JPH01119557A - Colored alumina sintered body - Google Patents
Colored alumina sintered bodyInfo
- Publication number
- JPH01119557A JPH01119557A JP62276728A JP27672887A JPH01119557A JP H01119557 A JPH01119557 A JP H01119557A JP 62276728 A JP62276728 A JP 62276728A JP 27672887 A JP27672887 A JP 27672887A JP H01119557 A JPH01119557 A JP H01119557A
- Authority
- JP
- Japan
- Prior art keywords
- alumina
- colorant
- weight
- sintered body
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 title claims abstract description 48
- 239000003086 colorant Substances 0.000 claims abstract description 33
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 15
- 238000005245 sintering Methods 0.000 claims abstract description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 16
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 13
- 239000010937 tungsten Substances 0.000 claims description 13
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 12
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 12
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- 229910004354 OF 20 W Inorganic materials 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 abstract description 15
- 238000000034 method Methods 0.000 abstract description 5
- 230000002542 deteriorative effect Effects 0.000 abstract description 4
- 239000000203 mixture Substances 0.000 abstract description 3
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 abstract 6
- 239000004065 semiconductor Substances 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- 239000011733 molybdenum Substances 0.000 description 14
- 239000000758 substrate Substances 0.000 description 7
- 238000005452 bending Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000009429 electrical wiring Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004993 emission spectroscopy Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Oxide Ceramics (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体集積回路素子を収納する半導体素子収
納用パッケージや半導体S積回路素子が搭載される多層
配線基板等の絶縁基体に用いる着色アルミナ質焼結体に
関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a coloring method for use in insulating substrates such as semiconductor element housing packages that house semiconductor integrated circuit elements and multilayer wiring boards on which semiconductor S integrated circuit elements are mounted. This invention relates to an alumina sintered body.
従来、半導体集積回路素子を収納するパッケージや半導
体集積回路素子が搭載される多層配線基板等は電気絶縁
性に優れたアルミナ(ム/!os)を基体として使用し
、その表面にタングステン(W)、モリブデン(MO)
、マンガン(Mn)等の金属から成る電気配線を施すこ
とによって製作されている。Conventionally, packages that house semiconductor integrated circuit elements and multilayer wiring boards on which semiconductor integrated circuit elements are mounted use alumina (mu/!os), which has excellent electrical insulation, as a base material, and tungsten (W) is coated on the surface. , molybdenum (MO)
It is manufactured by applying electrical wiring made of metal such as , manganese (Mn), etc.
しかし乍ら、半導体集積回路素子をパッケージ等の外部
リード端子と自動ワイヤボンダで接続する際、上記パッ
ケージ等の位置合わせ用ターゲットマークを上記自動機
のセンサーで検知して位置合わせするが、金色のターゲ
ットマークと白色のアルミナの基体との色調のコントラ
ストが弱いため、誤った位置合わせをすることがあった
。However, when connecting a semiconductor integrated circuit element to the external lead terminals of a package, etc. using an automatic wire bonder, the target mark for positioning on the package, etc. is detected and aligned by the sensor of the automatic machine, but the golden target The poor color contrast between the mark and the white alumina substrate sometimes led to incorrect alignment.
そこで、上記従来の欠点を解消するために、アルミナに
チタン(Ti)、銅(Cu)、ニッケル(Niχコバル
ト(Co)、鉄(Fe)、バナジウム(V)、りングス
テン、モリブデン、マンガン等の主として酸化物から成
る着色剤を加え、加湿した水素−窒素混合ガス雰囲気中
で1500〜1600℃の温度で焼成し、着色アル主す
質焼結体を得る方法がとられていた。Therefore, in order to eliminate the above conventional drawbacks, we added titanium (Ti), copper (Cu), nickel (Niχ cobalt (Co), iron (Fe), vanadium (V), phosphorus, molybdenum, manganese, etc. to alumina). A method has been used in which a coloring agent mainly consisting of an oxide is added and fired at a temperature of 1500 to 1600° C. in a humidified hydrogen-nitrogen mixed gas atmosphere to obtain a colored aluminum-based sintered body.
