JPH01117859U - - Google Patents
Info
- Publication number
- JPH01117859U JPH01117859U JP1045088U JP1045088U JPH01117859U JP H01117859 U JPH01117859 U JP H01117859U JP 1045088 U JP1045088 U JP 1045088U JP 1045088 U JP1045088 U JP 1045088U JP H01117859 U JPH01117859 U JP H01117859U
- Authority
- JP
- Japan
- Prior art keywords
- diamond abrasive
- cutter
- rotational direction
- electrodeposited
- cutting edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910003460 diamond Inorganic materials 0.000 claims description 12
- 239000010432 diamond Substances 0.000 claims description 12
- 239000006061 abrasive grain Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000004070 electrodeposition Methods 0.000 claims 3
- 238000007790 scraping Methods 0.000 claims 2
- 238000009713 electroplating Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Description
第1A図乃至第1F図は本考案によるダイヤモ
ンド砥粒電着カツターの第1実施例を示すもので
あり、第1A図は要部正面図、第1B図は第1A
図の超硬チツプが付いてない切刃の拡大前面図、
第1C図はダイヤモンド砥粒を一部省略した電着
カツターの部分拡大図、第1D図は第1C図の外
周展開図、第1E図は超硬チツプが付いている切
刃の拡大説明図、第1F図は第1E図の切刃後面
図であり、第2A図乃至第2C図は第2実施例を
示すものであり、第2A図は要部正面図、第2B
図は第2A図の切刃の拡大前面図、第2C図は第
2A図の部分外周展開図であり、第3A図乃至第
4図は従来例を示し、第3A図及び第3B図は要
部正面図及び拡大断面図、第4図は切刃形成部の
要部斜視図である。
1,21……円形基板、2……切刃形成部、2
a,22a……回転方向前面、2b,22b……
外周面、2c,22c……回転方向後面、22d
……切削面、3,23……切刃、4……超硬チツ
プ、5……間隙、6……ダイヤモンド砥粒、…
…回転方向。
1A to 1F show a first embodiment of the diamond abrasive electrodeposited cutter according to the present invention, FIG. 1A is a front view of the main part, and FIG.
Enlarged front view of the cutting edge without the carbide tip shown in the figure.
Fig. 1C is a partially enlarged view of the electrodeposited cutter with some diamond abrasive grains omitted, Fig. 1D is a developed view of the outer circumference of Fig. 1C, and Fig. 1E is an enlarged explanatory view of the cutting blade with a carbide tip. Fig. 1F is a rear view of the cutting blade in Fig. 1E, Figs. 2A to 2C show the second embodiment, Fig. 2A is a front view of the main part, and Fig. 2B
The figure is an enlarged front view of the cutting blade in Fig. 2A, Fig. 2C is a partially expanded view of the outer periphery of Fig. 2A, Figs. 3A to 4 show the conventional example, and Figs. 3A and 3B are essential parts. A front view and an enlarged sectional view, and FIG. 4 is a perspective view of the main part of the cutting blade forming part. 1, 21... Circular substrate, 2... Cutting edge forming part, 2
a, 22a...Rotational direction front, 2b, 22b...
Outer peripheral surface, 2c, 22c...Rear surface in rotational direction, 22d
... Cutting surface, 3, 23 ... Cutting edge, 4 ... Carbide chip, 5 ... Gap, 6 ... Diamond abrasive grain, ...
…Direction of rotation.
Claims (1)
なすように前面を傾斜させた切刃形成部を円形基
板の外周に間隙を置いて複数設け、該切刃形成部
の表面にダイヤモンド砥粒を電気メツキ法により
結着させて切刃を形成したダイヤモンド砥粒電着
カツターにおいて、前記切刃形成部の回転方向後
面に少なくとも一つの超硬チツプを取着したこと
を特徴とするダイヤモンド砥粒電着カツター。 2 前記超硬チツプは高さ及び幅をダイヤモンド
砥粒が電着された切刃より小さくした請求項1記
載のダイヤモンド砥粒電着カツター。 3 前記超硬チツプは前記切刃の少なくとも2個
以上に対し1個の割合で取着されている請求項1
記載のダイヤモンド砥粒電着カツター。 4 前記切刃形成部は、回転方向前面と外周面と
の接続部近傍の肉厚を薄く形成した請求項1,2
又は3記載のダイヤモンド砥粒電着カツター。 5 前記回転方向前面と外周面との接続部近傍の
肉厚を、切刃形成部の両面から交互に削り取るこ
とによつて薄くした請求項1,2,3又は4記載
のダイヤモンド砥粒電着カツター。 6 前記回転方向前面と外周面との接続部近傍の
肉厚を薄くする場合において、少なくとも前記複
数の切刃形成部の同一面側から連続して削り取つ
て薄くした部分を備えた請求項4又は5記載のダ
イヤモンド砥粒電着カツター。[Claims for Utility Model Registration] 1. A plurality of cutting blade forming parts each having a front surface inclined so that the front surface in the rotational direction of the cutting blade forming part and the outer peripheral surface form an obtuse angle are provided at intervals on the outer periphery of a circular substrate, In a diamond abrasive electrodeposited cutter in which a cutting edge is formed by bonding diamond abrasive grains to the surface of a blade forming part by an electroplating method, at least one carbide chip is attached to the rear surface in the rotational direction of the cutting blade forming part. Diamond abrasive electrodeposited cutter. 2. The diamond abrasive electrodeposited cutter according to claim 1, wherein the carbide tip has a height and width smaller than the cutting edge on which the diamond abrasive grains are electrodeposited. 3. Claim 1, wherein the carbide tip is attached at a ratio of one to at least two of the cutting edges.
