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JPH01112054U - - Google Patents

Info

Publication number
JPH01112054U
JPH01112054U JP594288U JP594288U JPH01112054U JP H01112054 U JPH01112054 U JP H01112054U JP 594288 U JP594288 U JP 594288U JP 594288 U JP594288 U JP 594288U JP H01112054 U JPH01112054 U JP H01112054U
Authority
JP
Japan
Prior art keywords
semiconductor device
board
dip resin
type semiconductor
mold type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP594288U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP594288U priority Critical patent/JPH01112054U/ja
Publication of JPH01112054U publication Critical patent/JPH01112054U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本案の一実施例の縦断面図、第２図は
従来技術のＡ部縦断面図である。 １……配線された絶縁基板、２……ろう材、３
……電子部品、４……外部端子、５……アンダー
コート、６……デイツプ樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. 配線された絶縁基板に電子部品が、ろう材を介
    して面実装され、前記基板の少なくとも一端部よ
    り外部端子が、取り付けられているデイツプ樹脂
    モールド型半導体装置において、前記基板端部の
    少なくとも１辺の表裏面にテーパを設けたことを
    特徴とするデイツプ樹脂モールド型半導体装置。
JP594288U 1988-01-22 1988-01-22 Pending JPH01112054U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP594288U JPH01112054U (ja) 1988-01-22 1988-01-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP594288U JPH01112054U (ja) 1988-01-22 1988-01-22

Publications (1)

Publication Number Publication Date
JPH01112054U true JPH01112054U (ja) 1989-07-27

Family

ID=31209758

Family Applications (1)

Application Number Title Priority Date Filing Date
JP594288U Pending JPH01112054U (ja) 1988-01-22 1988-01-22

Country Status (1)

Country Link
JP (1) JPH01112054U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103511560A (zh) * 2013-10-09 2014-01-15 唐海滨 一种电动客车机械自动变速箱

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103511560A (zh) * 2013-10-09 2014-01-15 唐海滨 一种电动客车机械自动变速箱

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