しかし乍ら、上記着色剤を加えて加湿した水素−窒素混
合ガス雰囲気中の焼成にて得られる着色アルミナ質焼結
体は色ムラを生じたり、電気絶縁性や誘電損失等の電気
的諸特性の劣化を引き起こすという問題があった。However, the colored alumina sintered body obtained by adding the above-mentioned coloring agent and firing in a humidified hydrogen-nitrogen mixed gas atmosphere may have uneven color and various electrical properties such as electrical insulation and dielectric loss. There was a problem that it caused deterioration.
そこで、上記欠点を解消するためにアルミナと鉱化剤か
ら成るアルミナ磁器組成物に酸化クロムと該酸化クロム
の等量以下の金属モリブデン及び/又はタングステンと
を含有せしめて着色セラミックスを得ることが特公昭6
1−12868号公報に提案されている。Therefore, in order to eliminate the above-mentioned drawbacks, it is special to obtain colored ceramics by incorporating chromium oxide and metal molybdenum and/or tungsten in an amount equal to or less than the chromium oxide into an alumina porcelain composition consisting of alumina and a mineralizer. Kosho 6
This method is proposed in Japanese Patent No. 1-12868.
〔発明が解決しようとする問題点〕
しかしながら、近時、情報処理装置の高性能化に伴い、
それを構成する半導体素子も高密度化、高集積化が急激
に進み、該半導体素子は作動に際し、大電力を要する結
果、該半導体素子の発熱量が著しく増加している。その
ために、半導体素子収納用パッケージや多層配線基板等
の絶縁基体として前記アルミナ質着色セラ疋ツクスを用
いた場合、該アルミナ質着色セラ疋フクスはその熱伝導
率が17 W/mK 程度と低く放熱が不充分となり
、上記半導体素子を正常かつ安定に作動させることが困
難となる恐れがあり、上記絶縁基体として高い熱伝導率
が望まれている。[Problems to be solved by the invention] However, with the recent improvement in the performance of information processing devices,
Semiconductor elements constituting these devices have rapidly become denser and more highly integrated, and as a result, the semiconductor elements require large amounts of power to operate, resulting in a significant increase in the amount of heat generated by the semiconductor elements. For this reason, when the alumina-based colored ceramics are used as an insulating substrate for semiconductor element storage packages, multilayer wiring boards, etc., the alumina-based colored ceramics has a low thermal conductivity of about 17 W/mK, which dissipates heat. There is a risk that the insulating substrate may have insufficient thermal conductivity, making it difficult to operate the semiconductor element normally and stably.
一方、前記半導体素子収納用パッケージ等はその製造や
半導体素子を実装するに際し、前記自動ワイヤボンダ等
の自動機が使用されており、前記アルミナ質セラミック
スはその曲げ強さbE80klAx”程度と低く、耐チ
ッピング性、耐摩耗性に劣るため高強度化が望まれてい
る。On the other hand, automatic machines such as the automatic wire bonder are used to manufacture the semiconductor element storage package and mount the semiconductor element, and the alumina ceramic has a low bending strength of about 80klAx" and is resistant to chipping. It is desired to have high strength because it has poor hardness and abrasion resistance.
本発明は上述の欠点に銑み案出されたもので、その目的
は半導体素子収納用パフケージや多層配線基板の絶縁基
体として十分な濃度に着色させるとともに電気的諸特性
を劣化させることなく、熱伝導率の向上を実現した高強
度の着色アルミナ質焼結体を提供することにある。The present invention has been devised to address the above-mentioned drawbacks, and its purpose is to color the powder to a sufficient density for use as an insulating substrate for puff cages for housing semiconductor devices and multilayer wiring boards, and to heat it without deteriorating its electrical characteristics. The object of the present invention is to provide a colored alumina sintered body with high strength and improved conductivity.