Diamond abrasive electrodeposited cutter as described. 4. Claims 1 and 2, wherein the cutting edge forming portion has a thinner wall thickness near the connection portion between the front surface in the rotational direction and the outer circumferential surface.
Or the diamond abrasive electrodeposition cutter described in 3. 5. The electrodeposition of diamond abrasive grains according to claim 1, 2, 3 or 4, wherein the wall thickness in the vicinity of the connection between the front surface in the rotational direction and the outer circumferential surface is thinned by alternately scraping off both sides of the cutting edge forming part. Cutter. 6. In the case of reducing the wall thickness near the connecting portion between the front surface in the rotational direction and the outer circumferential surface, a thinned portion is provided by continuously scraping at least from the same surface side of the plurality of cutting edge forming portions. Or the diamond abrasive electrodeposition cutter described in 5.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988010450U JPH075981Y2 (en) | 1988-01-30 | 1988-01-30 | Diamond abrasive grain electrodeposition cutter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988010450U JPH075981Y2 (en) | 1988-01-30 | 1988-01-30 | Diamond abrasive grain electrodeposition cutter |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01117859U true JPH01117859U (en) | 1989-08-09 |
JPH075981Y2 JPH075981Y2 (en) | 1995-02-15 |
Family
ID=31218123
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988010450U Expired - Lifetime JPH075981Y2 (en) | 1988-01-30 | 1988-01-30 | Diamond abrasive grain electrodeposition cutter |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH075981Y2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04301100A (en) * | 1991-03-29 | 1992-10-23 | Fuji Photo Film Co Ltd | Electrolytic treatment |
JPH05112950A (en) * | 1991-04-04 | 1993-05-07 | Akishige Nishino | Foundation structure of building and construction method thereof |
JPH05198828A (en) * | 1992-01-20 | 1993-08-06 | Sumitomo Electric Ind Ltd | Optical receiver for optical communication use |
WO1996023630A1 (en) * | 1995-02-01 | 1996-08-08 | Hiroshi Ishizuka | Superabrasive electroplated cutting edge and method of manufacturing the same |
JPH10128673A (en) * | 1996-10-30 | 1998-05-19 | Motoyuki:Kk | Blade saw |
JP2017196695A (en) * | 2016-04-27 | 2017-11-02 | 株式会社アマダホールディングス | Abrasive-grain saw blade |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59110563A (en) * | 1982-12-17 | 1984-06-26 | Asahi Daiyamondo Kogyo Kk | Diamond cutting grindstone |
-
1988
- 1988-01-30 JP JP1988010450U patent/JPH075981Y2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59110563A (en) * | 1982-12-17 | 1984-06-26 | Asahi Daiyamondo Kogyo Kk | Diamond cutting grindstone |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04301100A (en) * | 1991-03-29 | 1992-10-23 | Fuji Photo Film Co Ltd | Electrolytic treatment |
JPH05112950A (en) * | 1991-04-04 | 1993-05-07 | Akishige Nishino | Foundation structure of building and construction method thereof |
JPH05198828A (en) * | 1992-01-20 | 1993-08-06 | Sumitomo Electric Ind Ltd | Optical receiver for optical communication use |
WO1996023630A1 (en) * | 1995-02-01 | 1996-08-08 | Hiroshi Ishizuka | Superabrasive electroplated cutting edge and method of manufacturing the same |
JPH10128673A (en) * | 1996-10-30 | 1998-05-19 | Motoyuki:Kk | Blade saw |
JP2017196695A (en) * | 2016-04-27 | 2017-11-02 | 株式会社アマダホールディングス | Abrasive-grain saw blade |
Also Published As
Publication number | Publication date |
---|---|
JPH075981Y2 (en) | 1995-02-15 |