JPH01123449A - Lead molding process of semiconductor device - Google Patents

Abstract

PURPOSE:To accelerate the processing speed to increase the yield by a method wherein a pallet loaded with semiconductor devices is carried to mold outer leads. CONSTITUTION:Multiple semiconductor devices 1 are loaded on a pallet 10 which is carried between top and bottom die sets 9 and 5. First, the bottom force die set 5 is lifted up to make a lower cutter 2 pass through a through hole 10a of the pallet 10 for aligning, holding and lifting up the devices 1. Second, the top force die set 9 is lowered to press down an outer lead 1a by a lead stay 7 for holding the leads 1a between an upper cutter 6 and the lower cutter 2. Third, the die set 9 is lifted to release the outer leads 1a from the upper cutter 6 using the lead stay 7. Fourth, the lower die set 5 is lowered to load the devices 1 on the pallet 10 for releasing the lower cutter 2 from the pallet 10. Through these procedures, the processing speed can be accelerated to increase the yield.

Description

[Detailed Description of the Invention] [Industrial Application] The present invention is particularly applicable when molding external leads of a semiconductor device.
The present invention relates to a method of forming a toco lead by bending an external lead into a final product shape.

[Conventional technology]

FIG. 2 is a T cross-sectional view showing, for example, the basic main parts of a conventional lead forming apparatus for a semiconductor device, in which 1 is a semiconductor device, 2 is a lower blade, and 3 is an ejector 1 which is pressed upward by a compression spring 4. Reference numeral 5 designates a knife-shaped die set, which includes these parts, 6 an upper blade, 7 a lead presser pressed against the lower blade by a compression spring 8, and 9 an upper die set.

Next, the operation will be explained. By placing the semiconductor device 1 on the ejector 3 manually or by an external conveyance means (not shown) and lowering the upper die set 9, the external leads 1a of the semiconductor device 1 are pressed down with the lead presser 7, and then the upper blade 6 and bend the external lead l& with the lower blade 2. Then,
By raising the upper die set 9, the external lead 1a of the semiconductor device l is separated from the upper blade 6 by the lead presser 7, and the external lead of the semiconductor device l is separated from the lower blade 2 by the ejector 3. The molding equipment is configured as described above, and since semiconductor devices are supplied to and taken out from the lead molding equipment manually or by a transport device, there is a possibility that the processing capacity will be reduced and the external leads may become clogged due to clogging of the transport rails. There is a risk of damage.

As a result, the yield is lowered, and when a semiconductor device with a damaged external lead is molded, there are problems such as damage to the upper and lower blades ρ.

This invention is intended to solve the above problems.
It is an object of the present invention to provide a lead forming method that can transport external leads of a semiconductor device without damaging them and has high throughput.

[Means for solving problems]

The semiconductor device lead forming method according to the present invention involves mounting semiconductor devices on a pallet capable of locating and storing a plurality of semiconductor devices, transporting each pallet to a lead forming machine, and forming leads.

[Effect]

In the semiconductor device lead forming method according to the present invention, by raising the lower die set, the lower blade passes through the through hole P of the pallet to hold the semiconductor device, is raised from the pallet, and then lowered to the upper die set. By doing so, the external lead is held between the upper and lower blades and the lead is bent twice.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings. 1st
FI! In J, 1.2 and 5 to 9 indicate the same parts as those in FIG. A through hole is drilled in the pallet IO so that the semiconductor device 1 can be moved in and out in the direction of the semiconductor device.

Next, let's talk about its operation. Multiple hP exclusive equipment f
tl is loaded into a pallet) 10, this pallet is transported between the upper F die set 5.9 by an external transport means (not shown), and then the D die set 5 is raised.
The semiconductor device 1 is positioned and held through the lower blade 2 through the through hole 1 of the pallet 10, and then lifted. Further, by lowering the upper die set 9, the lead presser 7 holds down the external leads 1&, and the upper blade 6 and the lower blade 2 pinch and bend the external leads la.

After that, raise the upper die set 9, remove the external lead 1a from the upper blade 6 with the lead presser 7, and then lower the lower die set 5.
Lower the semiconductor device l onto the pallet 10, and lower the lower blade 2.
exits the pallet IO.

In addition, in the above embodiment, the upper F die set was moved up and down without moving the pallet up and down, but the upper die set or the lower die set was fixed, and the pallet and relative T
The die set may be moved up and down.

〔Effect of the invention〕

As described above, according to the present invention, semiconductor devices are mounted on pallets and transported pallet by pallet, and lead forming is performed, thereby speeding up processing capacity and reducing damage to external leads. There are no occurrences, the yield is the same as above, and it can greatly contribute to improving productivity.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a T sectional view showing a conventional semiconductor device molding apparatus. In the figure, 1 is a semiconductor device, 1a is an outer 1jilsI node,
2 is the lower blade, 5 is the lower die set, 6 is the upper blade, 7 is the lead presser, 9 is the upper die set, 1 (N: t pallet, lO
& is a through hole, and lOb is a stand.

Claims (1)

[Claims] In semiconductor device lead molding, in which the external leads of semiconductor devices are bent to form the final product shape, multiple semiconductor devices are positioned and stored, and the lower blade of the molding device can be moved in and out, and the semiconductor devices can be received by the lower blade. , using a pallet with through holes, the semiconductor device is mounted on the stand inside the through hole of this pallet, the lower blade passes through the through hole of the pallet, and the external leads of the semiconductor device are connected to the upper and lower blades of the molding machine. A semiconductor device lead forming method characterized by bending the leads by sandwiching them between the leads.