本発明はアル貫す、着色剤及び焼結助剤とから成る着色
アルミナ質焼結体において、前記アルミナと着色剤の容
量がm1図の下記ムBODの各点で囲まれた範囲内にあ
り、前記着色剤は酸化クロムと金属モリブデン及び/又
はタングステンとから成り、酸化クロム量に対する金属
モリブデン及び/又はタングステン量の瑯が1.5を越
え5.0以下であり、熱伝導率が20W/mK以上であ
ることを特徴とするものであり、ムBODの各点は、ム
:アルミナ95.0製部%、着色剤o、 s 重量%B
:フルiす92.0ifi%、着色剤0.5?1ttX
C:アルミナ87.8重量%、着色剤4.7重jlにD
:アルミナ91.811量に、着色剤4.7重11にで
ある。The present invention provides a colored alumina sintered body consisting of a coloring agent and a sintering aid, in which the capacity of the alumina and the coloring agent is within the range surrounded by each point of the following MBOD in the m1 diagram. , the coloring agent is made of chromium oxide and metal molybdenum and/or tungsten, the ratio of the amount of metal molybdenum and/or tungsten to the amount of chromium oxide is more than 1.5 and less than 5.0, and the thermal conductivity is 20 W/ mK or more, and each point of Mu BOD is: Mu: alumina 95.0% by weight, colorant o, s weight% B
: Full isu 92.0ifi%, colorant 0.5?1ttX
C: 87.8% by weight of alumina, 4.7wtl of colorant and D
: The amount of alumina is 91.811 parts, and the colorant is 4.7 parts by weight and 11 parts.
すなわち、本発明はアルミナと着色剤の容量を特定量に
設定し、且。つ、着色剤中の金属モリブデン及び/また
はタングステンの量を上記酸化クロム量に対して1.5
を越え5.0以下含有させることにより、意外にも20
W/mK以上と高い熱伝導率と曲げ強さが50.0 k
#/am以上の高強度の着色アルミナ質焼結体を実現し
たものである。これはアルミナ中に固溶する酸化クロム
が少ないため、粒内でのフォノン散乱の要因がなくなり
、熱伝導率が向上すると共に、アルミナ質焼結体の粒成
長を抑制する結果、強度が増加したものと考えられる。That is, the present invention sets the volumes of alumina and colorant to specific amounts, and. First, the amount of metal molybdenum and/or tungsten in the colorant is 1.5% relative to the above amount of chromium oxide.
By containing more than 5.0 and less than 5.0, surprisingly 20
High thermal conductivity of W/mK or more and bending strength of 50.0 k
A colored alumina sintered body with high strength of #/am or more has been realized. This is because there is less chromium oxide dissolved in alumina, which eliminates the cause of phonon scattering within the grains, improving thermal conductivity and suppressing grain growth in the alumina sintered body, resulting in increased strength. considered to be a thing.
なお、本発明において前記着色剤中の酸化クロム量に対
する金属モリブデン及び/またはタングステンの量の比
が1.5以下となると熱伝導率は向上せず、同じ(5,
0を越えると電気的特性が劣化するため不適当となる。In addition, in the present invention, if the ratio of the amount of metal molybdenum and/or tungsten to the amount of chromium oxide in the colorant is 1.5 or less, the thermal conductivity will not improve and the same (5,
If it exceeds 0, the electrical characteristics will deteriorate, making it inappropriate.
また、本発明において着色アルミナ質焼結体中のアル定
すff1Xと酸化クロムと金属モリブデン及び/または
タングステンとから成る着色剤のfiYが第1図に示す
ムB線外、すなわち着色剤Yが0.5重量%未満となる
と、アル亙す質焼結体は灰色を呈し、前記自動ワイヤー
ボンダ等の正確な位置合わせが期し難くなる。In addition, in the present invention, the colorant Y in the colored alumina sintered body is outside the line B shown in FIG. If the amount is less than 0.5% by weight, the aluminum-based sintered body will appear gray, making it difficult to achieve accurate positioning using the automatic wire bonder or the like.
