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JPH01117859U - - Google Patents

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Publication number
JPH01117859U
JPH01117859U JP1045088U JP1045088U JPH01117859U JP H01117859 U JPH01117859 U JP H01117859U JP 1045088 U JP1045088 U JP 1045088U JP 1045088 U JP1045088 U JP 1045088U JP H01117859 U JPH01117859 U JP H01117859U
Authority
JP
Japan
Prior art keywords
diamond abrasive
cutter
rotational direction
electrodeposited
cutting edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1045088U
Other languages
Japanese (ja)
Other versions
JPH075981Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988010450U priority Critical patent/JPH075981Y2/en
Publication of JPH01117859U publication Critical patent/JPH01117859U/ja
Application granted granted Critical
Publication of JPH075981Y2 publication Critical patent/JPH075981Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Polishing Bodies And Polishing Tools (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1A図乃至第1F図は本考案によるダイヤモ
ンド砥粒電着カツターの第1実施例を示すもので
あり、第1A図は要部正面図、第1B図は第1A
図の超硬チツプが付いてない切刃の拡大前面図、
第1C図はダイヤモンド砥粒を一部省略した電着
カツターの部分拡大図、第1D図は第1C図の外
周展開図、第1E図は超硬チツプが付いている切
刃の拡大説明図、第1F図は第1E図の切刃後面
図であり、第2A図乃至第2C図は第2実施例を
示すものであり、第2A図は要部正面図、第2B
図は第2A図の切刃の拡大前面図、第2C図は第
2A図の部分外周展開図であり、第3A図乃至第
4図は従来例を示し、第3A図及び第3B図は要
部正面図及び拡大断面図、第4図は切刃形成部の
要部斜視図である。 1,21……円形基板、2……切刃形成部、2
a,22a……回転方向前面、2b,22b……
外周面、2c,22c……回転方向後面、22d
……切削面、3,23……切刃、4……超硬チツ
プ、5……間隙、6……ダイヤモンド砥粒、…
…回転方向。
1A to 1F show a first embodiment of the diamond abrasive electrodeposited cutter according to the present invention, FIG. 1A is a front view of the main part, and FIG.
Enlarged front view of the cutting edge without the carbide tip shown in the figure.
Fig. 1C is a partially enlarged view of the electrodeposited cutter with some diamond abrasive grains omitted, Fig. 1D is a developed view of the outer circumference of Fig. 1C, and Fig. 1E is an enlarged explanatory view of the cutting blade with a carbide tip. Fig. 1F is a rear view of the cutting blade in Fig. 1E, Figs. 2A to 2C show the second embodiment, Fig. 2A is a front view of the main part, and Fig. 2B
The figure is an enlarged front view of the cutting blade in Fig. 2A, Fig. 2C is a partially expanded view of the outer periphery of Fig. 2A, Figs. 3A to 4 show the conventional example, and Figs. 3A and 3B are essential parts. A front view and an enlarged sectional view, and FIG. 4 is a perspective view of the main part of the cutting blade forming part. 1, 21... Circular substrate, 2... Cutting edge forming part, 2
a, 22a...Rotational direction front, 2b, 22b...
Outer peripheral surface, 2c, 22c...Rear surface in rotational direction, 22d
... Cutting surface, 3, 23 ... Cutting edge, 4 ... Carbide chip, 5 ... Gap, 6 ... Diamond abrasive grain, ...
…Direction of rotation.

Claims (1)

