of making the card embedding section 25 may be used.

Furthermore, in addition to this, an injection method or the like may be used as appropriate. When using the injection method, ABS resin, polyester, polypropylene, styrene resin, etc. can be preferably used as the resin for forming the card base material. In addition, when a processing method other than the injection method is employed, vinyl chloride, acrylic, polycarbonate, polyester, vinyl chloride/vinyl acetate copolymer, etc. can be preferably used.

Note that the first and second four parts 25 formed on the card base material
is preferably equal to or slightly larger than the IC module 11 (approximately 0.05 to 0.11) so that the IC module 11 to be buried can be easily inserted.

Further, in the above example, the card base material 20 is constituted by a laminate of a plurality of sheets, but of course, the card base material 20 can also be constituted by two base materials.

Next, an adhesive layer 24 is provided on the bottom surface of the first recess 25b formed in the card base material 20 as shown in the figure, the IC module 11 is inserted, and the surface of the external terminal 13 is sealed using a hot stamper (not shown). Localized heat pressing (for example,
The IC module 11 is fixed in the card base material 20 to obtain the IC card 10. In this case, the adhesive layer 24 can be formed of, for example, a double-sided adhesive tape made of a nonwoven fabric coated with an acrylic adhesive on both sides, or a room-temperature curing urethane adhesive. Furthermore, in order to obtain stronger adhesion, for example, a polyester-based thermal adhesive sheet is also preferably used.

Thermal pressing using the above-mentioned hot stamp bar is necessary when such a thermal adhesive sheet is used, and when using a normal adhesive, room temperature pressing is also possible.

Note that the recessed portion 25 is formed in the card base material 20 created by printing, Mg striping, or the like.

The method for manufacturing the IC card will be described in detail below.

First, the method for manufacturing the IC module 11 will be explained in FIGS. 3a to 3.
This will be explained using diagram f.

As shown in FIG. 3a, a copper foil for external terminals 13 is pasted on one side of the board 12, and then, as shown in FIG. performs processing. Next, as shown in FIG. 3C, an adhesive sheet 12a having an opening slightly larger in diameter than the through hole 14 at the same position as the through hole 14 is pasted on the other surface of the substrate 12, and a pattern layer is placed on the adhesive sheet 12a. No. 15 steel foils were laminated and bonded together using a heat press (not shown).

Next, as shown in FIG. 3d, a conductive plating 14a made of electroless copper plating and electrolytic copper plating is formed on the inner surface of the through hole 14 to establish electrical continuity between the external terminal 13 and the pattern layer 15.

Next, as shown in FIG. 3e, a resist film (not shown) is applied to the copper foils for the external terminals 13 and the pattern layer 15 bonded to both sides of the substrate 12, and pattern exposure is performed on these copper foils. . Thereafter, both surfaces of the substrate 12 are exposed and etched, and resist film is removed to obtain external terminals 13 and pattern layers 15 patterned on both surfaces of the substrate 12.

Next, the external terminals 13 and pattern layer 15 are electrolytically plated with nickel. Further, the surface on the external terminal 13 side is masked with a resist film (not shown), soft gold plating is applied, and the resist film on the surface on the external terminal 13 side is peeled off. Next, the surface on the pattern layer 15 side is covered with a resist film (
(not shown), hard gold plating is applied, and the resist film on the pattern layer 15 side is peeled off.

Next, as shown in FIG. 3F, a protective resist layer 16 is formed on the pattern layer 15 at a position corresponding to the periphery of the resin mold part by solder resist printing.

Next, a tC chip 17 is placed on the surface of the substrate 12 on the pattern layer 15 side.
bonding wire 1 between the pattern layer 15 and the pattern layer 15.
Perform the necessary wiring according to step 8. Subsequently, the periphery of the wiring section including the IC chip 17 and the bonding wires 18 is resin-molded with a molding resin by transfer molding to form a resin mold section 19.

Next, a polyester thermal adhesive sheet 24 is placed on the bottom surface of the first four parts of the card base material 20, and the IC module 11 is inserted into the four parts 25. Subsequently, pressure and heat are applied only to the IC module 11, and the IC module 11 is mounted in the recess 25 to create an IC card]0.

In this case, since one end of the through hole 14 is sealed by the pattern layer 15, the IC
When installing the module 11, remove the adhesive 2 on the bottom of the first recess.
4 does not enter the through hole 14 and leak out to the external terminal 13 side. In this way, the adhesive 24 is applied to the external terminal 1.
Since the IC card 10 does not leak to the third side, the appearance of the IC card 10 is not impaired, and poor contact of the external terminals 13 can be prevented.

〔Effect of the invention〕

As explained above, according to the present invention, since the adhesive provided in the recess does not flow out to the external terminal side, the IC
It is possible to prevent poor contact of external terminals without spoiling the overall appearance of the card.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an embodiment of an IC module and an IC card according to the present invention, FIG. 2 is an enlarged view of part A in FIG. 1, and FIGS. 3a to 3f are a method for manufacturing an IC module. FIG. 10...tC card, 11...IC module, 1
2... Substrate, 13... External terminal, 14... Through hole, 14a... Conductive plating, 15... Pattern layer, 17... IC chip, 18... Bonding wire, 19... ... Resin mold part, 20... Card base material, 24... Adhesive layer, 25... Four parts.

Claims (3)

[Claims] 1. In an IC module, an external terminal is provided on one surface of a substrate, a pattern layer and an IC chip are provided on the other surface of the substrate, and the periphery of the IC chip and wiring section is molded with resin. What is claimed is: 1. An IC module, characterized in that the pattern layer is electrically connected to the pattern layer through conductive plating formed on the inner surface of the through hole penetrating the substrate, and one end of the through hole is sealed by the pattern layer. 2. An IC module is formed by providing an external terminal on one side of the board, a pattern layer and an IC chip on the other side of the board, and resin molding around the IC chip and the wiring part, and this IC module is installed. an inner surface of a through-hole passing through the substrate between the external terminal and the pattern layer; An IC card characterized in that conduction is established through conductive plating formed on the through hole, and an end portion of the through hole on the card base material side is sealed. 3. 3. The IC card according to claim 2, wherein the end of the through hole on the card base material side is sealed by a pattern layer.