また同様に、第1図に示すCD線外、すなわち着色剤量
Yが4.7重量%を越えると電気的特性、とりわけ誘電
率が11以上と高くなり、半導体素子収納用パッケージ
や多層配線基板等の絶縁基体として使用するのが不適と
なる。Similarly, outside the CD line shown in FIG. 1, that is, when the coloring agent amount Y exceeds 4.7% by weight, the electrical properties, especially the dielectric constant, become high to 11 or more, and are used in semiconductor element storage packages and multilayer wiring boards. This makes it unsuitable for use as an insulating substrate.
一方、第1図に示すBe線外、すなわちアルミナff1
Xと着色剤ff1Yが、それぞれBO線未満の範囲では
熱伝導率及び強度が低くなり、本発明の目的を達成し得
ない。On the other hand, outside the Be line shown in Fig. 1, that is, alumina ff1
If X and colorant ff1Y are each in a range below the BO line, the thermal conductivity and strength will be low, making it impossible to achieve the object of the present invention.
同様にしてアルミナ量Xと着色剤fiYがそれぞれ第1
図に示すAD線を越える範囲では、前記タングステン、
モリブデン、マンガン等の金属から成る電気配線用のメ
タライズ金属層を均一に被着形成することが困難となり
実用的でない。Similarly, the amount of alumina X and the colorant fiY are
In the range beyond the AD line shown in the figure, the tungsten,
It is difficult to uniformly deposit a metallized metal layer for electrical wiring made of a metal such as molybdenum or manganese, which is impractical.
なお、本発明において前述のアルミナ量Xと着色剤mY
は、第1表の下記BOEFの各点で囲まれた範囲内、好
ましくは下記BGHFの各点で囲まれた範囲内である。In addition, in the present invention, the above-mentioned alumina amount X and colorant mY
is within the range surrounded by the points of BOEF below in Table 1, preferably within the range surrounded by the points of BGHF below.
x(1!量に)Y(重量%)
B 92.0 0.5
0 87.8 47E
90.8 4.7F
94.5 0.5G
89.5 8.0H92,88,0
〔実施例〕
次に本発明を実施例に基づき説明する。x (1! to amount) Y (weight%) B 92.0 0.5 0 87.8 47E
90.8 4.7F
94.5 0.5G
89.5 8.0H92,88,0 [Example] Next, the present invention will be explained based on an example.
まず、純度99.8に、平均粒径1.8μmのアルミナ
(AI!gOa)粉末と810!、Oak、MgO等を
主成分とする焼結助剤と酸化クロム(Or20g)及び
焼結後、金属モリブデン(MO)またはタングステン(
W)の少なくとも1種となるモリブデンまたはタングス
テンの酸化物あるいは塩類から成る着色剤を焼結後の含
有量が第1表に示した重量となる様に秤量し、有機溶媒
およびアルミナボールとともに回転【ルにて混合粉砕し
、次いで該混合粉砕物にブチラール樹脂等のバインダー
を加えて混合し、原料スラリーを調製した。First, alumina (AI! gOa) powder with a purity of 99.8 and an average particle size of 1.8 μm and 810! , Oak, MgO, etc. as main components and chromium oxide (Or20g) and after sintering, metal molybdenum (MO) or tungsten (
A coloring agent consisting of at least one molybdenum or tungsten oxide or salt W) was weighed so that the content after sintering would be as shown in Table 1, and the coloring agent was rotated together with an organic solvent and an alumina ball. The mixture was mixed and pulverized in a mill, and then a binder such as butyral resin was added and mixed to the mixed pulverized product to prepare a raw material slurry.
かくして得られたスラリーをドクターブレード法により
シート状に成形し、該成形体を複数枚加熱密着した後、
加湿した水素−窒素混合ガス雰囲気中で1500〜16
00’Cの範囲内の焼成温度で2時間焼成し、着色アル
ミナ質焼結体を得た。The slurry thus obtained was formed into a sheet shape by the doctor blade method, and a plurality of the formed bodies were heated and bonded together, and then
1500-16 in a humidified hydrogen-nitrogen mixed gas atmosphere
It was fired for 2 hours at a firing temperature within the range of 00'C to obtain a colored alumina sintered body.