【実用新案登録請求の範囲】 1 切刃形成部の回転方向前面と外周面が鈍角を
なすように前面を傾斜させた切刃形成部を円形基
板の外周に間隙を置いて複数設け、該切刃形成部
の表面にダイヤモンド砥粒を電気メツキ法により
結着させて切刃を形成したダイヤモンド砥粒電着
カツターにおいて、前記切刃形成部の回転方向後
面に少なくとも一つの超硬チツプを取着したこと
を特徴とするダイヤモンド砥粒電着カツター。 2 前記超硬チツプは高さ及び幅をダイヤモンド
砥粒が電着された切刃より小さくした請求項1記
載のダイヤモンド砥粒電着カツター。 3 前記超硬チツプは前記切刃の少なくとも2個
以上に対し1個の割合で取着されている請求項1
記載のダイヤモンド砥粒電着カツター。 4 前記切刃形成部は、回転方向前面と外周面と
の接続部近傍の肉厚を薄く形成した請求項1,2
又は3記載のダイヤモンド砥粒電着カツター。 5 前記回転方向前面と外周面との接続部近傍の
肉厚を、切刃形成部の両面から交互に削り取るこ
とによつて薄くした請求項1,2,3又は4記載
のダイヤモンド砥粒電着カツター。 6 前記回転方向前面と外周面との接続部近傍の
肉厚を薄くする場合において、少なくとも前記複
数の切刃形成部の同一面側から連続して削り取つ
て薄くした部分を備えた請求項4又は5記載のダ
イヤモンド砥粒電着カツター。
[Claims for Utility Model Registration] 1. A plurality of cutting blade forming parts each having a front surface inclined so that the front surface in the rotational direction of the cutting blade forming part and the outer peripheral surface form an obtuse angle are provided at intervals on the outer periphery of a circular substrate, In a diamond abrasive electrodeposited cutter in which a cutting edge is formed by bonding diamond abrasive grains to the surface of a blade forming part by an electroplating method, at least one carbide chip is attached to the rear surface in the rotational direction of the cutting blade forming part. Diamond abrasive electrodeposited cutter. 2. The diamond abrasive electrodeposited cutter according to claim 1, wherein the carbide tip has a height and width smaller than the cutting edge on which the diamond abrasive grains are electrodeposited. 3. Claim 1, wherein the carbide tip is attached at a ratio of one to at least two of the cutting edges.
Diamond abrasive electrodeposited cutter as described. 4. Claims 1 and 2, wherein the cutting edge forming portion has a thinner wall thickness near the connection portion between the front surface in the rotational direction and the outer circumferential surface.
Or the diamond abrasive electrodeposition cutter described in 3. 5. The electrodeposition of diamond abrasive grains according to claim 1, 2, 3 or 4, wherein the wall thickness in the vicinity of the connection between the front surface in the rotational direction and the outer circumferential surface is thinned by alternately scraping off both sides of the cutting edge forming part. Cutter. 6. In the case of reducing the wall thickness near the connecting portion between the front surface in the rotational direction and the outer circumferential surface, a thinned portion is provided by continuously scraping at least from the same surface side of the plurality of cutting edge forming portions. Or the diamond abrasive electrodeposition cutter described in 5.
JP1988010450U 1988-01-30 1988-01-30 Diamond abrasive grain electrodeposition cutter Expired - Lifetime JPH075981Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988010450U JPH075981Y2 (en) 1988-01-30 1988-01-30 Diamond abrasive grain electrodeposition cutter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988010450U JPH075981Y2 (en) 1988-01-30 1988-01-30 Diamond abrasive grain electrodeposition cutter

Publications (2)

Publication Number Publication Date
JPH01117859U true JPH01117859U (en) 1989-08-09
JPH075981Y2 JPH075981Y2 (en) 1995-02-15

Family

ID=31218123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988010450U Expired - Lifetime JPH075981Y2 (en) 1988-01-30 1988-01-30 Diamond abrasive grain electrodeposition cutter

Country Status (1)

Country Link
JP (1) JPH075981Y2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04301100A (en) * 1991-03-29 1992-10-23 Fuji Photo Film Co Ltd Electrolytic treatment
JPH05112950A (en) * 1991-04-04 1993-05-07 Akishige Nishino Foundation structure of building and construction method thereof
JPH05198828A (en) * 1992-01-20 1993-08-06 Sumitomo Electric Ind Ltd Optical receiver for optical communication use
WO1996023630A1 (en) * 1995-02-01 1996-08-08 Hiroshi Ishizuka Superabrasive electroplated cutting edge and method of manufacturing the same
JPH10128673A (en) * 1996-10-30 1998-05-19 Motoyuki:Kk Blade saw
JP2017196695A (en) * 2016-04-27 2017-11-02 株式会社アマダホールディングス Abrasive-grain saw blade

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59110563A (en) * 1982-12-17 1984-06-26 Asahi Daiyamondo Kogyo Kk Diamond cutting grindstone

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59110563A (en) * 1982-12-17 1984-06-26 Asahi Daiyamondo Kogyo Kk Diamond cutting grindstone

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04301100A (en) * 1991-03-29 1992-10-23 Fuji Photo Film Co Ltd Electrolytic treatment
JPH05112950A (en) * 1991-04-04 1993-05-07 Akishige Nishino Foundation structure of building and construction method thereof
JPH05198828A (en) * 1992-01-20 1993-08-06 Sumitomo Electric Ind Ltd Optical receiver for optical communication use
WO1996023630A1 (en) * 1995-02-01 1996-08-08 Hiroshi Ishizuka Superabrasive electroplated cutting edge and method of manufacturing the same
JPH10128673A (en) * 1996-10-30 1998-05-19 Motoyuki:Kk Blade saw
JP2017196695A (en) * 2016-04-27 2017-11-02 株式会社アマダホールディングス Abrasive-grain saw blade

Also Published As

Publication number Publication date
JPH075981Y2 (en) 1995-02-15

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