JPH01133746U - - Google Patents
Info
- Publication number
- JPH01133746U JPH01133746U JP2956388U JP2956388U JPH01133746U JP H01133746 U JPH01133746 U JP H01133746U JP 2956388 U JP2956388 U JP 2956388U JP 2956388 U JP2956388 U JP 2956388U JP H01133746 U JPH01133746 U JP H01133746U
- Authority
- JP
- Japan
- Prior art keywords
- mounting surface
- external lead
- package
- semiconductor device
- bent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は、この考案の一実施例による半導体装
置の正面図、第２図は、従来の半導体装置の正面
図である。
図において、１はパツケージ、２は外部リード
、３は取付基板。なお、図中、同一符号は同一、
又は相当部分を示す。
FIG. 1 is a front view of a semiconductor device according to an embodiment of this invention, and FIG. 2 is a front view of a conventional semiconductor device. In the figure, 1 is a package, 2 is an external lead, and 3 is a mounting board. In addition, in the figure, the same reference numerals are the same,
or a corresponding portion.
Claims (1)
に垂直な線に対してパツケージの側に所定の角度
をもつて曲げられて、その外部リードの先端は取
付面に対してほぼ平担にしたことを特徴とする半
導体装置。 The external lead coming out from the side of the package cage is bent at a predetermined angle to the side of the package with respect to a line perpendicular to the mounting surface, and the tip of the external lead is almost flat against the mounting surface. semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2956388U JPH01133746U (en) | 1988-03-04 | 1988-03-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2956388U JPH01133746U (en) | 1988-03-04 | 1988-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01133746U true JPH01133746U (en) | 1989-09-12 |
Family
ID=31253885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2956388U Pending JPH01133746U (en) | 1988-03-04 | 1988-03-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01133746U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6550906B2 (en) | 2001-01-02 | 2003-04-22 | 3M Innovative Properties Company | Method and apparatus for inkjet printing using UV radiation curable ink |
-
1988
- 1988-03-04 JP JP2956388U patent/JPH01133746U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6550906B2 (en) | 2001-01-02 | 2003-04-22 | 3M Innovative Properties Company | Method and apparatus for inkjet printing using UV radiation curable ink |