その後、上記着色アルミナ質焼結体を直径1゜!関・厚
さ2 aysの円板状に研摩加工し、レーザーフラッシ
ュ法により熱伝導率を、同様にして研摩加工した長さ4
0IIM、8mX4gsg角の角柱を使用して、JI8
R1601の規定に基づき8点曲げ強さをそれぞれ
測定した。After that, the colored alumina sintered body was made into a diameter of 1°! It was polished into a disc shape with a thickness of 2 ays, and its thermal conductivity was adjusted using the laser flash method.
0IIM, using a 8m x 4gsg square prism, JI8
The 8-point bending strength was measured based on the regulations of R1601.
また同様にして、縦・横各50B、厚さ2 amの板状
に研摩加工し、JI8 C2141の規定に基づき体
積固有抵抗(100℃、相対湿度50X)及び誘電率(
室温、IMHz)を測定し、誘電損失を導出した。Similarly, it was polished into a plate shape with a length and width of 50B and a thickness of 2 am, and the volume resistivity (100°C, relative humidity 50X) and dielectric constant (
The dielectric loss was derived by measuring the dielectric loss (room temperature, IMHz).
更に、上記着色アルミナ質焼結体表面にタングステンの
メタライズ金属層を被着形成すると共に、該メタライズ
金属層表面にニッケルめっきを行ない、これに低熱膨張
の金属片を低職点ロウ材でロウ付けし、8 kl//y
zm2の引張り応力でもうて該金属片を引張り、剥離の
有無を確認し、メタライズの強度評価を行なった。Further, a metallized tungsten metal layer is deposited on the surface of the colored alumina sintered body, and the surface of the metallized metal layer is plated with nickel, and a low thermal expansion metal piece is brazed to this with a low-temperature brazing material. 8 kl//y
The metal piece was pulled with a tensile stress of zm2 to confirm the presence or absence of peeling, and the strength of the metallization was evaluated.
なお、焼結体中のアルミナ及び各着色剤の量はICP発
光分光分析法によりそれぞれ測定した。The amounts of alumina and each coloring agent in the sintered body were measured by ICP emission spectrometry.
その結果を第1表に示す。The results are shown in Table 1.
また試料番号69.70.71は従来例を示す。Moreover, sample number 69.70.71 shows a conventional example.
/
/
第1表より明らかな様に、従来例の試料番号69,70
.71はいずれも熱伝導率が17W/mKと低く、曲げ
強度も80 kIIAll” J:、 低く、曲げ強度
も80 klI/B2と低い。また、試料番号l。/ / As is clear from Table 1, conventional sample numbers 69 and 70
.. Sample No. 71 has a low thermal conductivity of 17 W/mK, a low bending strength of 80 kIIAll" J:, and a low bending strength of 80 klI/B2.
2.4.10,51.62は第1図に示すAB 4m外
または着色剤中の酸化クロム量に対する金属モリブデン
及び/またはタングステンの量の比が1.5以下の場合
であり、いずれも色調が灰色となり実用的でない。また
、試料番号14.82は第1図に示すBe綿線外試料番
号5oは第1図に示すCD線外、試料番号8,21.8
6は第1図に示すムD線外の場合であり、それぞれ熱伝
導率、誘電率1.誘電損失、メタライズ強度が満足すべ
きものでない。門だ試料番号4,10,25,29゜3
7.45,62及び7,1B、27,81゜41.49
,55.68は酸化クロム量に対する金属モリブデン及
び/またはタングステンの量の比が1.5以下または5
゜0を越える場合で、それぞれ熱伝導率が19 W/m
[以下または3屯率、誘電損失等の電気的特性を満足す
るものではない。2.4.10 and 51.62 are cases outside of AB 4m shown in Figure 1 or when the ratio of the amount of metal molybdenum and/or tungsten to the amount of chromium oxide in the colorant is 1.5 or less, and in both cases the color tone is becomes gray and is not practical. In addition, sample number 14.82 is outside the Be cotton line shown in Figure 1, sample number 5o is outside the CD line shown in Figure 1, and sample numbers 8, 21.8
6 is the case outside the MuD line shown in FIG. 1, and the thermal conductivity and dielectric constant are 1.6 and 1.6, respectively. Dielectric loss and metallization strength are not satisfactory. Monda sample number 4, 10, 25, 29゜3
7.45,62 and 7,1B, 27,81°41.49
, 55.68, the ratio of the amount of metal molybdenum and/or tungsten to the amount of chromium oxide is 1.5 or less or 5
In cases where the thermal conductivity exceeds ゜0, respectively, the thermal conductivity is 19 W/m
[It does not satisfy electrical characteristics such as 3 tonne ratio or dielectric loss.]
これに対し、本発明の着色アルミナ質焼結体は熱伝導率
が20W/mK以上で、かつ曲げ強さも50 k、9/
sn2以上と極めて高く、色調及び電気的緒特性とも半
導体素子収納用パッケージや半導体集積回路素子が搭載
される多層配線基板等の絶縁基体として満足すべきもの
であった。In contrast, the colored alumina sintered body of the present invention has a thermal conductivity of 20 W/mK or more and a bending strength of 50 k, 9/mK or more.
It had an extremely high sn2 or higher, and both color tone and electrical properties were satisfactory as an insulating substrate for semiconductor element storage packages, multilayer wiring boards on which semiconductor integrated circuit elements are mounted, and the like.
本発明によれば、電気的緒特性を劣化させることなく意
外な程、高い熱伝導率を有しかつ高強度の十分かつ均質
な色調を有する着色アルミナ質焼結体を得ることができ
るため、放熱が良好な半導体素子収納用パッケージ?多
届配線基板を1υることができる。According to the present invention, it is possible to obtain a colored alumina sintered body having surprisingly high thermal conductivity, high strength, and sufficient and homogeneous color tone without deteriorating electrical characteristics. A package for storing semiconductor elements with good heat dissipation? It is possible to reduce the number of multi-delivery wiring boards by 1υ.
第1図は本発明の着色アルミナ質焼結体中のアルミナ量
Xと着色剤量Yの含有範囲を示した図である。
特許出願人 京セラ株式会社FIG. 1 is a diagram showing the content ranges of the amount of alumina X and the amount of colorant Y in the colored alumina sintered body of the present invention. Patent applicant Kyocera Corporation
Claims (1)
ナ質焼結体において、前記アルミナと着色剤の各量が第
1図の下記ABCDの各点で囲まれた範囲内にあり、前
記着色剤は酸化クロムと金属モリブデン及び/又はタン
グステンとから成り、酸化クロム量に対する金属モリブ
デン及び/又はタングステン量の比が1.5を越え5.
0以下であり、熱伝導率が20w/mK以上であること
を特徴とする着色アルミナ質焼結体。 A:アルミナ96.0重量%、着色剤0.5重量% B:アルミナ92.0重量%、着色剤0.5重量% C:アルミナ87.8重量%、着色剤4.7重量% D:アルミナ91.8重量%、着色剤4.7重量%[Claims] In a colored alumina sintered body consisting of alumina, a colorant, and a sintering aid, each amount of the alumina and colorant is within the range surrounded by each point ABCD below in FIG. 5. The coloring agent is composed of chromium oxide and molybdenum metal and/or tungsten, and the ratio of the amount of molybdenum metal and/or tungsten to the amount of chromium oxide exceeds 1.5.
0 or less and a thermal conductivity of 20 w/mK or more. A: 96.0% by weight of alumina, 0.5% by weight of colorant B: 92.0% by weight of alumina, 0.5% by weight of colorant C: 87.8% by weight of alumina, 4.7% by weight of colorant D: Alumina 91.8% by weight, colorant 4.7% by weight
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62276728A JPH0745335B2 (en) | 1987-10-30 | 1987-10-30 | Colored alumina sintered body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62276728A JPH0745335B2 (en) | 1987-10-30 | 1987-10-30 | Colored alumina sintered body |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4168076A Division JP2580439B2 (en) | 1992-06-26 | 1992-06-26 | High dielectric constant alumina sintered body and method for producing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01119557A true JPH01119557A (en) | 1989-05-11 |
JPH0745335B2 JPH0745335B2 (en) | 1995-05-17 |
Family
ID=17573511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62276728A Expired - Fee Related JPH0745335B2 (en) | 1987-10-30 | 1987-10-30 | Colored alumina sintered body |
Country Status (1)
Country | Link |
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JP (1) | JPH0745335B2 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03226987A (en) * | 1990-01-31 | 1991-10-07 | Kyocera Corp | Ceramic heater |
JPH05178656A (en) * | 1992-06-26 | 1993-07-20 | Kyocera Corp | Alumina sintered body |
US6265816B1 (en) * | 1998-04-30 | 2001-07-24 | Ngk Spark Plug Co., Ltd. | Spark plug, insulator for spark plug and process for fabricating the insulator |
JP2002198630A (en) * | 2000-12-26 | 2002-07-12 | Kyocera Corp | Electronic component mounting board |
WO2021068128A1 (en) * | 2019-10-09 | 2021-04-15 | Dic Corporation | Plate-like alumina particle and method for manufacturing plate-like alumina particle |
CN114514290A (en) * | 2019-10-09 | 2022-05-17 | Dic株式会社 | Flaky alumina particles and method for producing flaky alumina particles |
JP2022550984A (en) * | 2019-10-09 | 2022-12-06 | Dic株式会社 | Composite particles and method for producing the composite particles |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63182252A (en) * | 1987-01-20 | 1988-07-27 | 三菱電機株式会社 | Manufacture of black ceramics |
-
1987
- 1987-10-30 JP JP62276728A patent/JPH0745335B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63182252A (en) * | 1987-01-20 | 1988-07-27 | 三菱電機株式会社 | Manufacture of black ceramics |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03226987A (en) * | 1990-01-31 | 1991-10-07 | Kyocera Corp | Ceramic heater |
JPH05178656A (en) * | 1992-06-26 | 1993-07-20 | Kyocera Corp | Alumina sintered body |
JP2580439B2 (en) * | 1992-06-26 | 1997-02-12 | 京セラ株式会社 | High dielectric constant alumina sintered body and method for producing the same |
US6265816B1 (en) * | 1998-04-30 | 2001-07-24 | Ngk Spark Plug Co., Ltd. | Spark plug, insulator for spark plug and process for fabricating the insulator |
JP2002198630A (en) * | 2000-12-26 | 2002-07-12 | Kyocera Corp | Electronic component mounting board |
JP4540223B2 (en) * | 2000-12-26 | 2010-09-08 | 京セラ株式会社 | Electronic component mounting board |
WO2021068128A1 (en) * | 2019-10-09 | 2021-04-15 | Dic Corporation | Plate-like alumina particle and method for manufacturing plate-like alumina particle |
CN114502666A (en) * | 2019-10-09 | 2022-05-13 | Dic株式会社 | Sheet-like alumina particles and method for producing sheet-like alumina particles |
CN114514290A (en) * | 2019-10-09 | 2022-05-17 | Dic株式会社 | Flaky alumina particles and method for producing flaky alumina particles |
JP2022550984A (en) * | 2019-10-09 | 2022-12-06 | Dic株式会社 | Composite particles and method for producing the composite particles |
JP2022551131A (en) * | 2019-10-09 | 2022-12-07 | Dic株式会社 | Plate-like alumina particles and method for producing plate-like alumina particles |
CN114514290B (en) * | 2019-10-09 | 2023-09-29 | Dic株式会社 | Flaky alumina particles and methods of manufacturing flaky alumina particles |
CN114502666B (en) * | 2019-10-09 | 2024-02-13 | Dic株式会社 | Flaky alumina particles and methods of manufacturing flaky alumina particles |
Also Published As
Publication number | Publication date |
---|---|
JPH0745335B2 (en) | 1995-05-17 |
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